Active alignment, i.e. by apparatus steering

Industry

CPC
H01L2224/81121

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81121Active alignment, i.e. by apparatus steering

Industries

Patents Grantslast 30 patents

Information Patent Grant
Double resist structure for electrodeposition bonding
- Patent number 12,183,708
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Koki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,764,139
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,515,202
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 11,355,468
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing and filling containers
- Patent number 11,345,073
- Issue date May 31, 2022
- KHS GmbH
- Ludwig Clüsserath
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,289,372
- Issue date Mar 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,062,987
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,011,418
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probes with fiducial targets, probe systems including the same, and...
- Patent number 10,877,070
- Issue date Dec 29, 2020
- FormFactor Beaverton, Inc.
- Joseph George Frankel
- G01 - MEASURING TESTING
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,692,783
- Issue date Jun 23, 2020
- KULICKE AND SOFFA, INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 10,643,965
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,622,297
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of positioning semiconductor device, a...
- Patent number 10,446,501
- Issue date Oct 15, 2019
- Olympus Corporation
- Masato Mikami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip alignment utilizing superomniphobic surface treatment of silic...
- Patent number 10,396,050
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus, chip bonding method and a chip package stru...
- Patent number 10,366,965
- Issue date Jul 30, 2019
- Industrial Technology Research Institute
- Shu-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembling method, manufacturing method, device and electronic appa...
- Patent number 10,224,307
- Issue date Mar 5, 2019
- Goertek, Inc.
- Quanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 10,170,444
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump stretching method
- Patent number 10,163,835
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D IC method and device
- Patent number 10,147,641
- Issue date Dec 4, 2018
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D TSV assembly method for mass reflow
- Patent number 10,052,705
- Issue date Aug 21, 2018
- Universal Instruments Corporation
- Koenraad Alexander Gieskes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE RESIST STRUCTURE FOR ELECTRODEPOSITION BONDING
- Publication number 20230245997
- Publication date Aug 3, 2023
- International Business Machines Corporation
- KOKI NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A D...
- Publication number 20220384384
- Publication date Dec 1, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20220302069
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20210392752
- Publication date Dec 16, 2021
- ImberaTek LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20210335701
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210313225
- Publication date Oct 7, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210280461
- Publication date Sep 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20200273759
- Publication date Aug 27, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20200243435
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20190148222
- Publication date May 16, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...
- Publication number 20190131271
- Publication date May 2, 2019
- Industrial Technology Research Institute
- Shu-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRETCHING METHOD
- Publication number 20180108632
- Publication date Apr 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180090395
- Publication date Mar 29, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ALIGNMENT UTILIZING SUPEROMNIPHOBIC SURFACE TREATMENT OF SILIC...
- Publication number 20180082969
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Eric J. CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20170316971
- Publication date Nov 2, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND MANUFACTURING APP...
- Publication number 20170263585
- Publication date Sep 14, 2017
- Kabushiki Kaisha Toshiba
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-SCRUB PROCESS FOR FLUXLESS MICRO-BUMP BONDING
- Publication number 20170103963
- Publication date Apr 13, 2017
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE MOUNTING APPARATUS AND DEVICE MOUNTING METHOD
- Publication number 20170068056
- Publication date Mar 9, 2017
- FUJITSU COMPONENT LIMITED
- Rie Gappa
- G02 - OPTICS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20170005067
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING SEMICONDUCTOR CHIPS
- Publication number 20160079199
- Publication date Mar 17, 2016
- Seung-dae SEOK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Assembly and Method for Manufacturing the Same
- Publication number 20150364446
- Publication date Dec 17, 2015
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20150348951
- Publication date Dec 3, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELE...
- Publication number 20150171049
- Publication date Jun 18, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pillar Design for Conductive Bump
- Publication number 20140361432
- Publication date Dec 11, 2014
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF POSITIONING SEMICONDUCTOR DEVICE, A...
- Publication number 20140339711
- Publication date Nov 20, 2014
- OLYMPUS CORPORATION
- Masato MIKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP DEVICE AND MANUFACTURING METHOD FOR PRODUCING SAME
- Publication number 20140327101
- Publication date Nov 6, 2014
- Hiroki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Bonding Semiconductor Devices
- Publication number 20140242777
- Publication date Aug 28, 2014
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS

Active alignment, i.e. by apparatus steering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Double resist structure for electrodeposition bonding

Structure and method of forming a joint assembly

Circuit board structure and method for manufacturing a circuit boar...

Semiconductor device and method

Method and apparatus for embedding semiconductor devices

3D IC method and device

Structure and method of forming a joint assembly

Method and device for producing and filling containers

Systems and methods for bonding semiconductor elements

3D IC method and device

Circuit board structure and method for manufacturing a circuit boar...

Semiconductor device

3D IC method and device

Probes with fiducial targets, probe systems including the same, and...

Bonding package components through plating

Systems and methods for bonding semiconductor elements

Structure and method of forming a joint assembly

Semiconductor device and method

Bonding package components through plating

Semiconductor device, method of positioning semiconductor device, a...

Semiconductor chip mounted on a packaging substrate

Chip alignment utilizing superomniphobic surface treatment of silic...

Chip bonding apparatus, chip bonding method and a chip package stru...

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Assembling method, manufacturing method, device and electronic appa...

Packages for semiconductor devices, packaged semiconductor devices,...

Solder bump stretching method

3D IC method and device

3D TSV assembly method for mass reflow

Patents Applicationslast 30 patents

Structure and Method of Forming a Joint Assembly

DOUBLE RESIST STRUCTURE FOR ELECTRODEPOSITION BONDING

ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A D...

Structure and Method of Forming a Joint Assembly

Circuit board structure and method for manufacturing a circuit boar...

SEMICONDUCTOR DEVICE AND METHOD

3D IC METHOD AND DEVICE

3D IC METHOD AND DEVICE

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

Semiconductor Device and Method

Bonding Package Components Through Plating

3D IC METHOD AND DEVICE

CHIP BONDING APPARATUS, CHIP BONDING METHOD AND A CHIP PACKAGE STRU...

SOLDER BUMP STRETCHING METHOD

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

CHIP ALIGNMENT UTILIZING SUPEROMNIPHOBIC SURFACE TREATMENT OF SILIC...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

3D IC METHOD AND DEVICE

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND MANUFACTURING APP...

MICRO-SCRUB PROCESS FOR FLUXLESS MICRO-BUMP BONDING

DEVICE MOUNTING APPARATUS AND DEVICE MOUNTING METHOD

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

APPARATUS FOR BONDING SEMICONDUCTOR CHIPS

Semiconductor Chip Assembly and Method for Manufacturing the Same

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELE...

Pillar Design for Conductive Bump

SEMICONDUCTOR DEVICE, METHOD OF POSITIONING SEMICONDUCTOR DEVICE, A...

IMAGE PICKUP DEVICE AND MANUFACTURING METHOD FOR PRODUCING SAME

Method for Bonding Semiconductor Devices