Active alignment, i.e. by apparatus steering

Industry

CPC
H01L2224/80121

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80121Active alignment, i.e. by apparatus steering

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and device for manufacturing stacked substrate
- Patent number 12,107,068
- Issue date Oct 1, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,705,426
- Issue date Jul 18, 2023
- Semes Co., Ltd.
- Gil Yong Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with through substrate via (TSV)
- Patent number 11,658,172
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device including first pads on a first chip t...
- Patent number 11,482,514
- Issue date Oct 25, 2022
- Kioxia Corporation
- Hiromitsu Harashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing an LED-based emissive display device
- Patent number 11,404,401
- Issue date Aug 2, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Ivan-Christophe Robin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for arranging two substrates
- Patent number 11,121,091
- Issue date Sep 14, 2021
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 11,088,268
- Issue date Aug 10, 2021
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and imaging device
- Patent number 11,069,735
- Issue date Jul 20, 2021
- Sony Corporation
- Kengo Kotoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connectivity detection for wafer-to-wafer alignment and bonding
- Patent number 11,031,308
- Issue date Jun 8, 2021
- SanDisk Technologies LLC
- Seungpil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-induced selective heating for microLED placement and bonding
- Patent number 10,998,286
- Issue date May 4, 2021
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Location displacement detection method, location displacement detec...
- Patent number 10,991,666
- Issue date Apr 27, 2021
- SHARP KABUSHIKI KAISHA
- Yuta Ikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and imaging device
- Patent number 10,720,462
- Issue date Jul 21, 2020
- Sony Corporation
- Kengo Kotoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clip for semiconductor package
- Patent number 10,707,147
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Ariel Sotomayor Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 10,374,072
- Issue date Aug 6, 2019
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and imaging device
- Patent number 10,355,039
- Issue date Jul 16, 2019
- Sony Corporation
- Kengo Kotoo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clip for semiconductor package
- Patent number 10,204,844
- Issue date Feb 12, 2019
- Semiconductor Components Industries, LLC
- Ariel Sotomayor Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pad structure for hybrid bonding and methods of forming...
- Patent number 10,177,106
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding mechanisms for semiconductor wafers
- Patent number 9,960,129
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pad structure for hybrid bonding and methods of forming...
- Patent number 9,842,816
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for verification of bonding alignment
- Patent number 9,842,785
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 9,768,086
- Issue date Sep 19, 2017
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 9,761,444
- Issue date Sep 12, 2017
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for aligning micro-electronic components
- Patent number 9,601,459
- Issue date Mar 21, 2017
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,553,014
- Issue date Jan 24, 2017
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220045030
- Publication date Feb 10, 2022
- SEMES CO., LTD.
- Gil Yong MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20210343862
- Publication date Nov 4, 2021
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20210082896
- Publication date Mar 18, 2021
- KIOXIA Corporation
- Hiromitsu HARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTIVITY DETECTION FOR WAFER-TO-WAFER ALIGNMENT AND BONDING
- Publication number 20200381316
- Publication date Dec 3, 2020
- SANDISK TECHNOLOGIES LLC
- Seungpil Lee
- G01 - MEASURING TESTING
Information Patent Application
PROCESS FOR MANUFACTURING AN LED-BASED EMISSIVE DISPLAY DEVICE
- Publication number 20200303359
- Publication date Sep 24, 2020
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Ivan-Christophe Robin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR MANUFACTURING STACKED SUBSTRATE
- Publication number 20200286851
- Publication date Sep 10, 2020
- Nikon Corporation
- Hajime MITSUISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)
- Publication number 20200027868
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20200006540
- Publication date Jan 2, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND IMAGING DEVICE
- Publication number 20190296073
- Publication date Sep 26, 2019
- SONY CORPORATION
- Kengo KOTOO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLIP FOR SEMICONDUCTOR PACKAGE
- Publication number 20190148263
- Publication date May 16, 2019
- Semiconductor Components Industries, LLC
- Ariel Sotomayor TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Pad Structure for Hybrid Bonding and Methods of Forming...
- Publication number 20180068965
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20170309733
- Publication date Oct 26, 2017
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus And Method For Verification Of Bonding Alignment
- Publication number 20170047260
- Publication date Feb 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...
- Publication number 20150255444
- Publication date Sep 10, 2015
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding and Apparatus for Performing the Same
- Publication number 20140256087
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Devices for Fabricating and Assembling Printable Semico...
- Publication number 20140191236
- Publication date Jul 10, 2014
- The Board of Trustees of the University of IIIinois
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING MECHANISMS FOR SEMICONDUCTOR WAFERS
- Publication number 20140117546
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20140011324
- Publication date Jan 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
- Publication number 20130320503
- Publication date Dec 5, 2013
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. NUZZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR LOW TEMPERATURE WAFER BONDING AND BONDED STRUCTURE
- Publication number 20130307165
- Publication date Nov 21, 2013
- Lexvu Opto Microelectronics Technology (Shanghai) Ltd
- Zhiwei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS
- Publication number 20130256907
- Publication date Oct 3, 2013
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level...
- Publication number 20130252375
- Publication date Sep 26, 2013
- Ge Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DIRECTLY BONDING TOGETHER SEMICONDUCTOR STRUCTURES, AND...
- Publication number 20120153484
- Publication date Jun 21, 2012
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY SEMICONDUCTOR STRUCTURE BONDING METHODS AND RELATED BONDE...
- Publication number 20120013013
- Publication date Jan 19, 2012
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Devices for Fabricating and Assembling Printable Semico...
- Publication number 20110220890
- Publication date Sep 15, 2011
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and Devices for Fabricating and Assembling Printable Semico...
- Publication number 20100072577
- Publication date Mar 25, 2010
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Active alignment, i.e. by apparatus steering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and device for manufacturing stacked substrate

Methods and devices for fabricating and assembling printable semico...

Bonding apparatus and bonding method

Hybrid bonding with through substrate via (TSV)

Semiconductor storage device including first pads on a first chip t...

Process for manufacturing an LED-based emissive display device

Method for arranging two substrates

Methods and devices for fabricating and assembling printable semico...

Semiconductor device and imaging device

Connectivity detection for wafer-to-wafer alignment and bonding

Laser-induced selective heating for microLED placement and bonding

Location displacement detection method, location displacement detec...

Semiconductor device and imaging device

Clip for semiconductor package

Method of manufacturing a semiconductor device

Methods and devices for fabricating and assembling printable semico...

Hybrid bonding systems and methods for semiconductor wafers

Semiconductor device and imaging device

Clip for semiconductor package

Conductive pad structure for hybrid bonding and methods of forming...

Hybrid bonding systems and methods for semiconductor wafers

Semiconductor device, method of manufacturing a semiconductor devic...

Hybrid bonding mechanisms for semiconductor wafers

Conductive pad structure for hybrid bonding and methods of forming...

Apparatus and method for verification of bonding alignment

Methods and devices for fabricating and assembling printable semico...

Methods and devices for fabricating and assembling printable semico...

Hybrid bonding systems and methods for semiconductor wafers

Method for aligning micro-electronic components

Bonded processed semiconductor structures and carriers

Patents Applicationslast 30 patents

BONDING APPARATUS AND BONDING METHOD

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

SEMICONDUCTOR STORAGE DEVICE

CONNECTIVITY DETECTION FOR WAFER-TO-WAFER ALIGNMENT AND BONDING

PROCESS FOR MANUFACTURING AN LED-BASED EMISSIVE DISPLAY DEVICE

METHOD AND DEVICE FOR MANUFACTURING STACKED SUBSTRATE

HYBRID BONDING WITH THROUGH SUBSTRATE VIA (TSV)

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

SEMICONDUCTOR DEVICE AND IMAGING DEVICE

CLIP FOR SEMICONDUCTOR PACKAGE

Hybrid Bonding Systems and Methods for Semiconductor Wafers

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Conductive Pad Structure for Hybrid Bonding and Methods of Forming...

Hybrid Bonding Systems and Methods for Semiconductor Wafers

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

Apparatus And Method For Verification Of Bonding Alignment

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...

Hybrid Bonding and Apparatus for Performing the Same

Methods and Devices for Fabricating and Assembling Printable Semico...

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

HYBRID BONDING MECHANISMS FOR SEMICONDUCTOR WAFERS

Hybrid Bonding Systems and Methods for Semiconductor Wafers

METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...

METHOD FOR LOW TEMPERATURE WAFER BONDING AND BONDED STRUCTURE

BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS

Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level...

METHODS FOR DIRECTLY BONDING TOGETHER SEMICONDUCTOR STRUCTURES, AND...

TEMPORARY SEMICONDUCTOR STRUCTURE BONDING METHODS AND RELATED BONDE...

Methods and Devices for Fabricating and Assembling Printable Semico...

Methods and Devices for Fabricating and Assembling Printable Semico...