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B81C3/004

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C3/00Assembling of devices or systems from individually processed components

Current Industry

B81C3/004Active alignment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Micro-electromechanical (MEM) power relay
- Patent number 11,584,643
- Issue date Feb 21, 2023
- Massachusetts Institute of Technology
- Prashant Patil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing MEMS transducer, MEMS transducer, ultrasound p...
- Patent number 11,369,345
- Issue date Jun 28, 2022
- Konica Minolta, Inc.
- Yuta Nakayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and methods for microfabrication
- Patent number 11,305,987
- Issue date Apr 19, 2022
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Sae Won Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of controlling placement of micro-objects
- Patent number 11,148,941
- Issue date Oct 19, 2021
- Palo Alto Research Center Incorporated
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for manufacturing of micro-channel and method for manufac...
- Patent number 10,987,854
- Issue date Apr 27, 2021
- Korea Institute of Machinery & Materials
- Yeong-eun Yoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and systems for wafer bonding alignment compensation
- Patent number 10,886,256
- Issue date Jan 5, 2021
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and systems for adjusting wafer deformation during wafer bo...
- Patent number 10,553,565
- Issue date Feb 4, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and systems for wafer bonding alignment compensation
- Patent number 10,529,694
- Issue date Jan 7, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai Guo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Externally induced charge patterning using rectifying devices
- Patent number 10,141,285
- Issue date Nov 27, 2018
- Palo Alto Research Center Incorporated
- JengPing Lu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bumped electrode arrays for microassemblers
- Patent number 10,043,687
- Issue date Aug 7, 2018
- Palo Alto Research Center Incorporated
- Julie A. Bert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged microsystems
- Patent number 9,950,922
- Issue date Apr 24, 2018
- The Regents of the University of Michigan
- Yogesh Gianchandani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Positioning method in microprocessing process of bulk silicon
- Patent number 9,902,613
- Issue date Feb 27, 2018
- CSMC TECHNOLOGIES FAB1 CO., LTD.
- Errong Jing
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for precision transport, positioning, and assembl...
- Patent number 9,718,683
- Issue date Aug 1, 2017
- The Johns Hopkins University
- Chia-Ling Chien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Alignment methods in fluid-filled MEMS displays
- Patent number 9,274,333
- Issue date Mar 1, 2016
- Pixtronix, Inc.
- Nesbitt W. Hagood
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Alignment methods in fluid-filled MEMS displays
- Patent number 9,229,222
- Issue date Jan 5, 2016
- Pixtronix, Inc.
- Nesbitt W. Hagood
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone and method to position a membrane between two backplates
- Patent number 9,197,967
- Issue date Nov 24, 2015
- EPCOS AG
- Dennis Mortensen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing micro structure, and substrate structure
- Patent number 8,974,626
- Issue date Mar 10, 2015
- FUJIFILM Corporation
- Takamichi Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acceleration sensor and method of manufacturing acceleration sensor
- Patent number 8,276,449
- Issue date Oct 2, 2012
- Rohm Co., Ltd.
- Goro Nakatani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for measuring alignment of adjoining structures
- Patent number 8,195,420
- Issue date Jun 5, 2012
- Comissariat a l'Energie
- Francois De Crecy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Forming a micro electro mechanical system
- Patent number 8,084,285
- Issue date Dec 27, 2011
- Hewlett-Packard Development Company, L.P.
- Sriram Ramamoorthi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Assembling substrates that can form 3-D structures
- Patent number 7,993,968
- Issue date Aug 9, 2011
- Metamems Corp.
- Thaddeus John Gabara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Alignment method of two substrates by microcoils
- Patent number 7,902,837
- Issue date Mar 8, 2011
- Commissariat a l'Energie Atomique
- Maxime Rousseau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro electro mechanical system
- Patent number 7,851,876
- Issue date Dec 14, 2010
- Hewlett-Packard Development Company, L.P.
- Sriram Ramamoorthi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods of assembling micro electromechanical syst...
- Patent number 7,833,829
- Issue date Nov 16, 2010
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Assembling stacked substrates that can form 3-D structures
- Patent number 7,811,854
- Issue date Oct 12, 2010
- Metamems Corp.
- Thaddeus John Gabara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Assembling stacked substrates that can form cylindrical inductors a...
- Patent number 7,728,427
- Issue date Jun 1, 2010
- LCtank LLC
- Thaddeus John Gabara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for aligning devices
- Patent number 7,427,527
- Issue date Sep 23, 2008
- Surfect Technologies, Inc.
- Gerard Minogue
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Alignment method of using alignment marks on wafer edge
- Patent number 7,390,723
- Issue date Jun 24, 2008
- Industrial Technology Research Institute
- Chiu-Wang Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE
- Publication number 20240262683
- Publication date Aug 8, 2024
- ams-OSRAM International GmbH
- Nicole Berner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND ARRANGEMENT FOR ASSEMBLY OF MICROCHIPS INTO A SEPARATE S...
- Publication number 20220324703
- Publication date Oct 13, 2022
- Federico RIBET
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR MONITORING SURFACE CONDITION OF CONTACT SURFA...
- Publication number 20220002148
- Publication date Jan 6, 2022
- National Taiwan University
- Wei-Chang Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro-electromechanical (MEM) Power Relay
- Publication number 20210139322
- Publication date May 13, 2021
- Massachusetts Institute of Technology
- Prashant Patil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and Systems for Wafer Bonding Alignment Compensation
- Publication number 20200219850
- Publication date Jul 9, 2020
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ASSEMBLER SYSTEM FOR CONTROLLING PLACEMENT OF MICRO-OBJECTS
- Publication number 20200207615
- Publication date Jul 2, 2020
- Palo Alto Research Center Incorporated
- Anne Plochowietz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND SYSTEMS FOR WAFER BONDING ALIGNMENT COMPENSATION
- Publication number 20190355698
- Publication date Nov 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and Systems for Adjusting Wafer Deformation During Wafer Bo...
- Publication number 20190355699
- Publication date Nov 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Shuai GUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED MICROSYSTEMS
- Publication number 20170174506
- Publication date Jun 22, 2017
- The Regents of the University of Michigan
- Yogesh GIANCHANDANI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POSITIONING METHOD IN MICROPROCESSING PROCESS OF BULK SILICON
- Publication number 20170113930
- Publication date Apr 27, 2017
- CSMC TECHNOLOGIES FAB1 CO., LTD.
- Errong JING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR PRECISION TRANSPORT, POSITIONING, AND ASSEMBL...
- Publication number 20150353354
- Publication date Dec 10, 2015
- The Johns Hopkins University
- Chia-Ling Chien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microphone and Method to Position a Membrane Between Two Backplates
- Publication number 20140037121
- Publication date Feb 6, 2014
- EPCOS AG
- Dennis Mortensen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ALIGNMENT METHODS IN FLUID-FILLED MEMS DISPLAYS
- Publication number 20130010341
- Publication date Jan 10, 2013
- Pixtronix, Inc.
- Nesbitt W. Hagood
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR PRECISION TRANSPORT, POSITIONING, AND ASSEMBL...
- Publication number 20120219772
- Publication date Aug 30, 2012
- The Johns Hopkins University
- Chia-Ling Chien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR PRECISION TRANSPORT, POSITIONING, AND ASSEMBL...
- Publication number 20110311791
- Publication date Dec 22, 2011
- The Johns Hopkins University
- Chia-Ling Chien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING MICRO STRUCTURE, AND SUBSTRATE STRUCTURE
- Publication number 20110236659
- Publication date Sep 29, 2011
- Takamichi FUJII
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Forming a Micro Electro Mechanical System
- Publication number 20110059566
- Publication date Mar 10, 2011
- Sriram Ramamoorthi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microstructure and Process for its Assembly
- Publication number 20110048799
- Publication date Mar 3, 2011
- Albert-Ludwigs-Universitat Freiburg
- Sebastian Kisban
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ASSEMBLING SUBSTRATES THAT CAN FORM 3-D STRUCTURES
- Publication number 20100258951
- Publication date Oct 14, 2010
- METAMEMS Corp.
- Thaddeus Gabara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICES AND METHODS OF ASSEMBLING MICRO ELECTROMECHANICAL SYST...
- Publication number 20100105167
- Publication date Apr 29, 2010
- Honeywell International Inc.
- Mark Eskridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Assembling Stacked Substrates That Can Form 3-D Structures
- Publication number 20100097776
- Publication date Apr 22, 2010
- LCtank LLC
- Thaddeus Gabara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Acceleration sensor and method of manufacturing acceleration sensor
- Publication number 20100064808
- Publication date Mar 18, 2010
- Rohm Co., Ltd.
- Goro Nakatani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Device for Measuring Alignment of Adjoining Structures
- Publication number 20100049467
- Publication date Feb 25, 2010
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- François De Crecy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS BUMP PATTERN DIE ALIGNMENT SYSTEMS AND METHODS
- Publication number 20100020517
- Publication date Jan 28, 2010
- Honeywell International Inc.
- Bryan Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Alignment method of two substrates by microcoils
- Publication number 20090215207
- Publication date Aug 27, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Maxime Rousseau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ASSEMBLING STACKED SUBSTRATES THAT CAN FORM CYLINDRICAL INDUCTORS A...
- Publication number 20090147431
- Publication date Jun 11, 2009
- MetaMEMS LLC
- Thaddeus Gabara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro electro mechanical system
- Publication number 20080096301
- Publication date Apr 24, 2008
- Sriram Ramamoorthi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Alignment methods in fluid-filled MEMS displays
- Publication number 20080037104
- Publication date Feb 14, 2008
- Pixtronix, Inc.
- Nesbitt W. Hagood
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Alignment method of using alignment marks on wafer edge
- Publication number 20060139643
- Publication date Jun 29, 2006
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Chiu-Wang Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and structure for aligning mechanical based device to integr...
- Publication number 20050255666
- Publication date Nov 17, 2005
- Miradia Inc.
- Xiao Charles Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Active alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro-electromechanical (MEM) power relay

Method for producing MEMS transducer, MEMS transducer, ultrasound p...

System and methods for microfabrication

Method of controlling placement of micro-objects

Apparatus for manufacturing of micro-channel and method for manufac...

Methods and systems for wafer bonding alignment compensation

Methods and systems for adjusting wafer deformation during wafer bo...

Methods and systems for wafer bonding alignment compensation

Externally induced charge patterning using rectifying devices

Bumped electrode arrays for microassemblers

Packaged microsystems

Positioning method in microprocessing process of bulk silicon

System and method for precision transport, positioning, and assembl...

Alignment methods in fluid-filled MEMS displays

Alignment methods in fluid-filled MEMS displays

Microphone and method to position a membrane between two backplates

Method of manufacturing micro structure, and substrate structure

Acceleration sensor and method of manufacturing acceleration sensor

Device for measuring alignment of adjoining structures

Forming a micro electro mechanical system

Assembling substrates that can form 3-D structures

Alignment method of two substrates by microcoils

Micro electro mechanical system

MEMS devices and methods of assembling micro electromechanical syst...

Assembling stacked substrates that can form 3-D structures

Assembling stacked substrates that can form cylindrical inductors a...

Method for aligning devices

Alignment method of using alignment marks on wafer edge

Patents Applicationslast 30 patents

HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE

METHOD AND ARRANGEMENT FOR ASSEMBLY OF MICROCHIPS INTO A SEPARATE S...

DEVICE AND METHOD FOR MONITORING SURFACE CONDITION OF CONTACT SURFA...

Micro-electromechanical (MEM) Power Relay

Methods and Systems for Wafer Bonding Alignment Compensation

MICRO-ASSEMBLER SYSTEM FOR CONTROLLING PLACEMENT OF MICRO-OBJECTS

METHODS AND SYSTEMS FOR WAFER BONDING ALIGNMENT COMPENSATION

Methods and Systems for Adjusting Wafer Deformation During Wafer Bo...

PACKAGED MICROSYSTEMS

POSITIONING METHOD IN MICROPROCESSING PROCESS OF BULK SILICON

SYSTEM AND METHOD FOR PRECISION TRANSPORT, POSITIONING, AND ASSEMBL...

Microphone and Method to Position a Membrane Between Two Backplates

ALIGNMENT METHODS IN FLUID-FILLED MEMS DISPLAYS

SYSTEM AND METHOD FOR PRECISION TRANSPORT, POSITIONING, AND ASSEMBL...

SYSTEM AND METHOD FOR PRECISION TRANSPORT, POSITIONING, AND ASSEMBL...

METHOD OF MANUFACTURING MICRO STRUCTURE, AND SUBSTRATE STRUCTURE

Forming a Micro Electro Mechanical System

Microstructure and Process for its Assembly

ASSEMBLING SUBSTRATES THAT CAN FORM 3-D STRUCTURES

MEMS DEVICES AND METHODS OF ASSEMBLING MICRO ELECTROMECHANICAL SYST...

Assembling Stacked Substrates That Can Form 3-D Structures

Acceleration sensor and method of manufacturing acceleration sensor

Device for Measuring Alignment of Adjoining Structures

MEMS BUMP PATTERN DIE ALIGNMENT SYSTEMS AND METHODS

Alignment method of two substrates by microcoils

ASSEMBLING STACKED SUBSTRATES THAT CAN FORM CYLINDRICAL INDUCTORS A...

Micro electro mechanical system

Alignment methods in fluid-filled MEMS displays

Alignment method of using alignment marks on wafer edge

Method and structure for aligning mechanical based device to integr...