Assembling of devices or systems from individually processed components

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Patents Grantslast 30 patents

Information Patent Grant
Contact lens, method for detecting a structure-borne sound with the...
- Patent number 12,287,535
- Issue date Apr 29, 2025
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertial sensor and method for manufacturing the same
- Patent number 12,269,733
- Issue date Apr 8, 2025
- Denso Corporation
- Keitaro Ito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 12,258,265
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing package structure
- Patent number 12,215,018
- Issue date Feb 4, 2025
- Winbond Electronics Corp.
- Jin-Neng Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for bonding wafers, and a wafer
- Patent number 12,202,725
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Konsta Hannula
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated microfluidic system and method of fabrication
- Patent number 12,194,464
- Issue date Jan 14, 2025
- Corporation for National Research Initiatives
- Michael A. Huff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,168,605
- Issue date Dec 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Liang Hsiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Conductive bond structure to increase membrane sensitivity in MEMS...
- Patent number 12,139,399
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Undercut-free patterned aluminum nitride structure and methods for...
- Patent number 12,134,824
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronics H-frame device
- Patent number 12,122,666
- Issue date Oct 22, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of bonding substrates and separating a portion of the bonded...
- Patent number 12,116,303
- Issue date Oct 15, 2024
- Corning Incorporated
- Thomas Mikio Wynne
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of bonding substrates, microchip and method of manufacturing...
- Patent number 12,103,246
- Issue date Oct 1, 2024
- Ushio Denki Kabushiki Kaisha
- Motohiro Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microchannel chip and method for manufacturing same
- Patent number 12,091,308
- Issue date Sep 17, 2024
- Zeon Corporation
- Hiroya Nishioka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multilayer fluidic devices and methods for their fabrication
- Patent number 12,017,214
- Issue date Jun 25, 2024
- Illumina, Inc.
- Jeffrey S. Fisher
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Carbyne-based sensing device for high spatial resolution in DNA seq...
- Patent number 12,012,329
- Issue date Jun 18, 2024
- Board of Trustees of the University of Arkansas
- Steve Tung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual micro-electro mechanical system and manufacturing method thereof
- Patent number 11,993,512
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,973,048
- Issue date Apr 30, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,970,388
- Issue date Apr 30, 2024
- Winbond Electronics Corp.
- Jin-Neng Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded structures
- Patent number 11,948,847
- Issue date Apr 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Watch component, watch movement and watch
- Patent number 11,927,916
- Issue date Mar 12, 2024
- Seiko Epson Corporation
- Kazuyuki Miyashita
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-opto-mechanical system sensor, arrangement and manufacturing...
- Patent number 11,898,899
- Issue date Feb 13, 2024
- MIRAEX SA
- Mitchell Anderson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level stacked structures having integrated passive features
- Patent number 11,854,958
- Issue date Dec 26, 2023
- General Electric Company
- Marco Francesco Aimi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with built-in vibration isolation, thermal st...
- Patent number 11,834,328
- Issue date Dec 5, 2023
- Invensense, Inc.
- Hamid Eslampour
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vacuum bag having integral ultrasonic transducers
- Patent number 11,828,730
- Issue date Nov 28, 2023
- The Boeing Company
- Keith Daniel Humfeld
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical module and method for manufacturing optical module
- Patent number 11,789,255
- Issue date Oct 17, 2023
- Hamamatsu Photonics K.K.
- Daiki Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 11,772,963
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate assembly and method of bonding substrates
- Patent number 11,752,499
- Issue date Sep 12, 2023
- Taiwan Green Point Enterprises Co., Ltd.
- Sung-Yi Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SILICON-BASED 3-DIMENSIONAL MICROFLUIDICS
- Publication number 20250144621
- Publication date May 8, 2025
- International Business Machines Corporation
- Diego Monserrat Lopez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250115473
- Publication date Apr 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Liang HSIAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE
- Publication number 20250011160
- Publication date Jan 9, 2025
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SENSOR DEVICE WITH WAFER-LEVEL INTEGRATION O...
- Publication number 20250002332
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...
- Publication number 20250002330
- Publication date Jan 2, 2025
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT
- Publication number 20240425367
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION
- Publication number 20240375099
- Publication date Nov 14, 2024
- Illumina, Inc.
- Jeffrey S. FISHER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...
- Publication number 20240368746
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yuan-Chih Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...
- Publication number 20240367965
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240262681
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE
- Publication number 20240262683
- Publication date Aug 8, 2024
- ams-OSRAM International GmbH
- Nicole Berner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR WAFER DIE ASSEMBLY BONDING
- Publication number 20240253974
- Publication date Aug 1, 2024
- Rosemount Aerospace Inc.
- Roger Backman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE
- Publication number 20240217808
- Publication date Jul 4, 2024
- WINBOND ELECTRONICS CORP.
- Jin-Neng WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20240162102
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED STRUCTURES
- Publication number 20240120245
- Publication date Apr 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240092631
- Publication date Mar 21, 2024
- Rohm Co., Ltd.
- Yoshiyuki INUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE MANUFACTURING
- Publication number 20240043264
- Publication date Feb 8, 2024
- Obsidian Sensors, Inc.
- Tallis CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND APPARATUS FOR THE OPTICAL CONTACT BONDING OF COMPONENTS
- Publication number 20240036345
- Publication date Feb 1, 2024
- Carl Zeiss SMT GMBH
- Stefan SCHUETTER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Anchor Structure
- Publication number 20240017987
- Publication date Jan 18, 2024
- SensorTek technology Corp.
- Shih-Wei Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT
- Publication number 20230406698
- Publication date Dec 21, 2023
- Murata Manufacturing Co., Ltd.
- Altti TORKKELI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER
- Publication number 20230399226
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...
- Publication number 20230382713
- Publication date Nov 30, 2023
- Vanguard International Semiconductor Corporation
- RAMACHANDRAMURTHY PRADEEP YELEHANKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230365402
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Attachment Method for Microfluidic Device
- Publication number 20230364604
- Publication date Nov 16, 2023
- PhysioLogic Devices, Inc.
- Peter C. Lord
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATION STRUCTURE, SUBSTRATE, AND ENCAPSULATION METHOD
- Publication number 20230365400
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Guoqiang WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRUCTURE
- Publication number 20230331546
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- FAN HU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING MICRO FLOW PATH DEVICE, AND MICRO FLOW PATH...
- Publication number 20230285959
- Publication date Sep 14, 2023
- NOK Corporation
- Takayuki KOMORI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EXTENDED ACID ETCH FOR OXIDE REMOVAL
- Publication number 20230264949
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Ta KUO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROCHANNEL CHIP AND METHOD FOR MANUFACTURING SAME
- Publication number 20230212000
- Publication date Jul 6, 2023
- ZEON CORPORATION
- Hiroya NISHIOKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Assembling of devices or systems from individually processed components

Industry

Parent Industries

Current Industry

Sub Industries

Patents Grantslast 30 patents

Contact lens, method for detecting a structure-borne sound with the...

Inertial sensor and method for manufacturing the same

Bonding process for forming semiconductor device structure

Method for manufacturing package structure

Method for bonding wafers, and a wafer

Integrated microfluidic system and method of fabrication

Semiconductor device package and a method of manufacturing the same

Conductive bond structure to increase membrane sensitivity in MEMS...

Undercut-free patterned aluminum nitride structure and methods for...

Microelectronics package with vertically stacked MEMS device and co...

Microelectronics H-frame device

Method of bonding substrates and separating a portion of the bonded...

Method of bonding substrates, microchip and method of manufacturing...

Microchannel chip and method for manufacturing same

Multilayer fluidic devices and methods for their fabrication

Carbyne-based sensing device for high spatial resolution in DNA seq...

Dual micro-electro mechanical system and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Semiconductor package and method for manufacturing the same

Package structure and method for manufacturing the same

Bonded structures

Watch component, watch movement and watch

Micro-opto-mechanical system sensor, arrangement and manufacturing...

Wafer level stacked structures having integrated passive features

Semiconductor package with built-in vibration isolation, thermal st...

Vacuum bag having integral ultrasonic transducers

Support structure for MEMS device with particle filter

Optical module and method for manufacturing optical module

Bonding process for forming semiconductor device structure

Substrate assembly and method of bonding substrates

Patents Applicationslast 30 patents

SILICON-BASED 3-DIMENSIONAL MICROFLUIDICS

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE

MICROELECTROMECHANICAL SENSOR DEVICE WITH WAFER-LEVEL INTEGRATION O...

MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CO...

DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT

MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION

UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR...

CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS D...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE

SYSTEMS AND METHODS FOR WAFER DIE ASSEMBLY BONDING

METHOD FOR MANUFACTURING PACKAGE STRUCTURE

BONDED STRUCTURES

BONDED STRUCTURES

MEMS SENSOR AND MANUFACTURING METHOD THEREOF

MEMS DEVICE MANUFACTURING

METHOD AND APPARATUS FOR THE OPTICAL CONTACT BONDING OF COMPONENTS

Anchor Structure

MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT

MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication metho...

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

Attachment Method for Microfluidic Device

ENCAPSULATION STRUCTURE, SUBSTRATE, AND ENCAPSULATION METHOD

MEMS STRUCTURE

METHOD OF MANUFACTURING MICRO FLOW PATH DEVICE, AND MICRO FLOW PATH...

EXTENDED ACID ETCH FOR OXIDE REMOVAL

MICROCHANNEL CHIP AND METHOD FOR MANUFACTURING SAME