adapted for localised heating

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H01L2224/75253

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75253adapted for localised heating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser reflow apparatus and laser reflow method
- Patent number 11,935,863
- Issue date Mar 19, 2024
- Disco Corporation
- Satoshi Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat assisted flip chip bonding apparatus
- Patent number 11,682,650
- Issue date Jun 20, 2023
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component joining apparatus, component joining method and mounted s...
- Patent number 11,574,888
- Issue date Feb 7, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounting device and method for manufacturing sem...
- Patent number 11,296,048
- Issue date Apr 5, 2022
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,971,471
- Issue date Apr 6, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for improved die bonding
- Patent number 10,756,048
- Issue date Aug 25, 2020
- Skyworks Solutions, Inc.
- José Manuel Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for contactless transfer and soldering of chip...
- Patent number 10,304,709
- Issue date May 28, 2019
- Nederlandse Organisatie voor toegepast-natuurwetenschappelikj onderzoek TNO
- Rob Jacob Hendriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework process and tool design for semiconductor package
- Patent number 10,269,762
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for improved die bonding
- Patent number 10,199,351
- Issue date Feb 5, 2019
- Skyworks Solutions, Inc.
- José Manuel Flores
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 10,109,612
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,049,998
- Issue date Aug 14, 2018
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package alignment frame for local reflow
- Patent number 9,991,223
- Issue date Jun 5, 2018
- Intel Corporation
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting apparatus
- Patent number 9,842,824
- Issue date Dec 12, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akira Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,812,418
- Issue date Nov 7, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
UV-curable anisotropic conductive adhesive
- Patent number 9,777,197
- Issue date Oct 3, 2017
- Sunray Scientific, LLC
- S. Kumar Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,761,552
- Issue date Sep 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate composite, method and device for bonding of substrates
- Patent number 9,682,539
- Issue date Jun 20, 2017
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head and die bonding apparatus having the same
- Patent number 9,620,476
- Issue date Apr 11, 2017
- Semes Co., Ltd.
- Hang Lim Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP TO PACKAGE SUBSTRATE SOLDER JOINT
- Publication number 20230352441
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
- Publication number 20230317676
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD
- Publication number 20230019546
- Publication date Jan 19, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT ASSISTED FLIP CHIP BONDING APPARATUS
- Publication number 20220384383
- Publication date Dec 1, 2022
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220254745
- Publication date Aug 11, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220130783
- Publication date Apr 28, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327739
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327740
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP MOUNTING DEVICE AND METHOD FOR MANUFACTURING SEM...
- Publication number 20210257329
- Publication date Aug 19, 2021
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20210243894
- Publication date Aug 5, 2021
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER REFLOW APPARATUS AND LASER REFLOW METHOD
- Publication number 20210202431
- Publication date Jul 1, 2021
- Disco Corporation
- Satoshi KOBAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20200350281
- Publication date Nov 5, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200212001
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVED DIE BONDING
- Publication number 20200006283
- Publication date Jan 2, 2020
- SKYWORKS SOLUTIONS, INC.
- José Manuel FLORES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT JOINING APPARATUS, COMPONENT JOINING METHOD AND MOUNTED S...
- Publication number 20190189586
- Publication date Jun 20, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- RYO FUJITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW
- Publication number 20170179067
- Publication date Jun 22, 2017
- Intel Corporation
- RUSSELL S. AOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rework Process and Tool Design for Semiconductor Package
- Publication number 20170125374
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT CHIP ATTACHMENT USING LOCAL HEAT SOURCE
- Publication number 20160351526
- Publication date Dec 1, 2016
- Intel Corporation
- Thomas Alan Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fog Bonding Device and Method Thereof
- Publication number 20160225736
- Publication date Aug 4, 2016
- HYDIS TECHNOLOGIES CO., LTD.
- Young Hwan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DETERMINING AND ADJUSTING A LEVEL OF PARALL...
- Publication number 20150155254
- Publication date Jun 4, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael P. Schmidt-Lange
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING HEAD AND DIE BONDING APPARATUS HAVING THE SAME
- Publication number 20150129135
- Publication date May 14, 2015
- SEMES CO., LTD.
- Hang Lim LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL...
- Publication number 20150060527
- Publication date Mar 5, 2015
- Weihua Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20150050778
- Publication date Feb 19, 2015
- TORAY INDUSTRIES, INC.
- Noboru Asahi
- B32 - LAYERED PRODUCTS

adapted for localised heating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Selective transfer of micro devices

Laser reflow apparatus and laser reflow method

Dielectric-dielectric and metallization bonding via plasma activati...

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Heat assisted flip chip bonding apparatus

Component joining apparatus, component joining method and mounted s...

Selective micro device transfer to receiver substrate

System for processing semiconductor devices

Semiconductor chip mounting device and method for manufacturing sem...

Methods and systems for manufacturing semiconductor devices

Methods for improved die bonding

Apparatus and method for contactless transfer and soldering of chip...

Rework process and tool design for semiconductor package

Method and device for improved die bonding

Tools and systems for processing semiconductor devices, and methods...

Conductive connections, structures with such connections, and metho...

Conductive connections, structures with such connections, and metho...

Semiconductor package alignment frame for local reflow

Component mounting apparatus

Electronic apparatus and method for fabricating the same

Conductive connections, structures with such connections, and metho...

UV-curable anisotropic conductive adhesive

Electronic apparatus and method for fabricating the same

Substrate composite, method and device for bonding of substrates

Bonding head and die bonding apparatus having the same

Patents Applicationslast 30 patents

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

SELECTIVE TRANSFER OF MICRO DEVICES

BUMP TO PACKAGE SUBSTRATE SOLDER JOINT

BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING

IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHOD

HEAT ASSISTED FLIP CHIP BONDING APPARATUS

Tools and Systems for Processing Semiconductor Devices, and Methods...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SEMICONDUCTOR CHIP MOUNTING DEVICE AND METHOD FOR MANUFACTURING SEM...

SELECTIVE TRANSFER OF MICRO DEVICES

LASER REFLOW APPARATUS AND LASER REFLOW METHOD

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS FOR IMPROVED DIE BONDING

COMPONENT JOINING APPARATUS, COMPONENT JOINING METHOD AND MOUNTED S...

Tools and Systems for Processing Semiconductor Devices, and Methods...

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW

Rework Process and Tool Design for Semiconductor Package

INTEGRATED CIRCUIT CHIP ATTACHMENT USING LOCAL HEAT SOURCE

Fog Bonding Device and Method Thereof

SYSTEMS AND METHODS FOR DETERMINING AND ADJUSTING A LEVEL OF PARALL...

BONDING HEAD AND DIE BONDING APPARATUS HAVING THE SAME

NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL...

METHOD AND APPARATUS FOR PRODUCING SEMICONDUCTOR DEVICE