Adding a circuit layer by direct wet plating

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CPC
H05K3/4661

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4661Adding a circuit layer by direct wet plating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 12,171,067
- Issue date Dec 17, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board
- Patent number 12,101,894
- Issue date Sep 24, 2024
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 12,028,967
- Issue date Jul 2, 2024
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and a manufacturing method of the multilayer s...
- Patent number 11,923,123
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Kazutaka Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core multilayer wiring board and method of producing the same
- Patent number 11,877,394
- Issue date Jan 16, 2024
- TOPPAN INC.
- Susumu Maniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacturing method for same
- Patent number 11,871,525
- Issue date Jan 9, 2024
- Kyocera Corporation
- Yoshihiro Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method for printed wiring board
- Patent number 11,849,546
- Issue date Dec 19, 2023
- Kyocera Corporation
- Atsuo Kawagoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,832,397
- Issue date Nov 28, 2023
- Ibiden Co., Ltd.
- Masashi Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 11,696,391
- Issue date Jul 4, 2023
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,632,862
- Issue date Apr 18, 2023
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced capacitance land pad
- Patent number 11,516,915
- Issue date Nov 29, 2022
- Intel Corporation
- Zhichao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,457,532
- Issue date Sep 27, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preparing graphene circuit pattern
- Patent number 11,372,300
- Issue date Jun 28, 2022
- BOE Technology Group Co., Ltd.
- Bo Hu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Mounting substrate
- Patent number 11,367,555
- Issue date Jun 21, 2022
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, circuit module, method of manufacturing circuit boar...
- Patent number 11,310,914
- Issue date Apr 19, 2022
- Murata Manufacturing Co., Ltd.
- Takafumi Kusuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing plated component, plated component, catalytic...
- Patent number 11,310,918
- Issue date Apr 19, 2022
- MAXELL, LTD.
- Naoki Usuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus with a substrate provided with plasma treatment
- Patent number 11,291,122
- Issue date Mar 29, 2022
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,276,610
- Issue date Mar 15, 2022
- Fujitsu Limited
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board
- Patent number 11,140,785
- Issue date Oct 5, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless plating activation
- Patent number 11,109,493
- Issue date Aug 31, 2021
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,089,674
- Issue date Aug 10, 2021
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Large scale manufacturing of hybrid nanostructured textile sensors
- Patent number 11,047,051
- Issue date Jun 29, 2021
- Nanowear Inc.
- Vijay K. Varadan
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for manufacturing multi-layer circuit board capable of being...
- Patent number 11,044,806
- Issue date Jun 22, 2021
- Kinsus Interconnect Technology Corp.
- Chin-Kuan Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit carrier board and manufacturing method thereof
- Patent number 11,032,917
- Issue date Jun 8, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing plated component, plated component, catalytic...
- Patent number 11,013,125
- Issue date May 18, 2021
- MAXELL HOLDINGS, LTD.
- Naoki Usuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming circuit on substrate
- Patent number 10,966,327
- Issue date Mar 30, 2021
- JCU CORPORATION
- Daisuke Sadohara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and solution for forming interconnects
- Patent number 10,914,008
- Issue date Feb 9, 2021
- Imec VZW
- Henricus Philipsen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMIC...
- Publication number 20240301176
- Publication date Sep 12, 2024
- Asahi Kasei Kabushiki Kaisha
- Kenzo ONIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...
- Publication number 20240260200
- Publication date Aug 1, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240172373
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Byung Woo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gold Plating Bath and Gold Plated Final Finish
- Publication number 20240158941
- Publication date May 16, 2024
- MacDermid Enthone Inc.
- Roger Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
- Publication number 20240121903
- Publication date Apr 11, 2024
- Kyocera Corporation
- Atsuo KAWAGOE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
- Publication number 20240080994
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Gun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240023250
- Publication date Jan 18, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240008191
- Publication date Jan 4, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20230239998
- Publication date Jul 27, 2023
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20230209729
- Publication date Jun 29, 2023
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...
- Publication number 20230189444
- Publication date Jun 15, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230180385
- Publication date Jun 8, 2023
- IBIDEN CO., LTD.
- Shogo FUKUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230127697
- Publication date Apr 27, 2023
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20220394859
- Publication date Dec 8, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- FU-YUN SHEN
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
- Publication number 20220338357
- Publication date Oct 20, 2022
- KYOCERA CORPORATION
- Atsuo KAWAGOE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220330432
- Publication date Oct 13, 2022
- IBIDEN CO., LTD.
- Hirotaka TANIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS CORE MULTILAYER WIRING BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20220279651
- Publication date Sep 1, 2022
- TOPPAN INC.
- Susumu MANIWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20220183158
- Publication date Jun 9, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori SHIMIZU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD FOR SAME
- Publication number 20220159844
- Publication date May 19, 2022
- KYOCERA CORPORATION
- Yoshihiro HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20220053648
- Publication date Feb 17, 2022
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20220022316
- Publication date Jan 20, 2022
- Unimicron Technology Corp.
- Po-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Gold Plating Bath and Gold Plated Final Finish
- Publication number 20210371998
- Publication date Dec 2, 2021
- MacDermid Enthone Inc.
- Roger Bernards
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD
- Publication number 20210282277
- Publication date Sep 9, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING PLATED COMPONENT, PLATED COMPONENT, CATALYTIC...
- Publication number 20210235587
- Publication date Jul 29, 2021
- Maxell Holdings, Ltd.
- Naoki USUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210176866
- Publication date Jun 10, 2021
- IBIDEN CO., LTD.
- Masashi AWAZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210120677
- Publication date Apr 22, 2021
- LG Innotek Co., Ltd.
- Jung Ho Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT
- Publication number 20200245472
- Publication date Jul 30, 2020
- Intel Corporation
- Darko GRUJICIC
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20200137894
- Publication date Apr 30, 2020
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTI-LAYER CIRCUIT BOARD CAPABLE OF BEING...
- Publication number 20200128662
- Publication date Apr 23, 2020
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Chin-Kuan Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, CIRCUIT MODULE, METHOD OF MANUFACTURING CIRCUIT BOAR...
- Publication number 20200120806
- Publication date Apr 16, 2020
- MURATA MANUFACTURING CO., LTD.
- Takafumi KUSUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Adding a circuit layer by direct wet plating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing printed wiring board

Wiring board

Method of manufacturing wiring substrate

Multilayer substrate and a manufacturing method of the multilayer s...

Structure for embedding and packaging multiple devices by layer and...

Printed circuit board and method of manufacturing the same

Glass core multilayer wiring board and method of producing the same

Wiring board and manufacturing method for same

Printed wiring board and manufacturing method for printed wiring board

Printed wiring board and method for manufacturing printed wiring board

Multilayer coil circuit substrate

Wiring substrate and method of manufacturing the same

Wiring board

Reduced capacitance land pad

Method of manufacturing circuit board

Method of preparing graphene circuit pattern

Mounting substrate

Circuit board, circuit module, method of manufacturing circuit boar...

Method for producing plated component, plated component, catalytic...

Apparatus with a substrate provided with plasma treatment

Wiring board and method of manufacturing the same

Flexible printed circuit board

Electroless plating activation

Wiring substrate and method for manufacturing wiring substrate

Large scale manufacturing of hybrid nanostructured textile sensors

Method for manufacturing multi-layer circuit board capable of being...

Circuit carrier board and manufacturing method thereof

Method for producing plated component, plated component, catalytic...

Method for forming circuit on substrate

Method and solution for forming interconnects

Patents Applicationslast 30 patents

EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMIC...

METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

Gold Plating Bath and Gold Plated Final Finish

PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD

METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT

WIRING SUBSTRATE

WIRING SUBSTRATE

METHOD OF MANUFACTURING WIRING SUBSTRATE

WIRING BOARD

STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...

WIRING SUBSTRATE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING CIRCUIT BOARD

PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

GLASS CORE MULTILAYER WIRING BOARD AND METHOD OF PRODUCING THE SAME

METHOD OF MANUFACTURING PRINTED WIRING BOARD

WIRING BOARD AND MANUFACTURING METHOD FOR SAME

WIRING BOARD

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

Gold Plating Bath and Gold Plated Final Finish

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD

METHOD FOR PRODUCING PLATED COMPONENT, PLATED COMPONENT, CATALYTIC...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT

METHOD OF MANUFACTURING CIRCUIT BOARD

METHOD FOR MANUFACTURING MULTI-LAYER CIRCUIT BOARD CAPABLE OF BEING...

CIRCUIT BOARD, CIRCUIT MODULE, METHOD OF MANUFACTURING CIRCUIT BOAR...