Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Industry

CPC
H05K3/4652

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4652Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding component in component carrier by component fixation stru...
- Patent number 12,075,561
- Issue date Aug 27, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer body
- Patent number 12,058,819
- Issue date Aug 6, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for laminating graphene-coated printed circuit boards
- Patent number 12,004,308
- Issue date Jun 4, 2024
- Mellanox Technologies, Ltd.
- Boaz Atias
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit and manufacturing method thereof, and disp...
- Patent number 11,839,025
- Issue date Dec 5, 2023
- Beijing BOE Optoelectronics Technology Co., Ltd
- Xiaoxia Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded magnetic inlay and integrated coil...
- Patent number 11,792,932
- Issue date Oct 17, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer coil and method for manufacturing the same
- Patent number 11,688,553
- Issue date Jun 27, 2023
- Murata Manufacturing Co., Ltd.
- Kanto Iida
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and method of manufacturing the same
- Patent number 11,523,521
- Issue date Dec 6, 2022
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic device having the same
- Patent number 11,516,912
- Issue date Nov 29, 2022
- Samsung Electronics Co., Ltd.
- Jongmin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing transfer film including seed layer, method...
- Patent number 11,453,823
- Issue date Sep 27, 2022
- InkTee Co., Ltd.
- Kwang-Choon Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,419,222
- Issue date Aug 16, 2022
- Unimicron Technology Corp.
- Hsin-Chi Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,412,622
- Issue date Aug 9, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Kristl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, copper foil having carrier, laminated...
- Patent number 11,401,612
- Issue date Aug 2, 2022
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mechanically robust component carrier with rigid and flexible portions
- Patent number 11,324,126
- Issue date May 3, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Bund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board manufacturing method
- Patent number 11,317,522
- Issue date Apr 26, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and processes for forming electrical circuitries on three-d...
- Patent number 11,304,303
- Issue date Apr 12, 2022
- DUJUD LLC
- Reza Abbaspour
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Resin composition, support with resin layer, prepreg, laminate, mul...
- Patent number 11,286,346
- Issue date Mar 29, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Takao Tanigawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer laminate and method for producing multilayer printed wir...
- Patent number 11,285,700
- Issue date Mar 29, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,277,925
- Issue date Mar 15, 2022
- Ibiden Co., Ltd.
- Toshihide Makino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, memory system, and method for manufacturing p...
- Patent number 11,272,610
- Issue date Mar 8, 2022
- Kioxia Corporation
- Daigo Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of printed board
- Patent number 11,212,913
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,191,165
- Issue date Nov 30, 2021
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermo induction press for welding printed circuits and method carr...
- Patent number 11,148,384
- Issue date Oct 19, 2021
- CEDAL EQUIPMENT CO., LTD.
- Marco Bianchi
- B30 - PRESSES
Information Patent Grant
Method of making a rigid/flex circuit board
- Patent number 11,140,776
- Issue date Oct 5, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ning Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD
- Publication number 20240365477
- Publication date Oct 31, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...
- Publication number 20240260200
- Publication date Aug 1, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240215165
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myong Keun Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240188216
- Publication date Jun 6, 2024
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20240188227
- Publication date Jun 6, 2024
- DAI NIPPON PRINTING CO., LTD.
- Keita IIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structures for Forming Printed Board Interconnects Using Solder
- Publication number 20240172372
- Publication date May 23, 2024
- Conductor Analysis Technologies, Inc.
- Timothy A. Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240098908
- Publication date Mar 21, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BO...
- Publication number 20240064910
- Publication date Feb 22, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Junqi TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE
- Publication number 20240049397
- Publication date Feb 8, 2024
- Reophotonics, Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...
- Publication number 20240032209
- Publication date Jan 25, 2024
- Chihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOMIZED THERMAL PATHWAYS IN A PCB
- Publication number 20240008190
- Publication date Jan 4, 2024
- DSBJ PTE. LTD.
- Todd Robinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, PRINTED WI...
- Publication number 20230391939
- Publication date Dec 7, 2023
- Kohta IWANAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENTS, AND SU...
- Publication number 20230397337
- Publication date Dec 7, 2023
- Hiroyuki IZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
- Publication number 20230345631
- Publication date Oct 26, 2023
- JSR Corporation
- Nobuyuki MIYAKI
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20230319980
- Publication date Oct 5, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-CONTAINING SUBSTRATE
- Publication number 20230300990
- Publication date Sep 21, 2023
- Shinko Electric Industries Co., Ltd.
- Takao KOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING PROCESS FOR EMBEDDED CHIPS
- Publication number 20230230929
- Publication date Jul 20, 2023
- Guangdong ZECHENG Technology Co., LTD
- CHIA-MING LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS OF RIGID-FLEX BOARD
- Publication number 20230232546
- Publication date Jul 20, 2023
- Guangdong ZECHENG Technology Co., LTD
- CHIA-MING LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY ELECTRONIC COMPONENT
- Publication number 20230225049
- Publication date Jul 13, 2023
- MURATA MANUFACTURING CO., LTD.
- Hirofumi OIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20230217596
- Publication date Jul 6, 2023
- FLEXIUM INTERCONNECT, INC.
- Wei-Kuo CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230053211
- Publication date Feb 16, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...
- Publication number 20230025696
- Publication date Jan 26, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHUNG-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220394842
- Publication date Dec 8, 2022
- FUJIFILM CORPORATION
- Genya TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR LAMINATING GRAPHENE-COATED PRINTED CIRCUIT BOARDS
- Publication number 20220377912
- Publication date Nov 24, 2022
- MELLANOX TECHNOLOGIES, LTD.
- Boaz ATIAS
- C01 - INORGANIC CHEMISTRY
Information Patent Application
INSULATING LAYER FOR MULTILAYER PRINTED CIRCUIT BOARD, MULTILAYER P...
- Publication number 20220279663
- Publication date Sep 1, 2022
- LG CHEM, LTD.
- Jeong Wook MUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, AND DISP...
- Publication number 20220240381
- Publication date Jul 28, 2022
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xiaoxia WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PRINTED BOARD
- Publication number 20220087011
- Publication date Mar 17, 2022
- MURATA MANUFACTURING CO., LTD.
- Toshikazu HARADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20220087029
- Publication date Mar 17, 2022
- Ethertronics, Inc.
- Seung Hyuk Choi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Embedding Component in Component Carrier by Component Fixation Stru...
- Publication number 20220053633
- Publication date Feb 17, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BODY
- Publication number 20220022326
- Publication date Jan 20, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Rintaro ISHII
- B32 - LAYERED PRODUCTS

Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bent laminated printed circuit board

Embedding component in component carrier by component fixation stru...

Electromagnetic wave transmission board comprising an inner board w...

Multilayer body

Process for laminating graphene-coated printed circuit boards

Circuit board preparation method

Catalyzed metal foil and uses thereof

Flexible printed circuit and manufacturing method thereof, and disp...

Component carrier with embedded magnetic inlay and integrated coil...

Method for manufacturing a circuit having a lamination layer using...

Method for manufacturing an electronic module and electronic module

Multilayer coil and method for manufacturing the same

Process for fabrication of a printed circuit board using a semi-add...

Multilayer board and method of manufacturing the same

Printed circuit board and electronic device having the same

Method for manufacturing transfer film including seed layer, method...

Method of manufacturing circuit board

Component carrier and method of manufacturing the same

Surface-treated copper foil, copper foil having carrier, laminated...

Mechanically robust component carrier with rigid and flexible portions

Wiring board manufacturing method

Methods and processes for forming electrical circuitries on three-d...

Resin composition, support with resin layer, prepreg, laminate, mul...

Multilayer laminate and method for producing multilayer printed wir...

Wiring board and method for manufacturing the same

Printed wiring board, memory system, and method for manufacturing p...

Manufacturing method of printed board

Method for manufacturing a circuit having a lamination layer using...

Thermo induction press for welding printed circuits and method carr...

Method of making a rigid/flex circuit board

Patents Applicationslast 30 patents

CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD

METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...

PRINTED CIRCUIT BOARD

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

Structures for Forming Printed Board Interconnects Using Solder

CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR

LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BO...

METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE

MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...

CUSTOMIZED THERMAL PATHWAYS IN A PCB

RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, PRINTED WI...

METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENTS, AND SU...

PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

COMPONENT-CONTAINING SUBSTRATE

PACKAGING PROCESS FOR EMBEDDED CHIPS

MANUFACTURING PROCESS OF RIGID-FLEX BOARD

HIGH-FREQUENCY ELECTRONIC COMPONENT

FLEXIBLE CIRCUIT BOARD

MULTILAYER BOARD AND METHOD OF MANUFACTURING THE SAME

TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

PROCESS FOR LAMINATING GRAPHENE-COATED PRINTED CIRCUIT BOARDS

INSULATING LAYER FOR MULTILAYER PRINTED CIRCUIT BOARD, MULTILAYER P...

FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, AND DISP...

MANUFACTURING METHOD OF PRINTED BOARD

Method for Manufacturing a Circuit Having a Lamination Layer Using...

Embedding Component in Component Carrier by Component Fixation Stru...

MULTILAYER BODY