Adding a circuit layer by thin film methods

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CPC
H05K3/467

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/467Adding a circuit layer by thin film methods

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
- Patent number 12,156,325
- Issue date Nov 26, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of producing printed circuit board
- Patent number 12,144,111
- Issue date Nov 12, 2024
- Denso Corporation
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-dielectric printed circuit board
- Patent number 12,120,811
- Issue date Oct 15, 2024
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, photosensitive resin film, printe...
- Patent number 12,103,999
- Issue date Oct 1, 2024
- Resonac Corporation
- Akihiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,108,545
- Issue date Oct 1, 2024
- Samsung Display Co., Ltd.
- Jeongjin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board manufacturing apparatus
- Patent number 12,041,731
- Issue date Jul 16, 2024
- HAESUNG DS CO., LTD
- Sang Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guided transport path correction
- Patent number 12,028,991
- Issue date Jul 2, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Manufacturing method of a multi-layer for a probe card
- Patent number 12,019,111
- Issue date Jun 25, 2024
- Technoprobe S.p.A.
- Roberto Crippa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 12,016,119
- Issue date Jun 18, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, resin sheet, laminate, and printed...
- Patent number 12,006,433
- Issue date Jun 11, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kouichi Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having component covered with ultra-thin transiti...
- Patent number 11,963,310
- Issue date Apr 16, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,943,877
- Issue date Mar 26, 2024
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filtering cable
- Patent number 11,929,189
- Issue date Mar 12, 2024
- Yunan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and method of producing the same
- Patent number 11,917,751
- Issue date Feb 27, 2024
- TOPPAN INC.
- Masao Aratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded component covered by functional fil...
- Patent number 11,877,388
- Issue date Jan 16, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Imane Souli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 11,871,526
- Issue date Jan 9, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jun Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer line structure and method for manufacturing thereof
- Patent number 11,862,564
- Issue date Jan 2, 2024
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,832,397
- Issue date Nov 28, 2023
- Ibiden Co., Ltd.
- Masashi Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,825,613
- Issue date Nov 21, 2023
- Samsung Display Co., Ltd.
- Jeongjin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board, multilayer metal-clad laminated bo...
- Patent number 11,818,835
- Issue date Nov 14, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Planar coil element and method for producing planar coil element
- Patent number 11,785,724
- Issue date Oct 10, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper foil with carrier
- Patent number 11,765,840
- Issue date Sep 19, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit support structure with integrated isolation circuitry
- Patent number 11,716,117
- Issue date Aug 1, 2023
- Texas Instruments Incorporated
- Michael Lueders
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Triazole silane compound, method for synthesizing said compound and...
- Patent number 11,680,076
- Issue date Jun 20, 2023
- Shikoku Chemicals Corporation
- Takayuki Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board automated layup system
- Patent number 11,653,484
- Issue date May 16, 2023
- Raytheon Company
- Mikhail Pevzner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,622,443
- Issue date Apr 4, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Artan Baftiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming channels in printed circuit boards by stacking s...
- Patent number 11,606,865
- Issue date Mar 14, 2023
- Raytheon Company
- Mikhail Pevzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier Method of Manufacturing the Component Carrier and...
- Publication number 20240334617
- Publication date Oct 3, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Hans PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUIDED TRANSPORT PATH CORRECTION
- Publication number 20240314941
- Publication date Sep 19, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD
- Publication number 20240276653
- Publication date Aug 15, 2024
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UV CURABLE DIELECTRIC MATERIALS FOR 3D PRINTING AND 3D PRINTING SYS...
- Publication number 20240260201
- Publication date Aug 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240251504
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240179829
- Publication date May 30, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240172358
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Yunje Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATE...
- Publication number 20240120964
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Giacomo Calabrese
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240114619
- Publication date Apr 4, 2024
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240114629
- Publication date Apr 4, 2024
- Kensuke MATSUHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
- Publication number 20240080994
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Gun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240064911
- Publication date Feb 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGJIN PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240023251
- Publication date Jan 18, 2024
- Unimicron Technology Corp.
- Shao-Chien LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MEMBRANE CIRCUIT BOARD
- Publication number 20240015892
- Publication date Jan 11, 2024
- Primax Electronics Ltd.
- Yi-Te Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LITHOGRAPHIC STRAIN GAUGE IN AN ELECTRICALLY CONDUCTING SUBSTRATE
- Publication number 20230417609
- Publication date Dec 28, 2023
- Microsoft Technology Licensing, LLC
- Luke Thomas GREGORY
- G01 - MEASURING TESTING
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20230422397
- Publication date Dec 28, 2023
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
- Publication number 20230413431
- Publication date Dec 21, 2023
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230380055
- Publication date Nov 23, 2023
- IBIDEN CO., LTD.
- Masataka KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT, PRINTED CIRCUIT, AND METHOD OF M...
- Publication number 20230371176
- Publication date Nov 16, 2023
- Sumitomo Electric Industries, Ltd.
- Takuto HIDANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUPPORT STRUCTURE WITH INTEGRATED ISOLATION CIRCUITRY
- Publication number 20230344467
- Publication date Oct 26, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Michael Lueders
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230319986
- Publication date Oct 5, 2023
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230284394
- Publication date Sep 7, 2023
- Nitto Denko Corporation
- Naoki SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE FOR DISPLAY DEVICE
- Publication number 20230276580
- Publication date Aug 31, 2023
- AUO Corporation
- Chi-Sheng Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230240023
- Publication date Jul 27, 2023
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING S...
- Publication number 20230209728
- Publication date Jun 29, 2023
- Raytheon Company
- Mikhail Pevzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS
- Publication number 20230114747
- Publication date Apr 13, 2023
- HAESUNG DS CO., LTD.
- Sang Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Resistance on Circuit Board and Circuit Board Ha...
- Publication number 20230093870
- Publication date Mar 30, 2023
- Unimicron Technology Corporation
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE DEVICES INCORPORATING ELECTRONICALLY-CONDUCTIVE LAYERS, IN...
- Publication number 20230078471
- Publication date Mar 16, 2023
- THE UNIVERSITY COURT OF THE UNIVERSITY OF EDINBURGH
- Philip James Walton HANDS
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
- Publication number 20230083007
- Publication date Mar 16, 2023
- InnoLux Corporation
- Jia Sin Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Adding a circuit layer by thin film methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package carrier with improved heat dissipation efficiency and manuf...

Printed circuit board and method of producing printed circuit board

Multi-dielectric printed circuit board

Photosensitive resin composition, photosensitive resin film, printe...

Display device and method of manufacturing the same

Multilayer circuit board manufacturing apparatus

Guided transport path correction

Manufacturing method of a multi-layer for a probe card

Method for manufacturing multilayer printed circuit board

Thermosetting resin composition, resin sheet, laminate, and printed...

High density organic bridge device and method

Component carrier having component covered with ultra-thin transiti...

Circuit board structure and manufacturing method thereof

Filtering cable

Multilayer wiring board and method of producing the same

Manufacturing method of package structure

Printed circuit board and method of manufacturing the same

Component carrier with embedded component covered by functional fil...

Circuit board and method of manufacturing circuit board

Multi-layer line structure and method for manufacturing thereof

Printed wiring board and method for manufacturing printed wiring board

Display device and method of manufacturing the same

Multilayer printed wiring board, multilayer metal-clad laminated bo...

Planar coil element and method for producing planar coil element

Copper foil with carrier

Circuit support structure with integrated isolation circuitry

Triazole silane compound, method for synthesizing said compound and...

Printed circuit board automated layup system

Component carrier and method of manufacturing the same

Method for forming channels in printed circuit boards by stacking s...

Patents Applicationslast 30 patents

Component Carrier Method of Manufacturing the Component Carrier and...

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

GUIDED TRANSPORT PATH CORRECTION

WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

UV CURABLE DIELECTRIC MATERIALS FOR 3D PRINTING AND 3D PRINTING SYS...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATE...

ELECTRONIC DEVICE

WIRING SUBSTRATE

METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF MEMBRANE CIRCUIT BOARD

LITHOGRAPHIC STRAIN GAUGE IN AN ELECTRICALLY CONDUCTING SUBSTRATE

WIRING CIRCUIT BOARD

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD

WIRING SUBSTRATE

BASE MATERIAL FOR PRINTED CIRCUIT, PRINTED CIRCUIT, AND METHOD OF M...

CIRCUIT SUPPORT STRUCTURE WITH INTEGRATED ISOLATION CIRCUITRY

PRINTED WIRING BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE FOR DISPLAY DEVICE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING S...

MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS

Method for Forming Resistance on Circuit Board and Circuit Board Ha...

FLEXIBLE DEVICES INCORPORATING ELECTRONICALLY-CONDUCTIVE LAYERS, IN...

METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD