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Adding a circuit layer by thin film methods
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H05K3/467
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ELECTRICITY
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Electric techniques
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PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Apparatus or processes for manufacturing printed circuits
Current Industry
H05K3/467
Adding a circuit layer by thin film methods
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last 30 patents
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Patent Grant
Component carrier having component covered with ultra-thin transiti...
Patent number
11,963,310
Issue date
Apr 16, 2024
AT&S(China) Co. Ltd.
Mikael Tuominen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board structure and manufacturing method thereof
Patent number
11,943,877
Issue date
Mar 26, 2024
Unimicron Technology Corp.
Wen-Yu Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Filtering cable
Patent number
11,929,189
Issue date
Mar 12, 2024
Yunan Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer wiring board and method of producing the same
Patent number
11,917,751
Issue date
Feb 27, 2024
TOPPAN INC.
Masao Aratani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method of package structure
Patent number
11,895,780
Issue date
Feb 6, 2024
Unimicron Technology Corp.
Kai-Ming Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board and method of manufacturing the same
Patent number
11,889,634
Issue date
Jan 30, 2024
LG Innotek Co., Ltd
Jung Ho Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Component carrier with embedded component covered by functional fil...
Patent number
11,877,388
Issue date
Jan 16, 2024
AT&SAustria Technologie & Systemtechnik AG
Imane Souli
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board and method of manufacturing circuit board
Patent number
11,871,526
Issue date
Jan 9, 2024
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
Jun Dai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layer line structure and method for manufacturing thereof
Patent number
11,862,564
Issue date
Jan 2, 2024
Dai Nippon Printing Co., Ltd.
Hiroshi Kudo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed wiring board and method for manufacturing printed wiring board
Patent number
11,832,397
Issue date
Nov 28, 2023
Ibiden Co., Ltd.
Masashi Awazu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Display device and method of manufacturing the same
Patent number
11,825,613
Issue date
Nov 21, 2023
Samsung Display Co., Ltd.
Jeongjin Park
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer printed wiring board, multilayer metal-clad laminated bo...
Patent number
11,818,835
Issue date
Nov 14, 2023
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Hiroaki Takahashi
B32 - LAYERED PRODUCTS
Information
Patent Grant
Planar coil element and method for producing planar coil element
Patent number
11,785,724
Issue date
Oct 10, 2023
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Hiroshi Ueda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper foil with carrier
Patent number
11,765,840
Issue date
Sep 19, 2023
Mitsui Mining & Smelting Co., Ltd.
Rintaro Ishii
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Circuit support structure with integrated isolation circuitry
Patent number
11,716,117
Issue date
Aug 1, 2023
Texas Instruments Incorporated
Michael Lueders
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Triazole silane compound, method for synthesizing said compound and...
Patent number
11,680,076
Issue date
Jun 20, 2023
Shikoku Chemicals Corporation
Takayuki Murai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board automated layup system
Patent number
11,653,484
Issue date
May 16, 2023
Raytheon Company
Mikhail Pevzner
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Component carrier and method of manufacturing the same
Patent number
11,622,443
Issue date
Apr 4, 2023
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Artan Baftiri
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for forming channels in printed circuit boards by stacking s...
Patent number
11,606,865
Issue date
Mar 14, 2023
Raytheon Company
Mikhail Pevzner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring body and method for manufacturing same
Patent number
11,564,313
Issue date
Jan 24, 2023
Nippon Mektron, Ltd.
Fumihiko Matsuda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing circuit board with heat dissipation function
Patent number
11,553,602
Issue date
Jan 10, 2023
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
Yin-Ju Chen
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Electronic device
Patent number
11,553,591
Issue date
Jan 10, 2023
Gio Optoelectronics Corp.
Chin-Tang Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of processing wiring substrate
Patent number
11,510,320
Issue date
Nov 22, 2022
Ulvac, Inc.
Muneyuki Sato
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer wiring board and probe card including same
Patent number
11,497,126
Issue date
Nov 8, 2022
POINT ENGINEERING CO., LTD.
Bum Mo Ahn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Radio frequency filtering of printed wiring board direct current di...
Patent number
11,452,202
Issue date
Sep 20, 2022
Raytheon Company
John W. Hauff
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing multilayer printed wiring board
Patent number
11,452,216
Issue date
Sep 20, 2022
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Kazuki Matsumura
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Printed circuit board
Patent number
11,439,022
Issue date
Sep 6, 2022
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Young Il Cho
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and method of manufacturing the same
Patent number
11,430,725
Issue date
Aug 30, 2022
Shinko Electric Industries Co., Ltd.
Noriyoshi Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interlayer insulating film and method for producing same
Patent number
11,432,400
Issue date
Aug 30, 2022
SHOWA DENKO MATERIALS CO., LTD.
Masaharu Matsuura
B32 - LAYERED PRODUCTS
Information
Patent Grant
Method for producing wiring substrate
Patent number
11,425,823
Issue date
Aug 23, 2022
Toyota Jidosha Kabushiki Kaisha
Haruki Kondoh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATE...
Publication number
20240120964
Publication date
Apr 11, 2024
TEXAS INSTRUMENTS INCORPORATED
Giacomo Calabrese
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240114619
Publication date
Apr 4, 2024
InnoLux Corporation
Cheng-Chi WANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING SUBSTRATE
Publication number
20240114629
Publication date
Apr 4, 2024
Kensuke MATSUHASHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
Publication number
20240080994
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
Gun Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240064911
Publication date
Feb 22, 2024
SAMSUNG DISPLAY CO., LTD.
JEONGJIN PARK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240023251
Publication date
Jan 18, 2024
Unimicron Technology Corp.
Shao-Chien LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING METHOD OF MEMBRANE CIRCUIT BOARD
Publication number
20240015892
Publication date
Jan 11, 2024
Primax Electronics Ltd.
Yi-Te Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LITHOGRAPHIC STRAIN GAUGE IN AN ELECTRICALLY CONDUCTING SUBSTRATE
Publication number
20230417609
Publication date
Dec 28, 2023
Microsoft Technology Licensing, LLC
Luke Thomas GREGORY
G01 - MEASURING TESTING
Information
Patent Application
WIRING CIRCUIT BOARD
Publication number
20230422397
Publication date
Dec 28, 2023
Nitto Denko Corporation
Takahiro IKEDA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
Publication number
20230413431
Publication date
Dec 21, 2023
Nitto Denko Corporation
Takahiro IKEDA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING SUBSTRATE
Publication number
20230380055
Publication date
Nov 23, 2023
IBIDEN CO., LTD.
Masataka KATO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT, PRINTED CIRCUIT, AND METHOD OF M...
Publication number
20230371176
Publication date
Nov 16, 2023
Sumitomo Electric Industries, Ltd.
Takuto HIDANI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT SUPPORT STRUCTURE WITH INTEGRATED ISOLATION CIRCUITRY
Publication number
20230344467
Publication date
Oct 26, 2023
TEXAS INSTRUMENTS INCORPORATED
Michael Lueders
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
PRINTED WIRING BOARD
Publication number
20230319986
Publication date
Oct 5, 2023
IBIDEN CO., LTD.
Susumu KAGOHASHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
Publication number
20230284394
Publication date
Sep 7, 2023
Nitto Denko Corporation
Naoki SHIBATA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD STRUCTURE FOR DISPLAY DEVICE
Publication number
20230276580
Publication date
Aug 31, 2023
AUO Corporation
Chi-Sheng Liao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230240023
Publication date
Jul 27, 2023
Unimicron Technology Corp.
Wen-Yu Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING S...
Publication number
20230209728
Publication date
Jun 29, 2023
Raytheon Company
Mikhail Pevzner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING APPARATUS
Publication number
20230114747
Publication date
Apr 13, 2023
HAESUNG DS CO., LTD.
Sang Min LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Forming Resistance on Circuit Board and Circuit Board Ha...
Publication number
20230093870
Publication date
Mar 30, 2023
Unimicron Technology Corporation
Chin-Sheng Wang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
Publication number
20230083007
Publication date
Mar 16, 2023
InnoLux Corporation
Jia Sin Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLEXIBLE DEVICES INCORPORATING ELECTRONICALLY-CONDUCTIVE LAYERS, IN...
Publication number
20230078471
Publication date
Mar 16, 2023
THE UNIVERSITY COURT OF THE UNIVERSITY OF EDINBURGH
Philip James Walton HANDS
G01 - MEASURING TESTING
Information
Patent Application
STUD BUMPED PRINTED CIRCUIT ASSEMBLY
Publication number
20230041747
Publication date
Feb 9, 2023
James Rathburn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-LAYER CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD FOR M...
Publication number
20220418101
Publication date
Dec 29, 2022
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
CHENG-JIA LI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION
Publication number
20220377913
Publication date
Nov 24, 2022
QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
YIN-JU CHEN
B82 - NANO-TECHNOLOGY
Information
Patent Application
INTERPOSER AND ELECTRONIC DEVICE INCLUDING INTERPOSER
Publication number
20220352120
Publication date
Nov 3, 2022
Samsung Electronics Co., Ltd.
Eunseok HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Component Carrier
Publication number
20220346229
Publication date
Oct 27, 2022
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abderrazzaq IFIS
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
Publication number
20220276558
Publication date
Sep 1, 2022
Showa Denko Materials Co., Ltd.
Kohei ABE
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220264751
Publication date
Aug 18, 2022
SAMSUNG DISPLAY CO., LTD.
JEONGJIN PARK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220240378
Publication date
Jul 28, 2022
FUJI CORPORATION
Tasuku TAKEUCHI
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