Additional layers associated with aluminium layers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/53223Additional layers associated with aluminium layers

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with redistribution structure
- Patent number 12,211,831
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nanocrystalline graphene
- Patent number 12,211,744
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 12,199,038
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring layer and manufacturing method therefor
- Patent number 12,183,747
- Issue date Dec 31, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yutaka Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,558
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Naoya Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pit-less chemical mechanical planarization process and device struc...
- Patent number 12,131,915
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Atomic layer deposition of barrier metal layer for electrode of gal...
- Patent number 12,112,983
- Issue date Oct 8, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy E. Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ CMP self-assembled monolayer for enhancing metal-dielectric...
- Patent number 12,107,004
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having deep metal line and method for formi...
- Patent number 12,094,816
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 12,062,614
- Issue date Aug 13, 2024
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Integrated circuit device and method for forming the same
- Patent number 12,062,540
- Issue date Aug 13, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
- Ya-Ting Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having porous region embedded structure and me...
- Patent number 12,054,838
- Issue date Aug 6, 2024
- Murata Manufacturing Co., Ltd.
- Frédéric Voiron
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device structure with stacked conductive plugs and me...
- Patent number 12,051,644
- Issue date Jul 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having conductive pad structures with multi-b...
- Patent number 12,051,659
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a barrier layer along the sidewall of...
- Patent number 12,046,551
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure
- Patent number 12,040,364
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsueh-Wen Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,033,889
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and fabrication method thereof
- Patent number 12,027,463
- Issue date Jul 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a conductive pillar and methods of man...
- Patent number 12,027,495
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Kun Sil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials, 3D semiconductor packages and methods...
- Patent number 12,021,008
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 12,020,981
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a contact structure
- Patent number 11,996,361
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including aluminum alloy word lines...
- Patent number 11,990,413
- Issue date May 21, 2024
- SanDisk Technologies LLC
- Linghan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,980,018
- Issue date May 7, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yu-Cheng Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor package transmission lines with mic...
- Patent number 11,978,712
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile memory device and method for fabricating the same
- Patent number 11,963,357
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250038049
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and forming method thereof
- Publication number 20250015023
- Publication date Jan 9, 2025
- UNITED MICROELECTRONICS CORP.
- Chiu-Jung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006639
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yuan KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION OF BARRIER METAL LAYER FOR ELECTRODE OF GAL...
- Publication number 20240420995
- Publication date Dec 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy E. Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH
- Publication number 20240421069
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387166
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT STRUCTURE
- Publication number 20240387261
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387165
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...
- Publication number 20240379379
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...
- Publication number 20240379537
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240371683
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240371684
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240355622
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ting CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240339395
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Byungchul KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA STRUCTURES AND METHODS
- Publication number 20240339396
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE
- Publication number 20240332065
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Hong You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...
- Publication number 20240332168
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240312835
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM STRUCTURES
- Publication number 20240304551
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20240297074
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Forming the Same
- Publication number 20240282569
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE IN SEMICONDUCTOR STRUCTURE AND METHOD FOR FORM...
- Publication number 20240266279
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR METAL LINE, METAL LINE IN SEMICONDUCTOR DEVICE AND MET...
- Publication number 20240266291
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Eunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20240243009
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240244818
- Publication date Jul 18, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yu-Cheng Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...
- Publication number 20240203786
- Publication date Jun 20, 2024
- Tahoe Research, Ltd.
- Hui Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR METAL LINE IN SEMICONDUCTOR DEVICE, METAL LINE IN SEMI...
- Publication number 20240194604
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Eunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS

Additional layers associated with aluminium layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with redistribution structure

Method of forming nanocrystalline graphene

Semiconductor devices and methods of fabricating the same

Semiconductor device

Wiring layer and manufacturing method therefor

Semiconductor device

Pit-less chemical mechanical planarization process and device struc...

Atomic layer deposition of barrier metal layer for electrode of gal...

In-situ CMP self-assembled monolayer for enhancing metal-dielectric...

Semiconductor structure having deep metal line and method for formi...

Semiconductor package having routable encapsulated conductive subst...

Low resistance contacts including intermetallic alloy of nickel, pl...

Integrated circuit device and method for forming the same

Semiconductor device having porous region embedded structure and me...

Semiconductor device structure with stacked conductive plugs and me...

Semiconductor devices having conductive pad structures with multi-b...

Interconnect structure having a barrier layer along the sidewall of...

Semiconductor device structure

Semiconductor device structure and methods of forming the same

Memory device and fabrication method thereof

Semiconductor devices having a conductive pillar and methods of man...

Thermal interface materials, 3D semiconductor packages and methods...

Conductive feature formation and structure

Semiconductor devices including through-silicon-vias and methods of...

Method of making a contact structure

Three-dimensional memory device including aluminum alloy word lines...

Semiconductor device and method of fabricating the same

Method of forming semiconductor package transmission lines with mic...

Self-aligned barrier for metal vias

Nonvolatile memory device and method for fabricating the same

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor structure and forming method thereof

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ATOMIC LAYER DEPOSITION OF BARRIER METAL LAYER FOR ELECTRODE OF GAL...

TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

GATE CONTACT STRUCTURE

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...

SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

SELF-ALIGNED VIA STRUCTURES AND METHODS

INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

ALUMINUM STRUCTURES

Conductive Feature Formation and Structure

Semiconductor Device and Methods of Forming the Same

CONDUCTIVE STRUCTURE IN SEMICONDUCTOR STRUCTURE AND METHOD FOR FORM...

MATERIAL FOR METAL LINE, METAL LINE IN SEMICONDUCTOR DEVICE AND MET...

SELF-ALIGNED BARRIER FOR METAL VIAS

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND...

MATERIAL FOR METAL LINE IN SEMICONDUCTOR DEVICE, METAL LINE IN SEMI...