Additional layers associated with aluminium layers

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H01L23/53223

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/53223Additional layers associated with aluminium layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing methods thereof
- Patent number 12,327,792
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure without barrier layer on bottom surface of via
- Patent number 12,308,282
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tz-Jun Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interconnection structure including...
- Patent number 12,308,311
- Issue date May 20, 2025
- SK hynix Inc.
- Won Tae Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,308,317
- Issue date May 20, 2025
- SK Hynix Inc.
- Se Ra Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned conductive features
- Patent number 12,300,600
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of forming a porous low-k structure
- Patent number 12,300,486
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing for integrated circuit devices and assemblies
- Patent number 12,278,229
- Issue date Apr 15, 2025
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,272,597
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated inductor with inductor wire formed in an integrated circ...
- Patent number 12,272,639
- Issue date Apr 8, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,261,117
- Issue date Mar 25, 2025
- Fuji Electric Co., Ltd.
- Masaharu Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,237,342
- Issue date Feb 25, 2025
- Japan Display Inc.
- Akihiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution str...
- Patent number 12,237,318
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact structure
- Patent number 12,237,261
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 12,230,574
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure
- Patent number 12,211,831
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nanocrystalline graphene
- Patent number 12,211,744
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 12,199,038
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring layer and manufacturing method therefor
- Patent number 12,183,747
- Issue date Dec 31, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yutaka Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,558
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Naoya Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pit-less chemical mechanical planarization process and device struc...
- Patent number 12,131,915
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Atomic layer deposition of barrier metal layer for electrode of gal...
- Patent number 12,112,983
- Issue date Oct 8, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy E. Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ CMP self-assembled monolayer for enhancing metal-dielectric...
- Patent number 12,107,004
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having deep metal line and method for formi...
- Patent number 12,094,816
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 12,062,614
- Issue date Aug 13, 2024
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Integrated circuit device and method for forming the same
- Patent number 12,062,540
- Issue date Aug 13, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
- Ya-Ting Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having porous region embedded structure and me...
- Patent number 12,054,838
- Issue date Aug 6, 2024
- Murata Manufacturing Co., Ltd.
- Frédéric Voiron
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device structure with stacked conductive plugs and me...
- Patent number 12,051,644
- Issue date Jul 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having conductive pad structures with multi-b...
- Patent number 12,051,659
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsun Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE HAVING A BRASABLE METAL PAD COVER AND ASSOCIATED...
- Publication number 20250183174
- Publication date Jun 5, 2025
- STMicroelectronics International N.V.
- Michele MOLGG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE
- Publication number 20250183161
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132200
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring Layer And Manufacturing Method Therefor
- Publication number 20250126897
- Publication date Apr 17, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Yutaka Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250112088
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20250054866
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Keun Wook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250038049
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and forming method thereof
- Publication number 20250015023
- Publication date Jan 9, 2025
- UNITED MICROELECTRONICS CORP.
- Chiu-Jung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006639
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yuan KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION OF BARRIER METAL LAYER FOR ELECTRODE OF GAL...
- Publication number 20240420995
- Publication date Dec 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy E. Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH
- Publication number 20240421069
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387166
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT STRUCTURE
- Publication number 20240387261
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387165
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...
- Publication number 20240379379
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...
- Publication number 20240379537
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240371683
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240371684
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240355622
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Ting CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240339395
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Byungchul KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VIA STRUCTURES AND METHODS
- Publication number 20240339396
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE
- Publication number 20240332065
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Hong You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...
- Publication number 20240332168
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240312835
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM STRUCTURES
- Publication number 20240304551
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20240297074
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS

Additional layers associated with aluminium layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing methods thereof

Interconnect structure without barrier layer on bottom surface of via

Semiconductor device including interconnection structure including...

Semiconductor device and method for fabricating the same

Semiconductor device with self-aligned conductive features

System and method of forming a porous low-k structure

Hybrid manufacturing for integrated circuit devices and assemblies

Semiconductor interconnection structures and methods of forming the...

Integrated inductor with inductor wire formed in an integrated circ...

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing semiconductor device

Method for fabricating semiconductor device with redistribution str...

Semiconductor device having a contact structure

Reducing RC delay in semiconductor devices

Semiconductor device with redistribution structure

Method of forming nanocrystalline graphene

Semiconductor devices and methods of fabricating the same

Semiconductor device

Wiring layer and manufacturing method therefor

Semiconductor device

Pit-less chemical mechanical planarization process and device struc...

Atomic layer deposition of barrier metal layer for electrode of gal...

In-situ CMP self-assembled monolayer for enhancing metal-dielectric...

Semiconductor structure having deep metal line and method for formi...

Semiconductor package having routable encapsulated conductive subst...

Low resistance contacts including intermetallic alloy of nickel, pl...

Integrated circuit device and method for forming the same

Semiconductor device having porous region embedded structure and me...

Semiconductor device structure with stacked conductive plugs and me...

Semiconductor devices having conductive pad structures with multi-b...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE HAVING A BRASABLE METAL PAD COVER AND ASSOCIATED...

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Wiring Layer And Manufacturing Method Therefor

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor structure and forming method thereof

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ATOMIC LAYER DEPOSITION OF BARRIER METAL LAYER FOR ELECTRODE OF GAL...

TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

GATE CONTACT STRUCTURE

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...

SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE

SELF-ALIGNED VIA STRUCTURES AND METHODS

INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

ALUMINUM STRUCTURES

Conductive Feature Formation and Structure