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Additional layers associated with aluminium layers
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Self-aligned barrier for metal vias
Patent number
11,972,974
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Sung-Li Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Nonvolatile memory device and method for fabricating the same
Patent number
11,963,357
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Kohji Kanamori
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device including a porous dielectric layer, and metho...
Patent number
11,955,424
Issue date
Apr 9, 2024
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods and apparatus for forming dual metal interconnects
Patent number
11,948,885
Issue date
Apr 2, 2024
Applied Materials, Inc.
Suketu A Parikh
H01 - BASIC ELECTRIC ELEMENTS
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Baseplate for a semiconductor module and method for producing a bas...
Patent number
11,935,811
Issue date
Mar 19, 2024
Infineon Technologies AG
Arthur Unrau
H01 - BASIC ELECTRIC ELEMENTS
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Halogen treatment for NMOS contact resistance improvement
Patent number
11,923,290
Issue date
Mar 5, 2024
Intel Corporation
Siddharth Chouksey
H01 - BASIC ELECTRIC ELEMENTS
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Composite interconnect formation using graphene
Patent number
11,908,734
Issue date
Feb 20, 2024
International Business Machines Corporation
Takeshi Nogami
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selective formation of conductor nanowires
Patent number
11,908,789
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chao-Hsien Peng
H01 - BASIC ELECTRIC ELEMENTS
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Dielectric film for semiconductor fabrication
Patent number
11,901,295
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Wiring layer and manufacturing method therefor
Patent number
11,901,372
Issue date
Feb 13, 2024
Semiconductor Energy Laboratory Co., Ltd.
Yutaka Okazaki
H01 - BASIC ELECTRIC ELEMENTS
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Three-dimensional memory device containing amorphous and crystallin...
Patent number
11,894,298
Issue date
Feb 6, 2024
SanDisk Technologies LLC
Masanori Tsutsumi
H01 - BASIC ELECTRIC ELEMENTS
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Low resistance contacts including intermetallic alloy of nickel, pl...
Patent number
11,862,567
Issue date
Jan 2, 2024
International Business Machines Corporation
John Bruley
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method for manufacturing semiconductor device
Patent number
11,855,103
Issue date
Dec 26, 2023
Japan Display Inc.
Akihiro Hanada
H01 - BASIC ELECTRIC ELEMENTS
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Thin film resistor with punch-through vias
Patent number
11,848,268
Issue date
Dec 19, 2023
Texas Instruments Incorporated
Dhishan Kande
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method for forming a semiconductor device
Patent number
11,842,938
Issue date
Dec 12, 2023
Infineon Technologies AG
Jens Peter Konrath
H01 - BASIC ELECTRIC ELEMENTS
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Interconnects having a portion without a liner material and related...
Patent number
11,837,542
Issue date
Dec 5, 2023
Intel Corporation
Manish Chandhok
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure and method making the same
Patent number
11,830,808
Issue date
Nov 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with redistribution structure and method for f...
Patent number
11,830,865
Issue date
Nov 28, 2023
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
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Method for fabricating semiconductor device with plug structure
Patent number
11,823,984
Issue date
Nov 21, 2023
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
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Hybrid manufacturing for integrated circuit devices and assemblies
Patent number
11,817,442
Issue date
Nov 14, 2023
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
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Stacked substrate structure with inter-tier interconnection
Patent number
11,817,470
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
Patent number
11,810,881
Issue date
Nov 7, 2023
Rohm Co., Ltd.
Bungo Tanaka
H01 - BASIC ELECTRIC ELEMENTS
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In-situ CMP self-assembled monolayer for enhancing metal-dielectric...
Patent number
11,810,817
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Zhen Yu Guan
H01 - BASIC ELECTRIC ELEMENTS
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Chemical mechanical polishing topography reset and control on inter...
Patent number
11,810,816
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Shih-Kang Fu
H01 - BASIC ELECTRIC ELEMENTS
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Reducing RC delay in semiconductor devices
Patent number
11,804,439
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Gulbagh Singh
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
Patent number
11,804,528
Issue date
Oct 31, 2023
Samsung Electronics Co., Ltd.
Sang Young Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor devices including resistor structures
Patent number
11,804,516
Issue date
Oct 31, 2023
Samsung Electronics Co., Ltd.
Tae-yeol Kim
H01 - BASIC ELECTRIC ELEMENTS
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Conductive feature formation and structure
Patent number
11,798,843
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Yu Shih Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3DIC interconnect apparatus and method
Patent number
11,798,916
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated module with electromagnetic shielding
Patent number
11,784,136
Issue date
Oct 10, 2023
Qorvo US, Inc.
Mohsen Haji-Rahim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
Publication number
20240113024
Publication date
Apr 4, 2024
International Business Machines Corporation
Ching-Tzu Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MAT...
Publication number
20240113028
Publication date
Apr 4, 2024
Samsung Electronics Co., Ltd.
Yeonchoo CHO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH MULTILAYER METAL LINE
Publication number
20240105588
Publication date
Mar 28, 2024
Intel Corporation
Ilya V. Karpov
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240088166
Publication date
Mar 14, 2024
Japan Display Inc.
Akihiro HANADA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME
Publication number
20240088025
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20240079255
Publication date
Mar 7, 2024
United Semiconductor (Xiamen) Co., Ltd.
Ji He Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Barrier-Less Jumper Structure for Line-to-Line Connections
Publication number
20240071920
Publication date
Feb 29, 2024
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240071923
Publication date
Feb 29, 2024
Samsung Electronics Co., Ltd.
Minjun SONG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...
Publication number
20240047448
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STR...
Publication number
20240047447
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...
Publication number
20240038661
Publication date
Feb 1, 2024
Intel Corporation
Manish Chandhok
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
Publication number
20240030213
Publication date
Jan 25, 2024
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
STACKED SUBSTRATE STRUCTURE WITH INTER-TIER INTERCONNECTION
Publication number
20240021645
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jeng-Shyan Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
Publication number
20240014133
Publication date
Jan 11, 2024
International Business Machines Corporation
Benjamin D. Briggs
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240014159
Publication date
Jan 11, 2024
Rohm Co., Ltd.
Bungo TANAKA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
COMPOSITE BARRIER LAYERS
Publication number
20240006235
Publication date
Jan 4, 2024
Applied Materials, Inc.
Jiajie Cen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CONDUCTIVE STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20230395429
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kan-Ju LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Performing Chemical-Mechanical Polishing Process in Semi...
Publication number
20230386910
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Shih-Kang Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3DIC Interconnect Apparatus and Method
Publication number
20230378139
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC...
Publication number
20230377959
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Zhen Yu GUAN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Conductive Feature Formation and Structure
Publication number
20230369109
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu Shih Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
VIA LANDING ON FIRST AND SECOND BARRIER LAYERS TO REDUCE CLEANING T...
Publication number
20230361024
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Te-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
Publication number
20230361023
Publication date
Nov 9, 2023
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTERCONNECT STRUCTURE INCLUDING SINGLE LAYER SERVING AS BOTH BARRI...
Publication number
20230352409
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Pei LU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METALLIZATION IN INTEGRATED CIRCUITS
Publication number
20230352311
Publication date
Nov 2, 2023
TEXAS INSTRUMENTS INCORPORATED
Frances Ooi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FILM SCHEME TO REDUCE PLASMA-INDUCED DAMAGE
Publication number
20230343642
Publication date
Oct 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wen Zhong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
Publication number
20230343707
Publication date
Oct 26, 2023
Samsung Electronics Co., Ltd.
Wonhyuk Hong
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...
Publication number
20230298903
Publication date
Sep 21, 2023
Taiwan Semiconductor Manufacturing Company Limited
Jheng-Hong JIANG
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
PUNCH-THROUGH INTERCONNECT FEATURE TO COUPLE UPPER ELECTRODES OF CA...
Publication number
20230290722
Publication date
Sep 14, 2023
Intel Corporation
Travis W. Lajoie
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
Publication number
20230282570
Publication date
Sep 7, 2023
Semiconductor Manufacturing International (Shanghai) Corporation
Jisong JIN
H01 - BASIC ELECTRIC ELEMENTS