Additional layers associated with copper layers

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H01L23/53238

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53238Additional layers associated with copper layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 12,225,740
- Issue date Feb 11, 2025
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced lithography and self-assembled devices
- Patent number 12,218,052
- Issue date Feb 4, 2025
- Intel Corporation
- Richard E. Schenker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking semiconductor assemblies and methods of...
- Patent number 12,218,101
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal liner for interconnect structures
- Patent number 12,211,743
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure
- Patent number 12,211,831
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nanocrystalline graphene
- Patent number 12,211,744
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuits and methods for forming thin film crystal layers
- Patent number 12,211,794
- Issue date Jan 28, 2025
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing recessed gate structure with protection layer
- Patent number 12,211,905
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,211,740
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 12,205,887
- Issue date Jan 21, 2025
- Kioxia Corporation
- Masayuki Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection lines with different li...
- Patent number 12,199,042
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier collar for interconnects
- Patent number 12,198,981
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 12,199,038
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multi-layer etch stop structure
- Patent number 12,198,979
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure of electronic device
- Patent number 12,191,197
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ching-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method for manufacturing the same
- Patent number 12,183,628
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for copper doped hybrid metallization for line and via
- Patent number 12,183,631
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Suketu Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PVD target design and semiconductor devices formed using the same
- Patent number 12,180,576
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hsi Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring layer and manufacturing method therefor
- Patent number 12,183,747
- Issue date Dec 31, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yutaka Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect structure having cap layer with different thickn...
- Patent number 12,183,626
- Issue date Dec 31, 2024
- United Microelectronics Corp.
- Yi-How Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a transition metal containing film on a substrate...
- Patent number 12,173,402
- Issue date Dec 24, 2024
- ASM IP Holding B.V.
- Timo Hatanpää
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,176,267
- Issue date Dec 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structure having a barrier layer
- Patent number 12,165,975
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20250054866
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Keun Wook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACT
- Publication number 20250054858
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Kai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250054870
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- WOONCHUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS
- Publication number 20250054887
- Publication date Feb 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Guy BRIZAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE
- Publication number 20250046716
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL ETCH RATES OF COPPER FEATURES
- Publication number 20250046654
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PATTERNING WITH COLORED BLOCKING AND STRUCTURES RESULT...
- Publication number 20250046713
- Publication date Feb 6, 2025
- Intel Corporation
- Mohit K. HARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TRANSISTOR LOCAL INTERCONNECTS
- Publication number 20250038111
- Publication date Jan 30, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Mahbub Rashed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250038049
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE
- Publication number 20250029873
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE EDGE PROTECTION FOR SEMICONDUCTOR DEVICE ASSEMBLI...
- Publication number 20250015000
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...
- Publication number 20250014998
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- JUNGHOO SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-STEP VIA-LAST PROCESS FOR MULTI-STACK WAFERS
- Publication number 20250015047
- Publication date Jan 9, 2025
- QUALCOMM Incorporated
- Mustafa BADAROGLU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...
- Publication number 20250003067
- Publication date Jan 2, 2025
- Soulbrain Co., LTD
- Jae Sun JUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006639
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yuan KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINES HAVING CONDUCTIVE METAL LINER FOR ADVANCED INTEGRA...
- Publication number 20250006628
- Publication date Jan 2, 2025
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER FOR INTERCONNECTS
- Publication number 20240429094
- Publication date Dec 26, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20240429189
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240421066
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH
- Publication number 20240421069
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240413010
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THEREOF
- Publication number 20240413014
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20240413087
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS

Additional layers associated with copper layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual metal silicide structures for advanced integrated circuit stru...

Method of forming an integrated circuit device having an etch-stop...

Advanced lithography and self-assembled devices

Three-dimensional stacking semiconductor assemblies and methods of...

Method of forming a metal liner for interconnect structures

Semiconductor device with redistribution structure

Method of forming nanocrystalline graphene

Integrated circuits and methods for forming thin film crystal layers

Method for preparing recessed gate structure with protection layer

Interconnect structure and methods of forming the same

Semiconductor packages and methods of forming the same

Semiconductor device and method for manufacturing the semiconductor...

Semiconductor device and a manufacturing method thereof

Semiconductor device having interconnection lines with different li...

Diffusion barrier collar for interconnects

Gate line plug structures for advanced integrated circuit structure...

Semiconductor devices and methods of fabricating the same

Semiconductor device with multi-layer etch stop structure

Plugs for interconnect lines for advanced integrated circuit struct...

Manufacturing method of package structure of electronic device

Integrated circuit and method for manufacturing the same

Methods for copper doped hybrid metallization for line and via

PVD target design and semiconductor devices formed using the same

Semiconductor device

Wiring layer and manufacturing method therefor

Metal interconnect structure having cap layer with different thickn...

Method of forming a transition metal containing film on a substrate...

Semiconductor device and method for manufacturing the same

Selective passivation and selective deposition

Method of forming interconnect structure having a barrier layer

Patents Applicationslast 30 patents

FORMING LARGE CHIPS THROUGH STITCHING

INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACT

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS

MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE

DIFFERENTIAL ETCH RATES OF COPPER FEATURES

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SELF-ALIGNED PATTERNING WITH COLORED BLOCKING AND STRUCTURES RESULT...

SEMICONDUCTOR DEVICE WITH TRANSISTOR LOCAL INTERCONNECTS

INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

SEMICONDUCTOR DIE EDGE PROTECTION FOR SEMICONDUCTOR DEVICE ASSEMBLI...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

SINGLE-STEP VIA-LAST PROCESS FOR MULTI-STACK WAFERS

FILM QUALITY IMPROVER, METHOD OF FORMING THIN FILM USING FILM QUALI...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE LINES HAVING CONDUCTIVE METAL LINER FOR ADVANCED INTEGRA...

DIFFUSION BARRIER FOR INTERCONNECTS

SEMICONDUCTOR PACKAGE DEVICE

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME

TIGHT PITCH DIRECTIONAL SELECTIVE VIA GROWTH

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

Interconnect Structure and Method of Forming Thereof