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Additional layers associated with copper layers
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Semiconductor devices and methods for manufacturing the same
Patent number
11,967,554
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Jongjin Lee
H01 - BASIC ELECTRIC ELEMENTS
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Dual metal silicide structures for advanced integrated circuit stru...
Patent number
11,961,767
Issue date
Apr 16, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
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Dual metal gate structure having portions of metal gate layers in c...
Patent number
11,955,532
Issue date
Apr 9, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device including a porous dielectric layer, and metho...
Patent number
11,955,424
Issue date
Apr 9, 2024
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
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Heterogeneous metal line compositions for advanced integrated circu...
Patent number
11,955,534
Issue date
Apr 9, 2024
Intel Corporation
Andrew W. Yeoh
H01 - BASIC ELECTRIC ELEMENTS
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Etch damage and ESL free dual damascene metal interconnect
Patent number
11,955,376
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sunil Kumar Singh
H01 - BASIC ELECTRIC ELEMENTS
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Methods and apparatus for forming dual metal interconnects
Patent number
11,948,885
Issue date
Apr 2, 2024
Applied Materials, Inc.
Suketu A Parikh
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
11,948,887
Issue date
Apr 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Ki Yeul Yang
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Etch barrier for microelectronic packaging conductive structures
Patent number
11,948,898
Issue date
Apr 2, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
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Trench contact structures for advanced integrated circuit structure...
Patent number
11,948,997
Issue date
Apr 2, 2024
Intel Corporation
Subhash M. Joshi
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of fabricating the same
Patent number
11,942,427
Issue date
Mar 26, 2024
Samsung Electronics Co., Ltd.
Seung Yong Yoo
H01 - BASIC ELECTRIC ELEMENTS
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Etch stop layer in integrated circuits
Patent number
11,942,419
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shiu-Ko JangJian
H01 - BASIC ELECTRIC ELEMENTS
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Method of forming graphene barrier layer in interconnect structure
Patent number
11,929,326
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shin-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
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Integrated fan-out packages and methods of forming the same
Patent number
11,929,319
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
Patent number
11,929,366
Issue date
Mar 12, 2024
Samsung Electronics Co., Ltd.
Sunyoung Noh
H01 - BASIC ELECTRIC ELEMENTS
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Electro-migration barrier for interconnect
Patent number
11,923,304
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Su-Jen Sung
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
Patent number
11,923,279
Issue date
Mar 5, 2024
Sony Group Corporation
Nobutoshi Fujii
H01 - BASIC ELECTRIC ELEMENTS
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Interconnect structure having a carbon-containing barrier layer
Patent number
11,908,697
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company
Rueijer Lin
H01 - BASIC ELECTRIC ELEMENTS
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Composite interconnect formation using graphene
Patent number
11,908,734
Issue date
Feb 20, 2024
International Business Machines Corporation
Takeshi Nogami
H01 - BASIC ELECTRIC ELEMENTS
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Selective formation of conductor nanowires
Patent number
11,908,789
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chao-Hsien Peng
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Display device
Patent number
11,908,813
Issue date
Feb 20, 2024
Innolux Corporation
Tsung-Lun Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Dielectric film for semiconductor fabrication
Patent number
11,901,295
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Wiring layer and manufacturing method therefor
Patent number
11,901,372
Issue date
Feb 13, 2024
Semiconductor Energy Laboratory Co., Ltd.
Yutaka Okazaki
H01 - BASIC ELECTRIC ELEMENTS
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Metal capping layer and methods thereof
Patent number
11,894,266
Issue date
Feb 6, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shao-Kuan Lee
H01 - BASIC ELECTRIC ELEMENTS
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Multi-pass plating process with intermediate rinse and dry
Patent number
11,887,888
Issue date
Jan 30, 2024
Texas Instruments Incorporated
Peter John Holverson
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device having a self-forming barrier layer at via bottom
Patent number
RE49820
Issue date
Jan 30, 2024
GLOBALFOUNDRIES U.S. INC.
Larry Zhao
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Trench plug hardmask for advanced integrated circuit structure fabr...
Patent number
11,887,838
Issue date
Jan 30, 2024
Intel Corporation
Anthony St. Amour
H01 - BASIC ELECTRIC ELEMENTS
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Advanced copper interconnects with hybrid microstructure
Patent number
11,881,433
Issue date
Jan 23, 2024
TESSERA LLC
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
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Fin patterning for advanced integrated circuit structure fabrication
Patent number
11,881,520
Issue date
Jan 23, 2024
Intel Corporation
Curtis Ward
H01 - BASIC ELECTRIC ELEMENTS
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Interconnect wires including relatively low resistivity cores
Patent number
11,881,432
Issue date
Jan 23, 2024
Hui Jae Yoo
H01 - BASIC ELECTRIC ELEMENTS
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Silicon Carbide Device and Method for Forming a Silicon Carbide Device
Publication number
20240113026
Publication date
Apr 4, 2024
INFINEON TECHNOLOGIES AG
Edward Fürgut
H01 - BASIC ELECTRIC ELEMENTS
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INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
Publication number
20240112952
Publication date
Apr 4, 2024
Intel Corporation
HUI JAE YOO
H01 - BASIC ELECTRIC ELEMENTS
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TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABR...
Publication number
20240105520
Publication date
Mar 28, 2024
Intel Corporation
Anthony ST. AMOUR
H01 - BASIC ELECTRIC ELEMENTS
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DIELECTRIC PLUGS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
Publication number
20240105597
Publication date
Mar 28, 2024
Intel Corporation
Leonard P. GULER
H01 - BASIC ELECTRIC ELEMENTS
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INTERCONNECT WITH DISCONNECTED LINER AND METAL CAP
Publication number
20240105620
Publication date
Mar 28, 2024
International Business Machines Corporation
Koichi Motoyama
H01 - BASIC ELECTRIC ELEMENTS
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DIFFERENTIATED CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STR...
Publication number
20240105598
Publication date
Mar 28, 2024
Intel Corporation
Leonard P. GULER
H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT DEVICE
Publication number
20240096796
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
Yongjin KIM
H01 - BASIC ELECTRIC ELEMENTS
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MULTI-LAYER LINE STRUCTURE
Publication number
20240088040
Publication date
Mar 14, 2024
DAI NIPPON PRINTING CO., LTD.
Hiroshi Kudo
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
Publication number
20240088042
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
SHU-WEI LI
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME
Publication number
20240088025
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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Metal Contact Structure and Method of Forming the Same in a Semicon...
Publication number
20240087953
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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APPARATUSES AND METHODS INCLUDING STRUCTURES IN SCRIBE REGIONS OF S...
Publication number
20240079347
Publication date
Mar 7, 2024
Micron Technology, Inc.
FUMIE UCHIDA
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Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
Publication number
20240079270
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Huei-Wen Hsieh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20240079255
Publication date
Mar 7, 2024
United Semiconductor (Xiamen) Co., Ltd.
Ji He Huang
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE WITH MULTI-LAYER ETCH STOP STRUCTURE
Publication number
20240079267
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Cheng SHIH
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LOW RESISTANCE INTERCONNECT FEATURES AND METHOD FOR MANUFACTURING T...
Publication number
20240071822
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Lung CHUNG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SKIP VIA WITH LOCALIZED SPACER
Publication number
20240071904
Publication date
Feb 29, 2024
International Business Machines Corporation
Chanro Park
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ADVANCED LITHOGRAPHY AND SELF-ASSEMBLED DEVICES
Publication number
20240071917
Publication date
Feb 29, 2024
Intel Corporation
Richard E. SCHENKER
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240071928
Publication date
Feb 29, 2024
KIOXIA Corporation
Akira NAKAJIMA
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240071908
Publication date
Feb 29, 2024
Rohm Co., Ltd.
Shoji TAKEI
H01 - BASIC ELECTRIC ELEMENTS
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INVERTER
Publication number
20240063084
Publication date
Feb 22, 2024
Tesla, Inc.
Wenjun Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240055352
Publication date
Feb 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cian-Yu CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...
Publication number
20240047448
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
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INTERCONNECTION STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20240047357
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
Yoonyoung Jeon
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE HAVING FUNNEL-SHAPED INTERCONNECT AND METHOD O...
Publication number
20240047352
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
MIN-CHUNG CHENG
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE WITH WIRE BOND AND METHOD FOR PREPARING THE SAME
Publication number
20240047391
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240047340
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
Publication number
20240047556
Publication date
Feb 8, 2024
Intel Corporation
Andrew W. YEOH
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STR...
Publication number
20240047447
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METAL STRUCTURE HAVING FUNNEL-SHAPED INTERCONNECT AND METHOD OF MAN...
Publication number
20240047350
Publication date
Feb 8, 2024
NANYA TECHNOLOGY CORPORATION
MIN-CHUNG CHENG
H01 - BASIC ELECTRIC ELEMENTS