Additional layers associated with noble-metal layers

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H01L23/53252Additional layers associated with noble-metal layers

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Patents Grantslast 30 patents

Information Patent Grant
High aspect ratio buried power rail metallization
- Patent number 12,148,699
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 12,142,520
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component with a dielectric passivation stack
- Patent number 12,125,745
- Issue date Oct 22, 2024
- General Electric Company
- Cheng-Po Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low capacitance through substrate via structures
- Patent number 12,112,995
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Deepak C. Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ CMP self-assembled monolayer for enhancing metal-dielectric...
- Patent number 12,107,004
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure with double conductors
- Patent number 12,087,685
- Issue date Sep 10, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less structures
- Patent number 12,080,593
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 12,062,614
- Issue date Aug 13, 2024
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Top via interconnects without barrier metal between via and above line
- Patent number 12,057,395
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with stacked conductive plugs and me...
- Patent number 12,051,644
- Issue date Jul 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated top via interconnects
- Patent number 12,040,230
- Issue date Jul 16, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure
- Patent number 12,040,364
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsueh-Wen Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,033,889
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures
- Patent number 12,027,415
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and fabrication method thereof
- Patent number 12,027,463
- Issue date Jul 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 12,020,981
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a graphene film and method for fabricat...
- Patent number 12,014,988
- Issue date Jun 18, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- Jang Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL alternative metal interconnects: integration and process
- Patent number 11,990,414
- Issue date May 21, 2024
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and electronic device employing the same
- Patent number 11,978,704
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Changseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanotwin copper materials in semiconductor devices
- Patent number 11,973,034
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor devices and methods for manufacturing the same
- Patent number 11,967,554
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jongjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
- Patent number 11,967,552
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,929,366
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Sunyoung Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interconnect formation using graphene
- Patent number 11,908,734
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,881,432
- Issue date Jan 23, 2024
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 11,862,567
- Issue date Jan 2, 2024
- International Business Machines Corporation
- John Bruley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,854,979
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Jang Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS
- Publication number 20240395702
- Publication date Nov 28, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379436
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR AN INTERCONNECT STRUCTURE
- Publication number 20240379423
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...
- Publication number 20240332168
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- JUNG-HSING CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA INTERCONNECT
- Publication number 20240321630
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240312835
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20240297074
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Forming the Same
- Publication number 20240282569
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES IN SEMICONDUCTOR FABRICA...
- Publication number 20240274528
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Ming-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND ASSEMBLIES FOR COOLING SEMICONDUCTOR DEVICES USING CARB...
- Publication number 20240258197
- Publication date Aug 1, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES
- Publication number 20240249976
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20240243009
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects with Sidewall Barrier Layer Divot Fill
- Publication number 20240194587
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC SKIP-LEVEL VIA STRUCTURE
- Publication number 20240186177
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
- Publication number 20240113024
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MAT...
- Publication number 20240113028
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Yeonchoo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20240088042
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
- Publication number 20240014133
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SELF-FORMED BARRIER METAL LAYER
- Publication number 20240006233
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Kang FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION
- Publication number 20230402378
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Performing Chemical-Mechanical Polishing Process in Semi...
- Publication number 20230386910
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC...
- Publication number 20230377959
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zhen Yu GUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20230369109
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Middle-Of-Line Interconnect Structure Having Air Gap And Method Of...
- Publication number 20230360966
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partial Barrier Free Vias for Cobalt-Based Interconnects and Method...
- Publication number 20230361042
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20230361023
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING SINGLE LAYER SERVING AS BOTH BARRI...
- Publication number 20230352409
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Pei LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20230343707
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS

Additional layers associated with noble-metal layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High aspect ratio buried power rail metallization

Middle-of-line interconnect structure having air gap and method of...

Electrical component with a dielectric passivation stack

Low capacitance through substrate via structures

In-situ CMP self-assembled monolayer for enhancing metal-dielectric...

Semiconductor interconnect structure with double conductors

Barrier-less structures

Low resistance contacts including intermetallic alloy of nickel, pl...

Top via interconnects without barrier metal between via and above line

Semiconductor device structure with stacked conductive plugs and me...

Encapsulated top via interconnects

Semiconductor device structure

Semiconductor device structure and methods of forming the same

Semiconductor device structures

Memory device and fabrication method thereof

Conductive feature formation and structure

Semiconductor device having a graphene film and method for fabricat...

BEOL alternative metal interconnects: integration and process

Wiring structure and electronic device employing the same

Self-aligned barrier for metal vias

Nanotwin copper materials in semiconductor devices

Semiconductor devices and methods for manufacturing the same

Methods of forming interconnect structures in semiconductor fabrica...

Semiconductor device including a porous dielectric layer, and metho...

Methods and apparatus for forming dual metal interconnects

Semiconductor device

Composite interconnect formation using graphene

Interconnect wires including relatively low resistivity cores

Low resistance contacts including intermetallic alloy of nickel, pl...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS

SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

BARRIER LAYER FOR AN INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE WITH STACKED CONDUCTIVE PLUGS AND ME...

TOP VIA INTERCONNECT

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

Conductive Feature Formation and Structure

Semiconductor Device and Methods of Forming the Same

METHODS OF FORMING INTERCONNECT STRUCTURES IN SEMICONDUCTOR FABRICA...

METHODS AND ASSEMBLIES FOR COOLING SEMICONDUCTOR DEVICES USING CARB...

SEMICONDUCTOR DEVICE STRUCTURES

SELF-ALIGNED BARRIER FOR METAL VIAS

Interconnects with Sidewall Barrier Layer Divot Fill

ASYMMETRIC SKIP-LEVEL VIA STRUCTURE

MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MAT...

SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF

STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...

SEMICONDUCTOR DEVICE INCLUDING A SELF-FORMED BARRIER METAL LAYER

HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION

Methods of Performing Chemical-Mechanical Polishing Process in Semi...

IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC...

Conductive Feature Formation and Structure

Middle-Of-Line Interconnect Structure Having Air Gap And Method Of...

Partial Barrier Free Vias for Cobalt-Based Interconnects and Method...

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

INTERCONNECT STRUCTURE INCLUDING SINGLE LAYER SERVING AS BOTH BARRI...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME