Additional layers associated with noble-metal layers

Industry

CPC
H01L23/53252

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53252Additional layers associated with noble-metal layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanotwin copper materials in semiconductor devices
- Patent number 11,973,034
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor devices and methods for manufacturing the same
- Patent number 11,967,554
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jongjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
- Patent number 11,967,552
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,929,366
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Sunyoung Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interconnect formation using graphene
- Patent number 11,908,734
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,881,432
- Issue date Jan 23, 2024
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 11,862,567
- Issue date Jan 2, 2024
- International Business Machines Corporation
- John Bruley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,854,979
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Jang Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less structures
- Patent number 11,848,190
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ CMP self-assembled monolayer for enhancing metal-dielectric...
- Patent number 11,810,817
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing topography reset and control on inter...
- Patent number 11,810,816
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,804,528
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Sang Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 11,798,843
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated module with electromagnetic shielding
- Patent number 11,784,136
- Issue date Oct 10, 2023
- Qorvo US, Inc.
- Mohsen Haji-Rahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 11,776,910
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via structure and method
- Patent number 11,756,883
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of performing chemical-mechanical polishing process in semi...
- Patent number 11,742,239
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 11,735,476
- Issue date Aug 22, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hailong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device having conductive lines with air gaps therebetwee...
- Patent number 11,735,524
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including via structures having a via portion...
- Patent number 11,728,268
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 11,710,657
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalyst enhanced seamless ruthenium gap fill
- Patent number 11,680,312
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Byunghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier for preventing eutectic break-through in through-substrate...
- Patent number 11,676,860
- Issue date Jun 13, 2023
- MACOM Technology Solutions Holdings, Inc.
- Allen W. Hanson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices
- Patent number 11,651,995
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Sangkuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and electronic device having the same
- Patent number 11,652,051
- Issue date May 16, 2023
- TPK Advanced Solutions Inc.
- Yi-Min Jiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contact structure and electronic device having the same
- Patent number 11,652,052
- Issue date May 16, 2023
- TPK Advanced Solutions Inc.
- Xi-Zhao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device structure
- Patent number 11,626,493
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsueh-Wen Tsau
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
- Publication number 20240113024
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MAT...
- Publication number 20240113028
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Yeonchoo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20240088042
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
- Publication number 20240014133
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SELF-FORMED BARRIER METAL LAYER
- Publication number 20240006233
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Kang FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION
- Publication number 20230402378
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Performing Chemical-Mechanical Polishing Process in Semi...
- Publication number 20230386910
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC...
- Publication number 20230377959
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zhen Yu GUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20230369109
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Middle-Of-Line Interconnect Structure Having Air Gap And Method Of...
- Publication number 20230360966
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Partial Barrier Free Vias for Cobalt-Based Interconnects and Method...
- Publication number 20230361042
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20230361023
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING SINGLE LAYER SERVING AS BOTH BARRI...
- Publication number 20230352409
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Pei LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20230343707
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINES OF HYBRID HEIGHTS
- Publication number 20230275018
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Tien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230246080
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsueh-Wen TSAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICES
- Publication number 20230238330
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Myungho KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20230223334
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTOR AND ELECTRONIC APPARATUS INCLUDING THE SAME
- Publication number 20230207467
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Youngseok PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH STOP LAYER FOR BACKSIDE PROCESSING ARCHITECTURE
- Publication number 20230187273
- Publication date Jun 15, 2023
- Intel Corporation
- Anand Murthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCURATE METAL LINE AND VIA HEIGHT CONTROL FOR TOP VIA PROCESS
- Publication number 20230178429
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection Structure for a Semiconductor Device
- Publication number 20230170255
- Publication date Jun 1, 2023
- IMEC vzw
- Zheng Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230154789
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20230130273
- Publication date Apr 27, 2023
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METHOD FOR FORMING SEMICONDUCTOR INTERCONNECT STRUCTURE
- Publication number 20230118565
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE INTERCONNECT FORMATION USING GRAPHENE
- Publication number 20230106397
- Publication date Apr 6, 2023
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES
- Publication number 20230094979
- Publication date Mar 30, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS FILLING OF VARIABLE ASPECT RATIO SINGLE DAMASCENE CONT...
- Publication number 20230101107
- Publication date Mar 30, 2023
- Intel Corporation
- AKM Shaestagir CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA INTERCONNECTS WITHOUT BARRIER METAL BETWEEN VIA AND ABOVE LINE
- Publication number 20230077760
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS

Additional layers associated with noble-metal layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned barrier for metal vias

Nanotwin copper materials in semiconductor devices

Semiconductor devices and methods for manufacturing the same

Methods of forming interconnect structures in semiconductor fabrica...

Semiconductor device including a porous dielectric layer, and metho...

Methods and apparatus for forming dual metal interconnects

Semiconductor device

Composite interconnect formation using graphene

Interconnect wires including relatively low resistivity cores

Low resistance contacts including intermetallic alloy of nickel, pl...

Semiconductor device

Barrier-less structures

In-situ CMP self-assembled monolayer for enhancing metal-dielectric...

Chemical mechanical polishing topography reset and control on inter...

Semiconductor device

Conductive feature formation and structure

Integrated module with electromagnetic shielding

Partial barrier free vias for cobalt-based interconnects and method...

Through via structure and method

Methods of performing chemical-mechanical polishing process in semi...

Semiconductor structure and fabrication method thereof

Electrical device having conductive lines with air gaps therebetwee...

Semiconductor devices including via structures having a via portion...

Middle-of-line interconnect structure having air gap and method of...

Catalyst enhanced seamless ruthenium gap fill

Barrier for preventing eutectic break-through in through-substrate...

Memory devices

Contact structure and electronic device having the same

Contact structure and electronic device having the same

Semiconductor device structure

Patents Applicationslast 30 patents

MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MAT...

SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF

STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...

SEMICONDUCTOR DEVICE INCLUDING A SELF-FORMED BARRIER METAL LAYER

HIGH ASPECT RATIO BURIED POWER RAIL METALLIZATION

Methods of Performing Chemical-Mechanical Polishing Process in Semi...

IN-SITU CMP SELF-ASSEMBLED MONOLAYER FOR ENHANCING METAL-DIELECTRIC...

Conductive Feature Formation and Structure

Middle-Of-Line Interconnect Structure Having Air Gap And Method Of...

Partial Barrier Free Vias for Cobalt-Based Interconnects and Method...

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

INTERCONNECT STRUCTURE INCLUDING SINGLE LAYER SERVING AS BOTH BARRI...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

METAL LINES OF HYBRID HEIGHTS

SEMICONDUCTOR DEVICE STRUCTURE

VERTICAL SEMICONDUCTOR DEVICES

INTERCONNECT STRUCTURE

INTERCONNECTOR AND ELECTRONIC APPARATUS INCLUDING THE SAME

ETCH STOP LAYER FOR BACKSIDE PROCESSING ARCHITECTURE

ACCURATE METAL LINE AND VIA HEIGHT CONTROL FOR TOP VIA PROCESS

Interconnection Structure for a Semiconductor Device

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

HYBRID METHOD FOR FORMING SEMICONDUCTOR INTERCONNECT STRUCTURE

COMPOSITE INTERCONNECT FORMATION USING GRAPHENE

CONFORMAL POWER DELIVERY STRUCTURES NEAR HIGH-SPEED SIGNAL TRACES

SIMULTANEOUS FILLING OF VARIABLE ASPECT RATIO SINGLE DAMASCENE CONT...

TOP VIA INTERCONNECTS WITHOUT BARRIER METAL BETWEEN VIA AND ABOVE LINE