Additional layers associated with refractory-metal layers

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H01L23/53266

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/53266Additional layers associated with refractory-metal layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,176,290
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sungyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with contact structure
- Patent number 12,170,246
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device comprising sealing film including stacked insulating...
- Patent number 12,167,659
- Issue date Dec 10, 2024
- Japan Display Inc.
- Nobuto Managaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnection structure and manufacturing method thereof and semi...
- Patent number 12,165,967
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Delong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure and semiconductor device having the same
- Patent number 12,166,126
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten molybdenum structures
- Patent number 12,159,804
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capacitor formed with high resistance layer and method of manufactu...
- Patent number 12,154,849
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 12,142,566
- Issue date Nov 12, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate assembly and display device
- Patent number 12,142,581
- Issue date Nov 12, 2024
- Innolux Corporation
- Tsung-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,558
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Naoya Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via-first process for connecting a contact and a gate electrode
- Patent number 12,125,743
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of metal vias on metal lines
- Patent number 12,113,020
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Ryan Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a memory
- Patent number 12,106,817
- Issue date Oct 1, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Longyang Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
In-situ CMP self-assembled monolayer for enhancing metal-dielectric...
- Patent number 12,107,004
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing memory and memory
- Patent number 12,096,620
- Issue date Sep 17, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yexiao Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure having deep metal line and method for formi...
- Patent number 12,094,816
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure with double conductors
- Patent number 12,087,685
- Issue date Sep 10, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 12,087,575
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection structure and method of...
- Patent number 12,080,591
- Issue date Sep 3, 2024
- Renesas Electronics Corporation
- Kazuyuki Omori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Barrier-less structures
- Patent number 12,080,593
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive structures
- Patent number 12,068,252
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 12,062,614
- Issue date Aug 13, 2024
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Integrated circuit device and method for forming the same
- Patent number 12,062,540
- Issue date Aug 13, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
- Ya-Ting Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate cut and fin trim isolation for advanced integrated circuit str...
- Patent number 12,057,492
- Issue date Aug 6, 2024
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for liner-free conductive structures
- Patent number 12,057,397
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures having linerless self-forming barriers
- Patent number 12,057,388
- Issue date Aug 6, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,057,400
- Issue date Aug 6, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with stacked conductive plugs and me...
- Patent number 12,051,644
- Issue date Jul 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Jung-Hsing Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Contact Feature Through Heterogeneous Stacked Film and Methods of M...
- Publication number 20240429090
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jhen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240421070
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sunjung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEPARATION...
- Publication number 20240420999
- Publication date Dec 19, 2024
- SK HYNIX INC.
- Myung Ok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240421066
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Publication number 20240421090
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Seo Woo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240421190
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seong Heum Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
- Publication number 20240395612
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS
- Publication number 20240395702
- Publication date Nov 28, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...
- Publication number 20240395618
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE
- Publication number 20240387356
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure of Semiconductor Device and Method of Formin...
- Publication number 20240387360
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387166
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT STRUCTURE
- Publication number 20240387261
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR FORMED WITH HIGH RESISTANCE LAYER AND METHOD OF MANUFACTU...
- Publication number 20240387355
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mingni Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387165
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL MIM STRUCTURE
- Publication number 20240379532
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-huan WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS
- Publication number 20240379557
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Yang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER AND MANUFACTURING METHOD THEREFOR
- Publication number 20240379650
- Publication date Nov 14, 2024
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qichang AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FOR ELECTRONIC COMPONENT
- Publication number 20240379415
- Publication date Nov 14, 2024
- STMicroelectronics International N.V.
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379425
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...
- Publication number 20240379537
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE
- Publication number 20240371687
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240371683
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240371717
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Donggon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS
- Publication number 20240371771
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Sahil Jaykumar PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240371684
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240363540
- Publication date Oct 31, 2024
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE
- Publication number 20240363339
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-TEMPERATURE DEPOSITION PROCESSES TO FORM MOLYBDENUM-BASED MATER...
- Publication number 20240360549
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Feng Q. Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Additional layers associated with refractory-metal layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device with contact structure

Display device comprising sealing film including stacked insulating...

Interconnection structure and manufacturing method thereof and semi...

Gate structure and semiconductor device having the same

Tungsten molybdenum structures

Capacitor formed with high resistance layer and method of manufactu...

Method of forming stacked trench contacts and structures formed the...

Substrate assembly and display device

Semiconductor device

Contact over active gate structures for advanced integrated circuit...

Via-first process for connecting a contact and a gate electrode

Method for fabricating semiconductor device with redistribution plugs

Formation of metal vias on metal lines

Method for manufacturing a memory

In-situ CMP self-assembled monolayer for enhancing metal-dielectric...

Method for manufacturing memory and memory

Semiconductor structure having deep metal line and method for formi...

Semiconductor interconnect structure with double conductors

Conductive feature formation and structure

Semiconductor device having interconnection structure and method of...

Barrier-less structures

Hybrid conductive structures

Low resistance contacts including intermetallic alloy of nickel, pl...

Integrated circuit device and method for forming the same

Gate cut and fin trim isolation for advanced integrated circuit str...

Capping layer for liner-free conductive structures

Integrated circuit structures having linerless self-forming barriers

Integrated assemblies and methods of forming integrated assemblies

Semiconductor device structure with stacked conductive plugs and me...

Patents Applicationslast 30 patents

Contact Feature Through Heterogeneous Stacked Film and Methods of M...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING SEPARATION...

METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF

SEMICONDUCTOR DEVICES

CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE

SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS

ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...

SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE

Interconnect Structure of Semiconductor Device and Method of Formin...

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

GATE CONTACT STRUCTURE

CAPACITOR FORMED WITH HIGH RESISTANCE LAYER AND METHOD OF MANUFACTU...

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

NOVEL MIM STRUCTURE

CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS

FILTER AND MANUFACTURING METHOD THEREFOR

CONTACT FOR ELECTRONIC COMPONENT

CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

SEMICONDUCTOR DEVICE

INTERRUPTION LAYER FILL FOR LOW RESISTANCE CONTACTS

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

Integrated Assemblies and Methods of Forming Integrated Assemblies

CONDUCTIVE FEATURE FORMATION AND STRUCTURE

LOW-TEMPERATURE DEPOSITION PROCESSES TO FORM MOLYBDENUM-BASED MATER...