Additional layers associated with refractory-metal layers

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/53266Additional layers associated with refractory-metal layers

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Patents Grantslast 30 patents

Information Patent Grant
Apparatuses including interconnect structures including dielectric...
- Patent number 12,368,101
- Issue date Jul 22, 2025
- Battelle Energy Alliance, LLC
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures
- Patent number 12,362,229
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM structure
- Patent number 12,362,271
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun huan Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures and methods of fabrication thereof
- Patent number 12,362,273
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Nan Nian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming embedded diffusion barriers
- Patent number RE50494
- Issue date Jul 15, 2025
- TESSERA LLC
- Cyril Cabral
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,362,234
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with different metal materials
- Patent number 12,354,957
- Issue date Jul 8, 2025
- Intel Corporation
- Carl H. Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,347,766
- Issue date Jul 1, 2025
- Winbond Electronics Corp.
- Hao-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structure
- Patent number 12,347,768
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Anthony Dongick Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter block for recessed contacts and methods forming same
- Patent number 12,349,395
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench plug hardmask for advanced integrated circuit structure fabr...
- Patent number 12,349,450
- Issue date Jul 1, 2025
- Intel Corporation
- Anthony St. Amour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with material modification and low resistan...
- Patent number 12,347,725
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure, electronic device including the same, and m...
- Patent number 12,341,063
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,341,097
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Sangshin Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with liner structure
- Patent number 12,341,062
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure and manufacturing method
- Patent number 12,334,435
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,327,787
- Issue date Jun 10, 2025
- Kioxia Corporation
- Takashi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods
- Patent number 12,322,647
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with interconnects and method for preparing...
- Patent number 12,324,212
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tieh-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,315,792
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jongmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution plugs
- Patent number 12,315,793
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with liner structure
- Patent number 12,315,808
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor interconnection structure against...
- Patent number 12,308,310
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal loss prevention in conductive structures
- Patent number 12,308,314
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with fluorine-c...
- Patent number 12,308,290
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with barrier portion
- Patent number 12,308,318
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interconnection structure including...
- Patent number 12,308,311
- Issue date May 20, 2025
- SK hynix Inc.
- Won Tae Koo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OXIDE SEMICONDUCTOR FERROELECTRIC FIELD EFFECT TRANSISTOR
- Publication number 20250241015
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250240945
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jinseong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250234599
- Publication date Jul 17, 2025
- Fuji Electric Co., Ltd.
- Motoyoshi KUBOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250233075
- Publication date Jul 17, 2025
- WINBOND ELECTRONICS CORP.
- Yoshinori TANAKA
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS FOR SELECTIVE METAL CAP FORMATION
- Publication number 20250233074
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL LAYER ASSISTED THREE-DIMENSIONAL TOP VIA INTERCONNECTS
- Publication number 20250201697
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250201700
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Donggon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20250201629
- Publication date Jun 19, 2025
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
- Publication number 20250201797
- Publication date Jun 19, 2025
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE, AND ELECTRONIC DEVICE INCLUDING SAME
- Publication number 20250192053
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- GIYOUNG JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192038
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192044
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192043
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192058
- Publication date Jun 12, 2025
- Fuji Electric Co., Ltd.
- Atsushi ONOGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE
- Publication number 20250183161
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES HAVING ENHANCED WIRING STRUCTURES THEREIN
- Publication number 20250174554
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Seung Yong Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS
- Publication number 20250174558
- Publication date May 29, 2025
- Micron Technology, Inc.
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...
- Publication number 20250167043
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Keun Wook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20250169072
- Publication date May 22, 2025
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE LINER
- Publication number 20250157932
- Publication date May 15, 2025
- TOKYO ELECTRON LIMITED
- Tek Po Rinus Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Loss Prevention In Conductive Structures
- Publication number 20250157919
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20250157537
- Publication date May 15, 2025
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ASSEMBLY AND DISPLAY DEVICE
- Publication number 20250140715
- Publication date May 1, 2025
- Red Oak Innovations Limited
- Tsung-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20250142939
- Publication date May 1, 2025
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES
- Publication number 20250132248
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- David H. Wells
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132200
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Lung CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INTERCONNECTION STRUCTURE IN SEMICONDUCTOR...
- Publication number 20250132249
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Muryeong KUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-DAMAGE-RESISTANT INTERCONNECT STRUCTURE AND METHODS FOR MANU...
- Publication number 20250132258
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...
- Publication number 20250126869
- Publication date Apr 17, 2025
- Intel Corporation
- Subhash JOSHI
- H01 - BASIC ELECTRIC ELEMENTS

Additional layers associated with refractory-metal layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatuses including interconnect structures including dielectric...

Partial barrier free vias for cobalt-based interconnects and method...

Semiconductor device and method of manufacturing the same

Semiconductor device structures

MIM structure

Conductive structures and methods of fabrication thereof

Self-forming embedded diffusion barriers

Contact structure for semiconductor device

Cobalt based interconnects and methods of fabrication thereof

Interconnect structures with different metal materials

Semiconductor structure and method for forming the same

Semiconductor device including via structure

Inter block for recessed contacts and methods forming same

Trench plug hardmask for advanced integrated circuit structure fabr...

Semiconductor structure with material modification and low resistan...

Interconnect structure, electronic device including the same, and m...

Semiconductor devices

Method for fabricating semiconductor device with liner structure

Middle-of-line interconnect structure and manufacturing method

Semiconductor memory device

Semiconductor devices and methods

Semiconductor structure with interconnects and method for preparing...

Semiconductor device

Semiconductor device with redistribution plugs

Semiconductor device with liner structure

Method for forming semiconductor interconnection structure against...

Metal loss prevention in conductive structures

Method for preparing semiconductor device structure with fluorine-c...

Semiconductor device structure with barrier portion

Semiconductor device including interconnection structure including...

Patents Applicationslast 30 patents

OXIDE SEMICONDUCTOR FERROELECTRIC FIELD EFFECT TRANSISTOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

METHODS FOR SELECTIVE METAL CAP FORMATION

TWO-DIMENSIONAL LAYER ASSISTED THREE-DIMENSIONAL TOP VIA INTERCONNECTS

INTEGRATED CIRCUIT DEVICE

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

INTERCONNECT STRUCTURE, AND ELECTRONIC DEVICE INCLUDING SAME

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE

INTEGRATED CIRCUIT DEVICES HAVING ENHANCED WIRING STRUCTURES THEREIN

MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS

INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...

Integrated Assemblies, and Methods of Forming Integrated Assemblies

LOW RESISTANCE LINER

Metal Loss Prevention In Conductive Structures

Integrated Assemblies and Methods of Forming Integrated Assemblies

SUBSTRATE ASSEMBLY AND DISPLAY DEVICE

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

MEMORY DEVICES INCLUDING STAIRCASE STRUCTURES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND INTERCONNECTION STRUCTURE IN SEMICONDUCTOR...

PLASMA-DAMAGE-RESISTANT INTERCONNECT STRUCTURE AND METHODS FOR MANU...

EPITAXIAL SOURCE OR DRAIN STRUCTURES FOR ADVANCED INTEGRATED CIRCUI...