Additional layers associated with refractory-metal layers

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H01L23/53266

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53266Additional layers associated with refractory-metal layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for manufacturing the same
- Patent number 11,967,554
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jongjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating microelectronic devices with contacts to co...
- Patent number 11,967,556
- Issue date Apr 23, 2024
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter block for recessed contacts and methods forming same
- Patent number 11,967,622
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 11,961,767
- Issue date Apr 16, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,948,997
- Issue date Apr 2, 2024
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,948,882
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-region diffusion barrier containing titanium, silicon and nit...
- Patent number 11,942,365
- Issue date Mar 26, 2024
- Eugenus, Inc.
- Vinayak Veer Vats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contact having barrier layers with different depths
- Patent number 11,929,328
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,929,366
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Sunyoung Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Halogen treatment for NMOS contact resistance improvement
- Patent number 11,923,290
- Issue date Mar 5, 2024
- Intel Corporation
- Siddharth Chouksey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming apparatuses having tungsten-containing structures
- Patent number 11,923,305
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Luca Fumagalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,426
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Ji Won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with programmable unit
- Patent number 11,916,019
- Issue date Feb 27, 2024
- NANYA TECHNOLOGY CORPORATION
- Te-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
- Patent number 11,908,735
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having a carbon-containing barrier layer
- Patent number 11,908,697
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company
- Rueijer Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interconnect formation using graphene
- Patent number 11,908,734
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective formation of conductor nanowires
- Patent number 11,908,789
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsien Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies comprising conductive levels having two diffe...
- Patent number 11,910,606
- Issue date Feb 20, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,908,800
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Chin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,908,813
- Issue date Feb 20, 2024
- Innolux Corporation
- Tsung-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing a molybdenum metal film over a dielectric su...
- Patent number 11,908,736
- Issue date Feb 20, 2024
- ASM IP Holding B.V.
- Bhushan Zope
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,903,198
- Issue date Feb 13, 2024
- Kioxia Corporation
- Kenichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring layer and manufacturing method therefor
- Patent number 11,901,372
- Issue date Feb 13, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yutaka Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,903,201
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal capping layer and methods thereof
- Patent number 11,894,266
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Ru Liner above a Barrier Layer
- Publication number 20240136223
- Publication date Apr 25, 2024
- Zhaoxuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER
- Publication number 20240113024
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Ching-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE
- Publication number 20240113018
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MAT...
- Publication number 20240113028
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Yeonchoo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABR...
- Publication number 20240105520
- Publication date Mar 28, 2024
- Intel Corporation
- Anthony ST. AMOUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240096796
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Yongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20240096697
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240096691
- Publication date Mar 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Mingming MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTAN...
- Publication number 20240087952
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20240088042
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-WEI LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088041
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TSENG-CHIEH PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240088166
- Publication date Mar 14, 2024
- Japan Display Inc.
- Akihiro HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME
- Publication number 20240088025
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS
- Publication number 20240079332
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Yang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Via With Improved Gap Filling Performance
- Publication number 20240071813
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071923
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Minjun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240071821
- Publication date Feb 29, 2024
- Macronix International Co., Ltd.
- Dai-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANTHANUM NITRIDE AS A DRAM MOLYBDENUM LINER
- Publication number 20240074162
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Rand Haddadin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240071928
- Publication date Feb 29, 2024
- KIOXIA Corporation
- Akira NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...
- Publication number 20240047448
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES
- Publication number 20240047268
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Peiqi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM DEPOSITION IN FEATURES
- Publication number 20240047269
- Publication date Feb 8, 2024
- LAM RESEARCH CORPORATION
- Jeong-Seok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STR...
- Publication number 20240047447
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20240047556
- Publication date Feb 8, 2024
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTINUOUS GATE AND FIN SPACER FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20240038578
- Publication date Feb 1, 2024
- Intel Corporation
- Heidi M. MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...
- Publication number 20240038661
- Publication date Feb 1, 2024
- Intel Corporation
- Manish Chandhok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND R...
- Publication number 20240030062
- Publication date Jan 25, 2024
- LAM RESEARCH CORPORATION
- Dennis M. Hausmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SU...
- Publication number 20240030035
- Publication date Jan 25, 2024
- ASM IP HOLDING B.V.
- Jerry Peijun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Contact Plug with Impurity Variation
- Publication number 20240021471
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS

Additional layers associated with refractory-metal layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned barrier for metal vias

Semiconductor devices and methods for manufacturing the same

Methods for fabricating microelectronic devices with contacts to co...

Inter block for recessed contacts and methods forming same

Dual metal silicide structures for advanced integrated circuit stru...

Dual metal gate structure having portions of metal gate layers in c...

Heterogeneous metal line compositions for advanced integrated circu...

Methods and apparatus for forming dual metal interconnects

Trench contact structures for advanced integrated circuit structure...

Semiconductor device and method of fabricating the same

Multi-region diffusion barrier containing titanium, silicon and nit...

Conductive contact having barrier layers with different depths

Semiconductor device

Halogen treatment for NMOS contact resistance improvement

Methods of forming apparatuses having tungsten-containing structures

Semiconductor device

Method for fabricating semiconductor device with programmable unit

Vias for cobalt-based interconnects and methods of fabrication thereof

Interconnect structure having a carbon-containing barrier layer

Composite interconnect formation using graphene

Selective formation of conductor nanowires

Integrated assemblies comprising conductive levels having two diffe...

Semiconductor structure

Display device

Methods for depositing a molybdenum metal film over a dielectric su...

Semiconductor device and manufacturing method thereof

Wiring layer and manufacturing method therefor

Integrated assemblies, and methods of forming integrated assemblies

Top via with damascene line and via

Metal capping layer and methods thereof

Patents Applicationslast 30 patents

Ru Liner above a Barrier Layer

MULTI-LAYER TOPOLOGICAL INTERCONNECT WITH PROXIMAL DOPING LAYER

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE

INTERCONNECTION LAYER STRUCTURES INCLUDING TWO-DIMENSIONAL (2D) MAT...

TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABR...

INTEGRATED CIRCUIT DEVICE

CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTAN...

SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME

CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS

Conductive Via With Improved Gap Filling Performance

SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME

LANTHANUM NITRIDE AS A DRAM MOLYBDENUM LINER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...

METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES

MOLYBDENUM DEPOSITION IN FEATURES

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STR...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

CONTINUOUS GATE AND FIN SPACER FOR ADVANCED INTEGRATED CIRCUIT STRU...

INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...

INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND R...

METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SU...

Contact Plug with Impurity Variation