Additional leads joined to the metallisation on the insulating substrate

Industry

CPC
H01L23/49811

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49811Additional leads joined to the metallisation on the insulating substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of overlapping power terminals in a semiconductor module
- Patent number 11,973,015
- Issue date Apr 30, 2024
- Fuji Electric Co., Ltd.
- Masashi Hoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,967,545
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power unit and semiconductor power module
- Patent number 11,967,536
- Issue date Apr 23, 2024
- SEMIKRON ELEKTRONIK GMBH CO., KG
- Valeriano Cardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 11,961,795
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Bongken Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,961,797
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 11,961,867
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, semiconductor package structure, and method for...
- Patent number 11,961,831
- Issue date Apr 16, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure with reinforcement element
- Patent number 11,961,808
- Issue date Apr 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Jen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,948,872
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,948,890
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 11,948,862
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,942,408
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate stacked on die for high voltage isolation capacitor
- Patent number 11,942,402
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,942,403
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with embedded interconnects
- Patent number 11,942,406
- Issue date Mar 26, 2024
- Intel Corporation
- Kyu Oh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device module with dummy pad die layout
- Patent number 11,935,817
- Issue date Mar 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced bump height variation
- Patent number 11,935,866
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component built-in wiring board and method for manufactu...
- Patent number 11,935,801
- Issue date Mar 19, 2024
- Ibiden Co., Ltd.
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module layout for symmetric switching and temperature sensing
- Patent number 11,935,875
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,935,813
- Issue date Mar 19, 2024
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,935,847
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,935,806
- Issue date Mar 19, 2024
- Nichia Corporation
- Tadaaki Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,929,312
- Issue date Mar 12, 2024
- Fuji Electric Co., Ltd.
- Masaoki Miyakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 11,929,262
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE AND METHOD FOR MAN...
- Publication number 20240145359
- Publication date May 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145360
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC INTERCONNECT AND METHOD OF FORMING THE SAME
- Publication number 20240145365
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240145373
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- HYEONGSEOK KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
- Publication number 20240145340
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE
- Publication number 20240145457
- Publication date May 2, 2024
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240145329
- Publication date May 2, 2024
- Samsung Electronics Co. Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE
- Publication number 20240145358
- Publication date May 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240145361
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- WONBIN SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Arrangement
- Publication number 20240145362
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Ákos Ferenc Hegedüs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240136261
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- SEUNGWAN SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Chip Packaging Method
- Publication number 20240136304
- Publication date Apr 25, 2024
- Honor Device Co., Ltd.
- Xueping Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240136262
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- DONGHYEON JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER INCLUDING ALIGNMENT KEY PATTERN LAYER INCLUDING...
- Publication number 20240128198
- Publication date Apr 18, 2024
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128241
- Publication date Apr 18, 2024
- Fuji Electric Co., Ltd.
- Akira HIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CHIP CARRIER PACKAGE
- Publication number 20240128170
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240120249
- Publication date Apr 11, 2024
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120325
- Publication date Apr 11, 2024
- Powertech Technology Inc.
- Pei-chun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20240120281
- Publication date Apr 11, 2024
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240112996
- Publication date Apr 4, 2024
- Rohm Co., Ltd.
- Hiroshi OJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER
- Publication number 20240112997
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113003
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Yun Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113001
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Kyounglim SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105656
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240105541
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- YONGHWAN KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105566
- Publication date Mar 28, 2024
- ROHM CO., LTD.
- Xiaopeng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240105467
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF-BRIDGE POWER DEVICE AND HALF-BRIDGE POWER MODULE
- Publication number 20240106342
- Publication date Mar 28, 2024
- ZF Friedrichshafen AG
- Zhiwu Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20240105628
- Publication date Mar 28, 2024
- MURATA MANUFACTURING CO., LTD.
- Hiromichi KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
- Publication number 20240096775
- Publication date Mar 21, 2024
- Analog Devices, Inc.
- Hien Minh Pham
- H01 - BASIC ELECTRIC ELEMENTS

Additional leads joined to the metallisation on the insulating substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Method of manufacturing substrate structure with filling material f...

Plurality of overlapping power terminals in a semiconductor module

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor device

Electronic power unit and semiconductor power module

Semiconductor package and package-on-package including the same

Semiconductor package and fabricating method thereof

Electronic device package and fabricating method thereof

Solderless interconnection structure and method of forming same

Electronic package, semiconductor package structure, and method for...

Devices and methods related to dual-sided radio-frequency package w...

Electronic package structure with reinforcement element

Semiconductor device package comprising a pin in the form of a dril...

Semiconductor package and method of fabricating the same

Semiconductor package and method

Package structures and method of forming the same

Semiconductor structure and manufacturing method thereof

Laminate stacked on die for high voltage isolation capacitor

Integrated circuit package and method

Semiconductor packages with embedded interconnects

Power device module with dummy pad die layout

Semiconductor device having reduced bump height variation

Electronic component built-in wiring board and method for manufactu...

Power module layout for symmetric switching and temperature sensing

Semiconductor device

Semiconductor package

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Stack package and methods of manufacturing the same

Patents Applicationslast 30 patents

WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE AND METHOD FOR MAN...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ELECTRONIC INTERCONNECT AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING

FAN-OUT PACKAGING FOR A MULTICHIP PACKAGE

SEMICONDUCTOR PACKAGE

WINDOW BALL GRIDE ARRAY (WBGA) PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Power Semiconductor Module Arrangement

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Electronic Device and Chip Packaging Method

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR WAFER INCLUDING ALIGNMENT KEY PATTERN LAYER INCLUDING...

SEMICONDUCTOR DEVICE

HYBRID CHIP CARRIER PACKAGE

SEMICONDUCTOR MODULE

STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE

SEMICONDUCTOR DEVICE

MULTILAYER PACKAGE SUBSTRATE WITH STRESS BUFFER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGING DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

HALF-BRIDGE POWER DEVICE AND HALF-BRIDGE POWER MODULE

RADIO FREQUENCY MODULE AND COMMUNICATION APPARATUS

ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE