Adhesive characteristics other than chemical

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H01L2924/078

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/078Adhesive characteristics other than chemical

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method and electronic module with new routing possibi...
- Patent number RE49970
- Issue date May 14, 2024
- IMBERATEK, LLC
- Antti Kivikero
Information Patent Grant
Adhesive bonding composition and electronic components prepared fro...
- Patent number 11,901,331
- Issue date Feb 13, 2024
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 11,862,539
- Issue date Jan 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 11,854,952
- Issue date Dec 26, 2023
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,854,946
- Issue date Dec 26, 2023
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,806,141
- Issue date Nov 7, 2023
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device with improved flexural resistance and electri...
- Patent number 11,784,290
- Issue date Oct 10, 2023
- Nichia Corporation
- Keiichi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Filler disposition film
- Patent number 11,732,105
- Issue date Aug 22, 2023
- Dexerials Corporation
- Yasushi Akutsu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a semiconduc...
- Patent number 11,688,659
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and display device using the same
- Patent number 11,683,963
- Issue date Jun 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selecting adhesive with excellent folding stability
- Patent number 11,649,384
- Issue date May 16, 2023
- LG Chem, Ltd.
- Hyunsup Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof, electronic device
- Patent number 11,588,138
- Issue date Feb 21, 2023
- BOE Technology Group Co., Ltd.
- Junbo Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor mounted on an integrated circuit die, and meth...
- Patent number 11,562,978
- Issue date Jan 24, 2023
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,471,080
- Issue date Oct 18, 2022
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 11,456,258
- Issue date Sep 27, 2022
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,424,176
- Issue date Aug 23, 2022
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 11,410,916
- Issue date Aug 9, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks with top side connections and inte...
- Patent number 11,411,152
- Issue date Aug 9, 2022
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with lead frame with improved lead design for discrete elec...
- Patent number 11,404,355
- Issue date Aug 2, 2022
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for making connections between analyte sensors and other...
- Patent number 11,382,542
- Issue date Jul 12, 2022
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device having an oscillator and an associated integra...
- Patent number 11,309,234
- Issue date Apr 19, 2022
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive bonding composition and electronic components prepared fro...
- Patent number 11,270,973
- Issue date Mar 8, 2022
- Immunolight, LLC
- Zakaryae Fathi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20240203839
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20240090801
- Publication date Mar 21, 2024
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
- Publication number 20240063165
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Ramesh NALLAVELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
- Publication number 20230395524
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT
- Publication number 20230361076
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Hermann Bechert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BANDGAP SEMICONDUCTOR DEVICE
- Publication number 20230335633
- Publication date Oct 19, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Manufacturing Method
- Publication number 20230317684
- Publication date Oct 5, 2023
- Hitachi Energy Switzerland AG
- Harald Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE ADHESIVE THAT OVERFLOWS FOR R...
- Publication number 20230238349
- Publication date Jul 27, 2023
- Airoha Technology (HK) Limited
- Chun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20230026949
- Publication date Jan 26, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20230000400
- Publication date Jan 5, 2023
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220352053
- Publication date Nov 3, 2022
- KIOXIA Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
- Publication number 20220181292
- Publication date Jun 9, 2022
- Immunolight, LLC
- Zakaryae FATHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...
- Publication number 20220149011
- Publication date May 12, 2022
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220044987
- Publication date Feb 10, 2022
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20210345914
- Publication date Nov 11, 2021
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...
- Publication number 20210128027
- Publication date May 6, 2021
- Abbott Diabetes Care Inc.
- Mohammad E. Moein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC ADHESIVE COMPOSITIONS HAVING GOOD WORK LIVES AND THERMAL C...
- Publication number 20210118836
- Publication date Apr 22, 2021
- Matthew WROSCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20210074609
- Publication date Mar 11, 2021
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20210050284
- Publication date Feb 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...
- Publication number 20210035946
- Publication date Feb 4, 2021
- Immunolight, LLC
- Zakaryae FATHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...
- Publication number 20200365492
- Publication date Nov 19, 2020
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20200312751
- Publication date Oct 1, 2020
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE WITH IMPROVED FLEXURAL RESISTANCE AND ELECTRI...
- Publication number 20200251630
- Publication date Aug 6, 2020
- TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Keiichi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...
- Publication number 20200152352
- Publication date May 14, 2020
- DEXERIALS CORPORATION
- Tomoyuki ISHIMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20200144164
- Publication date May 7, 2020
- Amkor Technology, Inc.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20200083207
- Publication date Mar 12, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTNG DEVICE
- Publication number 20200044115
- Publication date Feb 6, 2020
- Nichia Corporation.
- Toru HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURES WITH IMPROVED ADHESION AND STRENGTH
- Publication number 20200013689
- Publication date Jan 9, 2020
- SKYWORKS SOLUTIONS, INC.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stretchable Form of Single Crystal Silicon for High Performance Ele...
- Publication number 20200013720
- Publication date Jan 9, 2020
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20200013975
- Publication date Jan 9, 2020
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Adhesive characteristics other than chemical

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method and electronic module with new routing possibi...

Adhesive bonding composition and electronic components prepared fro...

Method of forming a packaged semiconductor device having enhanced w...

Semiconductor device and measurement device

Semiconductor device with sealed semiconductor chip

Connectors for making connections between analyte sensors and other...

Circuit board structure and method for manufacturing a circuit boar...

Light-emitting device with improved flexural resistance and electri...

Light emitting diode display with redundancy scheme

Method of room temperature covalent bonding

Filler disposition film

Method for manufacturing an electronic module and electronic module

Method for manufacturing a semiconductor device having a semiconduc...

Anisotropic conductive film and display device using the same

Method for selecting adhesive with excellent folding stability

Interconnect structure with redundant electrical connectors and ass...

Power module package and method of manufacturing the same

Display device and manufacturing method thereof, electronic device

Decoupling capacitor mounted on an integrated circuit die, and meth...

Connectors for making connections between analyte sensors and other...

Stretchable form of single crystal silicon for high performance ele...

Method of making flexible semiconductor device with graphene tape

Semiconductor device with sealed semiconductor chip

Method of forming a packaged semiconductor device having enhanced w...

Packaging photon building blocks with top side connections and inte...

Package with lead frame with improved lead design for discrete elec...

Connectors for making connections between analyte sensors and other...

Light emitting diode display with redundancy scheme

Semiconductor device having an oscillator and an associated integra...

Adhesive bonding composition and electronic components prepared fro...

Patents Applicationslast 30 patents

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT

EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT

CHIP ARRANGEMENT

WIDE BANDGAP SEMICONDUCTOR DEVICE

Power Semiconductor Module and Manufacturing Method

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE ADHESIVE THAT OVERFLOWS FOR R...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...

INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER...

METALLIC ADHESIVE COMPOSITIONS HAVING GOOD WORK LIVES AND THERMAL C...

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FRO...

PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

LIGHT-EMITTING DEVICE WITH IMPROVED FLEXURAL RESISTANCE AND ELECTRI...

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

Method of Manufacturing a Multi-Chip Semiconductor Power Device

LIGHT-EMITTNG DEVICE

PACKAGING STRUCTURES WITH IMPROVED ADHESION AND STRENGTH

Stretchable Form of Single Crystal Silicon for High Performance Ele...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME