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Aligning added circuit layers or via connections relative to previous circuit layers
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H05K3/4679
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ELECTRICITY
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Electric techniques
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PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Apparatus or processes for manufacturing printed circuits
Current Industry
H05K3/4679
Aligning added circuit layers or via connections relative to previous circuit layers
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last 30 patents
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Patent Grant
Multi-layer line structure and method for manufacturing thereof
Patent number
11,862,564
Issue date
Jan 2, 2024
Dai Nippon Printing Co., Ltd.
Hiroshi Kudo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed wiring board and method for manufacturing printed wiring board
Patent number
11,832,397
Issue date
Nov 28, 2023
Ibiden Co., Ltd.
Masashi Awazu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Display device and method of manufacturing the same
Patent number
11,825,613
Issue date
Nov 21, 2023
Samsung Display Co., Ltd.
Jeongjin Park
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board automated layup system
Patent number
11,653,484
Issue date
May 16, 2023
Raytheon Company
Mikhail Pevzner
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method for forming channels in printed circuit boards by stacking s...
Patent number
11,606,865
Issue date
Mar 14, 2023
Raytheon Company
Mikhail Pevzner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board
Patent number
11,439,022
Issue date
Sep 6, 2022
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Young Il Cho
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic devices comprising a via and methods of forming such ele...
Patent number
11,284,521
Issue date
Mar 22, 2022
3M Innovative Properties, Company
Matthew S. Stay
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Guided transport path correction
Patent number
11,234,334
Issue date
Jan 25, 2022
Kateeva, Inc.
Eliyahu Vronsky
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Line structure and a method for producing the same
Patent number
11,217,530
Issue date
Jan 4, 2022
Dai Nippon Printing Co., Ltd.
Hiroshi Kudo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Line structure and a method for producing the same
Patent number
11,069,618
Issue date
Jul 20, 2021
Dai Nippon Printing Co., Ltd.
Hiroshi Kudo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for estimating the simulated contour of a material composed...
Patent number
10,962,356
Issue date
Mar 30, 2021
Shih-Hao Ray Yeh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Printed circuit board for integrated LED driver
Patent number
10,856,376
Issue date
Dec 1, 2020
Lumileds LLC
Zhihua Song
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board for integrated LED driver
Patent number
10,813,182
Issue date
Oct 20, 2020
Lumileds LLC
Zhihua Song
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical assembly with a multilayer bus board
Patent number
10,779,392
Issue date
Sep 15, 2020
INTERPLEX INDUSTRIES, INC.
Richard Schneider
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer wiring board
Patent number
10,765,011
Issue date
Sep 1, 2020
Dai Nippon Printing Co., Ltd.
Shigeki Chujo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Zero-misalignment via-pad structures
Patent number
10,645,813
Issue date
May 5, 2020
Intel Corporation
Brandon M. Rawlings
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stacking and moving apparatus for manufacturing printed circuit boards
Patent number
10,617,015
Issue date
Apr 7, 2020
Shih-Hao Ray Yeh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Line structure and a method for producing the same
Patent number
10,586,768
Issue date
Mar 10, 2020
Dai Nippon Printing Co., Ltd.
Hiroshi Kudo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fusion bonded liquid crystal polymer electrical circuit structure
Patent number
10,506,722
Issue date
Dec 10, 2019
HSIO Technologies, LLC
James J. Rathburn
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Patterned overcoat layer
Patent number
10,492,305
Issue date
Nov 26, 2019
3M Innovative Properties Company
Matthew S. Stay
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multilayer bus board
Patent number
10,485,092
Issue date
Nov 19, 2019
INTERPLEX INDUSTRIES, INC.
Richard Schneider
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer wiring board
Patent number
10,477,702
Issue date
Nov 12, 2019
Dai Nippon Printing Co., Ltd.
Shigeki Chujo
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Multilayer ceramic substrate and method for manufacturing same
Patent number
10,455,699
Issue date
Oct 22, 2019
Hitachi Metals, Ltd.
Kenji Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printing of multi-layer circuits
Patent number
10,446,412
Issue date
Oct 15, 2019
PRINTCB LTD.
Yiftah Karni
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Guided transport path correction
Patent number
10,433,434
Issue date
Oct 1, 2019
Kateeva, Inc.
Eliyahu Vronsky
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Transport path correction techniques and related systems, methods a...
Patent number
10,420,225
Issue date
Sep 17, 2019
Kateeva, Inc.
David C. Darrow
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Multi-layer circuit structure and manufacturing method thereof
Patent number
10,383,226
Issue date
Aug 13, 2019
Unimicron Technology Corp.
Chang-Fu Chen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wired circuit board and producing method thereof
Patent number
10,257,926
Issue date
Apr 9, 2019
Nitto Denko Corporation
Yuu Sugimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wired circuit board and producing method thereof
Patent number
10,251,263
Issue date
Apr 2, 2019
Nitto Denko Corporation
Yuu Sugimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Zero-misalignment via-pad structures
Patent number
10,187,998
Issue date
Jan 22, 2019
Intel Corporation
Brandon M. Rawlings
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
Publication number
20240080994
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
Gun Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240064911
Publication date
Feb 22, 2024
SAMSUNG DISPLAY CO., LTD.
JEONGJIN PARK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240023251
Publication date
Jan 18, 2024
Unimicron Technology Corp.
Shao-Chien LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING METHOD OF MEMBRANE CIRCUIT BOARD
Publication number
20240015892
Publication date
Jan 11, 2024
Primax Electronics Ltd.
Yi-Te Chou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED WIRING BOARD
Publication number
20230319986
Publication date
Oct 5, 2023
IBIDEN CO., LTD.
Susumu KAGOHASHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD STRUCTURE FOR DISPLAY DEVICE
Publication number
20230276580
Publication date
Aug 31, 2023
AUO Corporation
Chi-Sheng Liao
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING S...
Publication number
20230209728
Publication date
Jun 29, 2023
Raytheon Company
Mikhail Pevzner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STUD BUMPED PRINTED CIRCUIT ASSEMBLY
Publication number
20230041747
Publication date
Feb 9, 2023
James Rathburn
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-LAYER CIRCUIT BOARD WITH EMBEDDED COMPONENTS AND METHOD FOR M...
Publication number
20220418101
Publication date
Dec 29, 2022
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
CHENG-JIA LI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220264751
Publication date
Aug 18, 2022
SAMSUNG DISPLAY CO., LTD.
JEONGJIN PARK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220240378
Publication date
Jul 28, 2022
FUJI CORPORATION
Tasuku TAKEUCHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
Publication number
20220159824
Publication date
May 19, 2022
Unimicron Technology Corp.
Ming-Hao Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GUIDED TRANSPORT PATH CORRECTION
Publication number
20220039265
Publication date
Feb 3, 2022
Kateeva, Inc.
Eliyahu Vronsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Publication number
20210176866
Publication date
Jun 10, 2021
IBIDEN CO., LTD.
Masashi AWAZU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD AUTOMATED LAYUP SYSTEM
Publication number
20210144892
Publication date
May 13, 2021
Raytheon Company
Mikhail Pevzner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING S...
Publication number
20210144864
Publication date
May 13, 2021
Raytheon Company
Mikhail Pevzner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20210068261
Publication date
Mar 4, 2021
Samsung Electro-Mechanics Co., Ltd.
Young Il Cho
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LINE STRUCTURE AND A METHOD FOR PRODUCING THE SAME
Publication number
20200144196
Publication date
May 7, 2020
DAI NIPPON PRINTING CO., LTD.
Hiroshi Kudo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Publication number
20200092995
Publication date
Mar 19, 2020
Hitachi Metals, Ltd.
Kenji Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF A MULTI-LAYER FOR A PROBE CARD
Publication number
20200072873
Publication date
Mar 5, 2020
Technoprobe S.p.A.
Roberto CRIPPA
G01 - MEASURING TESTING
Information
Patent Application
ELECTRICAL ASSEMBLY WITH A MULTILAYER BUS BOARD
Publication number
20200060022
Publication date
Feb 20, 2020
Interplex Industries, Inc.
Richard Schneider
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTILAYER WIRING BOARD
Publication number
20190394886
Publication date
Dec 26, 2019
DAI NIPPON PRINTING CO., LTD.
Shigeki CHUJO
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
Publication number
20190350091
Publication date
Nov 14, 2019
Avary Holding (Shenzhen) Co., Limited.
TZU-CHIEN YEH
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Method For Estimating The Simulated Contour Of A Material Composed...
Publication number
20190316897
Publication date
Oct 17, 2019
Shih-Hao Ray Yeh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Stacking And Moving Apparatus For Manufacturing Printed Circuit Boards
Publication number
20190306992
Publication date
Oct 3, 2019
Shih-Hao Ray Yeh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Transport Path Correction Techniques and Related Systems, Methods a...
Publication number
20190297733
Publication date
Sep 26, 2019
Kateeva, Inc.
David C. Darrow
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
METHOD FOR MANUFACTURING AN EMBEDDED FLEXIBLE CIRCUIT BOARD
Publication number
20190281707
Publication date
Sep 12, 2019
Avary Holding (Shenzhen) Co., Limited.
LI-KUN LIU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
GUIDED TRANSPORT PATH CORRECTION
Publication number
20190246506
Publication date
Aug 8, 2019
Kateeva, Inc.
Eliyahu Vronsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
Publication number
20190223300
Publication date
Jul 18, 2019
Avary Holding (Shenzhen) Co., Limited.
LI-KUN LIU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POSITIONING STRUCTURE AND FLEXIBLE PRINTED CIRCUIT
Publication number
20190215954
Publication date
Jul 11, 2019
Kunshan Go-Visionox Opto-Electronics Co., Ltd.
Tan ZHANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR