Aligning components to be assembled

Industry

CPC
B81C2203/05

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

Current Industry

B81C2203/05Aligning components to be assembled

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sound producing cell
- Patent number 12,192,722
- Issue date Jan 7, 2025
- xMEMS Labs, Inc.
- Chiung C. Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Laser-assisted material phase-change and expulsion micro-machining...
- Patent number 12,077,432
- Issue date Sep 3, 2024
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sound producing cell and manufacturing method thereof
- Patent number 11,943,595
- Issue date Mar 26, 2024
- xMEMS Labs, Inc.
- Chiung C. Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capping plate for panel scale packaging of MEMS products
- Patent number 11,685,649
- Issue date Jun 27, 2023
- OBSIDIAN SENSORS, INC.
- John Hong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical (MEM) power relay
- Patent number 11,584,643
- Issue date Feb 21, 2023
- Massachusetts Institute of Technology
- Prashant Patil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Modular 3-D printed devices for sample delivery and method
- Patent number 11,485,632
- Issue date Nov 1, 2022
- Arizona Board of Regents on behalf of Arizona State University
- Alexandra Ros
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing MEMS transducer, MEMS transducer, ultrasound p...
- Patent number 11,369,345
- Issue date Jun 28, 2022
- Konica Minolta, Inc.
- Yuta Nakayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and methods for microfabrication
- Patent number 11,305,987
- Issue date Apr 19, 2022
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Sae Won Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-transfer-printed compound sensor device
- Patent number 11,230,471
- Issue date Jan 25, 2022
- X-CELEPRINT LIMITED
- Ronald S. Cok
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with roughend interface
- Patent number 11,192,778
- Issue date Dec 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated package structure for MEMS element and ASIC chip and met...
- Patent number 11,130,674
- Issue date Sep 28, 2021
- J-METRICS TECHNOLOGY CO., LTD.
- Sheng-Lin Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Alignment mark and semiconductor device, and fabrication methods th...
- Patent number 11,049,816
- Issue date Jun 29, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Coupling a magnet with a MEMS device
- Patent number 11,022,792
- Issue date Jun 1, 2021
- Intel Corporation
- Kyle Yazzie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for bonding wafers eutectically, and a wafer composite
- Patent number 10,927,004
- Issue date Feb 23, 2021
- Robert Bosch GmbH
- Axel Grosse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of achieving universal interfacing using suspended and/or f...
- Patent number 10,807,864
- Issue date Oct 20, 2020
- The Regents of the University of Colorado, a Body Corporate
- Joseph J. Brown
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with roughend interface
- Patent number 10,710,872
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for self-aligning solder-attached mems die to a mounting sur...
- Patent number 10,662,057
- Issue date May 26, 2020
- DunAn Microstaq, Inc.
- Wayne C. Long
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device, and a semiconductor...
- Patent number 10,607,843
- Issue date Mar 31, 2020
- TOSHIBA MEMORY CORPORATION
- Shinya Watanabe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transfer head and method for transferring micro devices
- Patent number 10,593,582
- Issue date Mar 17, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Self-cleaning liquid level sensor
- Patent number 10,551,240
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Jonathan Fry
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microscale fluidic devices and components having a fluid retention...
- Patent number 10,525,464
- Issue date Jan 7, 2020
- Bio-Rad Laboratories, Inc.
- Alwin Wan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro devices formed by flex circuit substrates
- Patent number 10,512,164
- Issue date Dec 17, 2019
- Encite LLC
- Stephen A. Marsh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Assembly and packaging of MEMS device
- Patent number 10,472,231
- Issue date Nov 12, 2019
- Invensense, Inc.
- Brian H. Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fully wafer-level-packaged MEMS microphone and method for manufactu...
- Patent number 10,306,372
- Issue date May 28, 2019
- Goertek Inc.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and device for producing a microfluidic analysis cartridge
- Patent number 10,295,441
- Issue date May 21, 2019
- Robert Bosch GmbH
- Franz Laermer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for self-aligning solder-attached MEMS die to a mounting sur...
- Patent number 10,189,706
- Issue date Jan 29, 2019
- DunAn Microstaq, Inc.
- Wayne C. Long
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic device
- Patent number 10,160,145
- Issue date Dec 25, 2018
- STRATEC Consumables GmbH
- Gottfried Reiter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Externally induced charge patterning using rectifying devices
- Patent number 10,141,285
- Issue date Nov 27, 2018
- Palo Alto Research Center Incorporated
- JengPing Lu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die bond design for medium pressure sensor
- Patent number 10,035,703
- Issue date Jul 31, 2018
- Continental Automotive Systems, Inc.
- Joe Pin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing an electromechanical device and correspond...
- Patent number 9,944,512
- Issue date Apr 17, 2018
- TRONICS MICROSYSTEMS
- Joël Collet
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME
- Publication number 20250002333
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Eric SAUGIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT
- Publication number 20240425367
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
- Publication number 20240425364
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE
- Publication number 20240262683
- Publication date Aug 8, 2024
- ams-OSRAM International GmbH
- Nicole Berner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOUND PRODUCING CELL
- Publication number 20240031740
- Publication date Jan 25, 2024
- xMEMS Labs, Inc.
- Chiung C. Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Anchor Structure
- Publication number 20240017987
- Publication date Jan 18, 2024
- SensorTek technology Corp.
- Shih-Wei Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE, APPARATUS AND FORMING METHODS THEREOF
- Publication number 20240022859
- Publication date Jan 18, 2024
- xMEMS Labs, Inc.
- Chiung C. Lo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314197
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A PROCESS AND APPARATUS FOR THE PREPARATION OF A BONDED SUBSTRATE
- Publication number 20220340416
- Publication date Oct 27, 2022
- TOP TECHNOLOGY LTD
- Youngho LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND ARRANGEMENT FOR ASSEMBLY OF MICROCHIPS INTO A SEPARATE S...
- Publication number 20220324703
- Publication date Oct 13, 2022
- Federico RIBET
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR MONITORING SURFACE CONDITION OF CONTACT SURFA...
- Publication number 20220002148
- Publication date Jan 6, 2022
- National Taiwan University
- Wei-Chang Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210280527
- Publication date Sep 9, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro-electromechanical (MEM) Power Relay
- Publication number 20210139322
- Publication date May 13, 2021
- Massachusetts Institute of Technology
- Prashant Patil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Laser-Assisted Material Phase-Change and Expulsion Micro-Machining...
- Publication number 20210139321
- Publication date May 13, 2021
- Massachusetts Institute of Technology
- Prashant Patil
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMS PACKAGE WITH ROUGHEND INTERFACE
- Publication number 20200339413
- Publication date Oct 29, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yu-Jui Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PACKAGE STRUCTURE FOR MEMS ELEMENT AND ASIC CHIP AND MET...
- Publication number 20200262700
- Publication date Aug 20, 2020
- J-METRICS TECHNOLOGY Co., Ltd.
- Sheng-Lin Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ALIGNMENT MARK AND SEMICONDUCTOR DEVICE, AND FABRICATION METHODS TH...
- Publication number 20200161251
- Publication date May 21, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Mengbin LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro Devices Formed by Flex Circuit Substrates
- Publication number 20200084892
- Publication date Mar 12, 2020
- ENCITE LLC
- Stephen A. Marsh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COUPLING A MAGNET WITH A MEMS DEVICE
- Publication number 20190391386
- Publication date Dec 26, 2019
- Intel Corporation
- Kyle Yazzie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ASSEMBLY AND PACKAGING OF MEMS DEVICE
- Publication number 20190308874
- Publication date Oct 10, 2019
- InvenSense, Inc.
- Brian H. Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRANSFER HEAD AND METHOD FOR TRANSFERRING MICRO DEVICES
- Publication number 20190267272
- Publication date Aug 29, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELF-CLEANING LIQUID LEVEL SENSOR
- Publication number 20190162578
- Publication date May 30, 2019
- International Business Machines Corporation
- Jonathan Fry
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING WAFERS EUTECTICALLY, AND A WAFER COMPOSITE
- Publication number 20190135617
- Publication date May 9, 2019
- ROBERT BOSCH GmbH
- Axel GROSSE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...
- Publication number 20190092629
- Publication date Mar 28, 2019
- DunAn Microstaq, Inc.
- Wayne C. Long
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...
- Publication number 20190092630
- Publication date Mar 28, 2019
- DunAn Microstaq, Inc.
- Wayne C. Long
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, AND A SEMICONDUCTOR...
- Publication number 20190088493
- Publication date Mar 21, 2019
- Toshiba Memory Corporation
- Shinya WATANABE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Producing Mems Transducer, Mems Transducer, Ultrasound P...
- Publication number 20190008479
- Publication date Jan 10, 2019
- Konica Minolta Inc.
- Yuta Nakayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF ASSEMBLING NANOSCALE AND MICROSCALE OBJECTS INTO THREE-DI...
- Publication number 20180244518
- Publication date Aug 30, 2018
- The Charles Stark Draper Laboratory, Inc.
- Peter Miraglia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...
- Publication number 20180127269
- Publication date May 10, 2018
- DunAn Microstaq, Inc.
- Wayne C. Long
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTROMECHANICAL DEVICE AND CORRESPOND...
- Publication number 20170305739
- Publication date Oct 26, 2017
- TRONIC'S MICROSYSTEMS
- Joël COLLET
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Aligning components to be assembled

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sound producing cell

Laser-assisted material phase-change and expulsion micro-machining...

Sound producing cell and manufacturing method thereof

Capping plate for panel scale packaging of MEMS products

Micro-electromechanical (MEM) power relay

Modular 3-D printed devices for sample delivery and method

Method for producing MEMS transducer, MEMS transducer, ultrasound p...

System and methods for microfabrication

Micro-transfer-printed compound sensor device

MEMS package with roughend interface

Integrated package structure for MEMS element and ASIC chip and met...

Alignment mark and semiconductor device, and fabrication methods th...

Coupling a magnet with a MEMS device

Method for bonding wafers eutectically, and a wafer composite

Methods of achieving universal interfacing using suspended and/or f...

MEMS package with roughend interface

Method for self-aligning solder-attached mems die to a mounting sur...

Method of manufacturing a semiconductor device, and a semiconductor...

Transfer head and method for transferring micro devices

Self-cleaning liquid level sensor

Microscale fluidic devices and components having a fluid retention...

Micro devices formed by flex circuit substrates

Assembly and packaging of MEMS device

Fully wafer-level-packaged MEMS microphone and method for manufactu...

Method and device for producing a microfluidic analysis cartridge

Method for self-aligning solder-attached MEMS die to a mounting sur...

Microfluidic device

Externally induced charge patterning using rectifying devices

Die bond design for medium pressure sensor

Method for manufacturing an electromechanical device and correspond...

Patents Applicationslast 30 patents

WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME

DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE

SOUND PRODUCING CELL

Anchor Structure

PACKAGE STRUCTURE, APPARATUS AND FORMING METHODS THEREOF

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

A PROCESS AND APPARATUS FOR THE PREPARATION OF A BONDED SUBSTRATE

METHOD AND ARRANGEMENT FOR ASSEMBLY OF MICROCHIPS INTO A SEPARATE S...

DEVICE AND METHOD FOR MONITORING SURFACE CONDITION OF CONTACT SURFA...

SEMICONDUCTOR DEVICE

Micro-electromechanical (MEM) Power Relay

Laser-Assisted Material Phase-Change and Expulsion Micro-Machining...

MEMS PACKAGE WITH ROUGHEND INTERFACE

INTEGRATED PACKAGE STRUCTURE FOR MEMS ELEMENT AND ASIC CHIP AND MET...

ALIGNMENT MARK AND SEMICONDUCTOR DEVICE, AND FABRICATION METHODS TH...

Micro Devices Formed by Flex Circuit Substrates

COUPLING A MAGNET WITH A MEMS DEVICE

ASSEMBLY AND PACKAGING OF MEMS DEVICE

TRANSFER HEAD AND METHOD FOR TRANSFERRING MICRO DEVICES

SELF-CLEANING LIQUID LEVEL SENSOR

METHOD FOR BONDING WAFERS EUTECTICALLY, AND A WAFER COMPOSITE

Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...

Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, AND A SEMICONDUCTOR...

Method for Producing Mems Transducer, Mems Transducer, Ultrasound P...

METHOD OF ASSEMBLING NANOSCALE AND MICROSCALE OBJECTS INTO THREE-DI...

Method For Self-Aligning Solder-Attached Mems Die To A Mounting Sur...

METHOD FOR MANUFACTURING AN ELECTROMECHANICAL DEVICE AND CORRESPOND...