Forming micro-structural systems

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS

B81C2203/00Forming micro-structural systems

B81C2203/01Packaging MEMS B81C2203/0109Bonding an individual cap on the substrate B81C2203/0118Bonding a wafer on the substrate B81C2203/0127Using a carrier for applying a plurality of packaging lids to the system wafer B81C2203/0136Growing or depositing of a covering layer B81C2203/0145Hermetically sealing an opening in the lid B81C2203/0154Moulding a cap over the MEMS device B81C2203/0163Reinforcing a cap B81C2203/0172Seals B81C2203/0181Using micro-heaters for bonding the lid B81C2203/019characterised by the material or arrangement of seals between parts B81C2203/03Bonding two components B81C2203/031Anodic bondings B81C2203/032Gluing B81C2203/033Thermal bonding B81C2203/035Soldering B81C2203/036Fusion bonding B81C2203/037Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036 B81C2203/038Bonding techniques not provided for in B81C2203/031 - B81C2203/037 B81C2203/05Aligning components to be assembled B81C2203/051Active alignment B81C2203/052Passive alignment B81C2203/054using structural alignment aids B81C2203/055using the surface tension of fluid solder to align the elements B81C2203/057Passive alignment techniques not provided for in B81C2203/054 - B81C2203/055 B81C2203/058Aligning components using methods not provided for in B81C2203/051 - B81C2203/052 B81C2203/07Integrating an electronic processing unit with a micromechanical structure B81C2203/0707Monolithic integration B81C2203/0714Forming the micromechanical structure with a CMOS process B81C2203/0721Forming the micromechanical structure with a low-temperature process B81C2203/0728Pre-CMOS B81C2203/0735Post-CMOS B81C2203/0742Interleave B81C2203/075the electronic processing unit being integrated into an element of the micromechanical structure B81C2203/0757Topology for facilitating the monolithic integration B81C2203/0764Forming the micromechanical structure in a groove B81C2203/0771Stacking the electronic processing unit and the micromechanical structure B81C2203/0778Topology for facilitating the monolithic integration not provided for in B81C2203/0764 - B81C2203/0771 B81C2203/0785Transfer and j oin technology B81C2203/0792Forming interconnections between the electronic processing unit and the micromechanical structure