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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8512Aligning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods for generating wire loop profiles for wire loops, and metho...
- Patent number 11,289,448
- Issue date Mar 29, 2022
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods of operating wire bonding machines including cl...
- Patent number 10,763,236
- Issue date Sep 1, 2020
- Kulicke and Soffa Industries, Inc.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,741,650
- Issue date Aug 11, 2020
- TOSHIBA MEMORY CORPORATION
- Tsutomu Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for generating wire loop profiles for wire loops, and metho...
- Patent number 10,672,735
- Issue date Jun 2, 2020
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing in complex quantum systems
- Patent number 10,658,340
- Issue date May 19, 2020
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and method of estimating position of landing poin...
- Patent number 10,586,781
- Issue date Mar 10, 2020
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for routing signals in complex quantum systems
- Patent number 10,347,605
- Issue date Jul 9, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for generating wire loop profiles for wire loops, and metho...
- Patent number 10,325,878
- Issue date Jun 18, 2019
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,050,011
- Issue date Aug 14, 2018
- Renesas Electronics Corporation
- Kenya Hironaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire connecting method and terminal
- Patent number 9,716,077
- Issue date Jul 25, 2017
- Toyota Jidosha Kabushiki Kaisha
- Shuhei Horimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,589,923
- Issue date Mar 7, 2017
- Renesas Electronics Corporation
- Kenya Hironaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,130,062
- Issue date Sep 8, 2015
- Renesas Electronics Corporation
- Kenya Hironaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 9,057,501
- Issue date Jun 16, 2015
- LG Innotek Co., Ltd
- Hyun Seok Cho
- F21 - LIGHTING
Information Patent Grant
Method for producing bonding connection of semiconductor device
- Patent number 9,059,182
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Hubert Maier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wire interconnect (TWI) for semiconductor components having...
- Patent number 9,013,044
- Issue date Apr 21, 2015
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,746,537
- Issue date Jun 10, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bonder and a method of cleaning a wedge bonder
- Patent number 8,657,181
- Issue date Feb 25, 2014
- ASM Technology Singapore Pte. Ltd.
- Chi Wah Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor component having through wire interconnect (T...
- Patent number 8,513,797
- Issue date Aug 20, 2013
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having through wire interconnect (TWI) with...
- Patent number 8,193,646
- Issue date Jun 5, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of teaching eyepoints for wire bonding and related semicondu...
- Patent number 8,100,317
- Issue date Jan 24, 2012
- Kulicke and Soffa Industries, Inc.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,091,761
- Issue date Jan 10, 2012
- Shinkawa Ltd.
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of teaching eyepoints for wire bonding and related semicondu...
- Patent number 7,931,186
- Issue date Apr 26, 2011
- Kulicke and Soffa Industries, Inc.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging device and method for a bonding apparatus
- Patent number 7,848,022
- Issue date Dec 7, 2010
- Kabushiki Kaisha Shinkawa
- Shigeru Hayata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of correcting bonding coordinates using reference bond pads
- Patent number 7,817,846
- Issue date Oct 19, 2010
- Samsung Techwin Co., Ltd.
- Yong-bok Chung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor components with through wire interconnects (TWI)
- Patent number 7,786,605
- Issue date Aug 31, 2010
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device handler for a bonding apparatus
- Patent number 7,677,431
- Issue date Mar 16, 2010
- ASM Technology Singapore Pte. Ltd.
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250140740
- Publication date May 1, 2025
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240234331
- Publication date Jul 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136302
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...
- Publication number 20230069967
- Publication date Mar 9, 2023
- Fuji Electric Co., Ltd.
- Nobuhiro HIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20230049088
- Publication date Feb 16, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...
- Publication number 20200251444
- Publication date Aug 6, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS
- Publication number 20190287946
- Publication date Sep 19, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...
- Publication number 20190259730
- Publication date Aug 22, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...
- Publication number 20190214363
- Publication date Jul 11, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME
- Publication number 20190206769
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ROUTING SIGNALS IN COMPLEX QUANTUM SYSTEMS
- Publication number 20190164935
- Publication date May 30, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...
- Publication number 20180005980
- Publication date Jan 4, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE CONNECTING METHOD AND TERMINAL
- Publication number 20170287869
- Publication date Oct 5, 2017
- Toyota Jidosha Kabushiki Kaisha
- Shuhei HORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE CONNECTING METHOD AND TERMINAL
- Publication number 20170077063
- Publication date Mar 16, 2017
- Toyota Jidosha Kabushiki Kaisha
- Shuhei HORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...
- Publication number 20150255444
- Publication date Sep 10, 2015
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140073068
- Publication date Mar 13, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenya HIRONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20140048584
- Publication date Feb 20, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE
- Publication number 20140009941
- Publication date Jan 9, 2014
- Hyun Seok CHO
- F21 - LIGHTING
Information Patent Application
WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER
- Publication number 20130341377
- Publication date Dec 26, 2013
- Chi Wah CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...
- Publication number 20120228781
- Publication date Sep 13, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...
- Publication number 20120024089
- Publication date Feb 2, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jeremiah Couey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...
- Publication number 20110174865
- Publication date Jul 21, 2011
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus and bonding method
- Publication number 20110114704
- Publication date May 19, 2011
- Shinkawa Ltd.
- Kenji Sugawara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Component Having Through Wire Interconnect (TWI) With...
- Publication number 20100264521
- Publication date Oct 21, 2010
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...
- Publication number 20100181365
- Publication date Jul 22, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Michael T. Deley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Imaging device and method for a bonding apparatus
- Publication number 20090124028
- Publication date May 14, 2009
- KABUSHIKI KAISHA SHINKAWA
- Shigeru Hayata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRE BONDING SYSTEM UTILIZING MULTIPLE POSITIONING TABLES
- Publication number 20090078743
- Publication date Mar 26, 2009
- Wing Cheung James HO
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for generating wire loop profiles for wire loops, and metho...

Device and method for positioning first object in relation to secon...

Wire bond clamp design and lead frame capable of engaging with same

Systems and methods of operating wire bonding machines including cl...

Semiconductor device and method of manufacturing the same

Methods for generating wire loop profiles for wire loops, and metho...

Signal routing in complex quantum systems

Bonding apparatus and method of estimating position of landing poin...

Method of manufacturing a semiconductor device

System and method for routing signals in complex quantum systems

Methods for generating wire loop profiles for wire loops, and metho...

Method of manufacturing semiconductor device

Semiconductor device, method of manufacturing a semiconductor devic...

Wire connecting method and terminal

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Light emitting device package

Method for producing bonding connection of semiconductor device

Through wire interconnect (TWI) for semiconductor components having...

Ultrasonic bonding systems and methods of using the same

Wedge bonder and a method of cleaning a wedge bonder

Stacked semiconductor component having through wire interconnect (T...

Semiconductor component having through wire interconnect (TWI) with...

Method of teaching eyepoints for wire bonding and related semicondu...

Bonding apparatus and bonding method

Method of teaching eyepoints for wire bonding and related semicondu...

Imaging device and method for a bonding apparatus

Method of correcting bonding coordinates using reference bond pads

Stacked semiconductor components with through wire interconnects (TWI)

Electronic device handler for a bonding apparatus

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...

SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS

METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...

SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...

WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME

SYSTEM AND METHOD FOR ROUTING SIGNALS IN COMPLEX QUANTUM SYSTEMS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHO...

WIRE CONNECTING METHOD AND TERMINAL

WIRE CONNECTING METHOD AND TERMINAL

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

LIGHT EMITTING DEVICE PACKAGE

WEDGE BONDER AND A METHOD OF CLEANING A WEDGE BONDER

Through Wire Interconnect (TWI) For Semiconductor Components Having...

STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON...

METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...

Bonding apparatus and bonding method

Semiconductor Component Having Through Wire Interconnect (TWI) With...

METHOD OF TEACHING EYEPOINTS FOR WIRE BONDING AND RELATED SEMICONDU...

Imaging device and method for a bonding apparatus

WIRE BONDING SYSTEM UTILIZING MULTIPLE POSITIONING TABLES