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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8112Aligning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,087,727
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Amplifier modules with power transistor die and peripheral ground c...
- Patent number 11,990,384
- Issue date May 21, 2024
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
- Patent number 11,908,820
- Issue date Feb 20, 2024
- Intel Corporation
- Chandramouleeswaran Subramani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnect for semiconductor device assembly
- Patent number 11,810,894
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,764,139
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a protection mechanism and associated sys...
- Patent number 11,756,844
- Issue date Sep 12, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for superconducting multi-chip module
- Patent number 11,711,985
- Issue date Jul 25, 2023
- SeeQC Inc.
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package with dummy solder structure under corner, and relat...
- Patent number 11,682,646
- Issue date Jun 20, 2023
- MARVELL ASIA PTE. LTD.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring and bonding of devices
- Patent number 11,677,060
- Issue date Jun 13, 2023
- ELECTRONICS AND TELEOCMMUNICATIONS RESEARCH INSTITUTE
- Jiho Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with separate die for programmable fabric...
- Patent number 11,632,112
- Issue date Apr 18, 2023
- Intel Corporation
- Ravi Prakash Gutala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 11,631,594
- Issue date Apr 18, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 11,621,173
- Issue date Apr 4, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 11,600,588
- Issue date Mar 7, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing display device
- Patent number 11,552,155
- Issue date Jan 10, 2023
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using optoelectronic semiconductor stamp to manufacture o...
- Patent number 11,538,785
- Issue date Dec 27, 2022
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,515,202
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 11,502,056
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid interconnect for laser bonding using nanoporous metal tips
- Patent number 11,424,214
- Issue date Aug 23, 2022
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 11,355,468
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing and filling containers
- Patent number 11,345,073
- Issue date May 31, 2022
- KHS GmbH
- Ludwig Clüsserath
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
- Patent number 11,322,469
- Issue date May 3, 2022
- Intel Corporation
- Chandramouleeswaran Subramani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,289,372
- Issue date Mar 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package with dummy solder structure under corner, and relat...
- Patent number 11,171,104
- Issue date Nov 9, 2021
- Marvell Asia Pte, Ltd.
- Manish Nayini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20240387335
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20240339432
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...
- Publication number 20240282654
- Publication date Aug 22, 2024
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING
- Publication number 20240178182
- Publication date May 30, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP DIE ALIGNMENT
- Publication number 20230378081
- Publication date Nov 23, 2023
- International Business Machines Corporation
- Effendi Leobandung
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
- Publication number 20230380302
- Publication date Nov 23, 2023
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS
- Publication number 20230352437
- Publication date Nov 2, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device with Separate Die for Programmable Fabric...
- Publication number 20230253965
- Publication date Aug 10, 2023
- Intel Corporation
- Ravi Prakash Gutala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DOUBLE RESIST STRUCTURE FOR ELECTRODEPOSITION BONDING
- Publication number 20230245997
- Publication date Aug 3, 2023
- International Business Machines Corporation
- KOKI NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
- Publication number 20230207507
- Publication date Jun 29, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230063251
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A D...
- Publication number 20220384384
- Publication date Dec 1, 2022
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE
- Publication number 20220375895
- Publication date Nov 24, 2022
- Japan Display Inc.
- Keisuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20220359458
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20220302069
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Method, Semiconductor Assembly and Electron...
- Publication number 20220246576
- Publication date Aug 4, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEURAL RECORDING INTERFACE WITH HYBRID INTEGRATION OF NEURAL PROBE...
- Publication number 20220167901
- Publication date Jun 2, 2022
- The Regents of the University of Michigan
- Sung-Yun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20220013492
- Publication date Jan 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE
- Publication number 20210408355
- Publication date Dec 30, 2021
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20210392752
- Publication date Dec 16, 2021
- ImberaTek LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20210375822
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20210335701
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...
- Publication number 20210328551
- Publication date Oct 21, 2021
- NXP USA, Inc.
- Elie A. Maalouf
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210313225
- Publication date Oct 7, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20210280461
- Publication date Sep 9, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...
- Publication number 20210183716
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20210183811
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20210151543
- Publication date May 20, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chan-Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Joint structure in semiconductor package and manufacturing method t...

Structure and method of forming a joint assembly

Advanced device assembly structures and methods

Amplifier modules with power transistor die and peripheral ground c...

Dual solder methodologies for ultrahigh density first level interco...

Multilayer substrate

Solderless interconnect for semiconductor device assembly

Circuit board structure and method for manufacturing a circuit boar...

Semiconductor device and method

Semiconductor device with a protection mechanism and associated sys...

System and method for superconducting multi-chip module

IC chip package with dummy solder structure under corner, and relat...

Method for transferring and bonding of devices

Integrated circuit device with separate die for programmable fabric...

Fan out structure for light-emitting diode (LED) device and lightin...

Fan out structure for light-emitting diode (LED) device and lightin...

Superconducting bump bonds for quantum computing systems

Method for manufacturing display device

Method and apparatus for embedding semiconductor devices

Method of using optoelectronic semiconductor stamp to manufacture o...

3D IC method and device

Joint structure in semiconductor package and manufacturing method t...

Hybrid interconnect for laser bonding using nanoporous metal tips

Structure and method of forming a joint assembly

Method and device for producing and filling containers

Dual solder methodologies for ultrahigh density first level interco...

Systems and methods for bonding semiconductor elements

3D IC method and device

IC chip package with dummy solder structure under corner, and relat...

Device and method for positioning first object in relation to secon...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

Structure and Method of Forming a Joint Assembly

AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...

APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING

MULTI-CHIP DIE ALIGNMENT

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

HYBRID INTERCONNECT FOR LASER BONDING USING NANOPOROUS METAL TIPS

Integrated Circuit Device with Separate Die for Programmable Fabric...

DOUBLE RESIST STRUCTURE FOR ELECTRODEPOSITION BONDING

Superconducting Bump Bonds for Quantum Computing Systems

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A D...

MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

Structure and Method of Forming a Joint Assembly

Semiconductor Packaging Method, Semiconductor Assembly and Electron...

NEURAL RECORDING INTERFACE WITH HYBRID INTEGRATION OF NEURAL PROBE...

Advanced Device Assembly Structures And Methods

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

SYSTEM AND METHOD FOR SUPERCONDUCTING MULTI-CHIP MODULE

Circuit board structure and method for manufacturing a circuit boar...

SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD

AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...

3D IC METHOD AND DEVICE

3D IC METHOD AND DEVICE

SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYS...

SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY

METHOD FOR MANUFACTURING DISPLAY DEVICE