all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00

Industry

CPC
H01L25/03

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulse signal output circuit and shift register
- Patent number 11,942,170
- Issue date Mar 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Seiko Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging with high density interconnects
- Patent number 11,881,457
- Issue date Jan 23, 2024
- Tahoe Research, LTD.
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through-mold via
- Patent number 11,869,829
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with molding layer
- Patent number 11,756,931
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-rotation feature for bonded stud
- Patent number 11,735,980
- Issue date Aug 22, 2023
- Hamilton Sundstrand Corporation
- Craig J. Wojcik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a stiffener ring
- Patent number 11,728,232
- Issue date Aug 15, 2023
- Mediatek Inc.
- Chi-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package
- Patent number 11,721,618
- Issue date Aug 8, 2023
- TDK Corporation
- Yosuke Komasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,670,548
- Issue date Jun 6, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with controllers under memory packages and associate...
- Patent number 11,658,154
- Issue date May 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,610,858
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process control for package formation
- Patent number 11,587,922
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High electric-thermal performance and high-power density power module
- Patent number 11,569,815
- Issue date Jan 31, 2023
- Zhong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded power device module, processor substrate and electronic sy...
- Patent number 11,552,049
- Issue date Jan 10, 2023
- Infineon Technologies Austria AG
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with multi-layer liner structure
- Patent number 11,538,988
- Issue date Dec 27, 2022
- Intel Corporation
- Santanu Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 11,532,569
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jui-Pin Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fan-out wafer level package structure
- Patent number 11,527,464
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 11,527,454
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with molding layer and method for forming th...
- Patent number 11,469,215
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure and stacked packaging method for chip
- Patent number 11,462,510
- Issue date Oct 4, 2022
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 11,417,580
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,362,046
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulse signal output circuit and shift register
- Patent number 11,348,653
- Issue date May 31, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Seiko Amano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package having a stiffener ring
- Patent number 11,302,592
- Issue date Apr 12, 2022
- Mediatek Inc.
- Chi-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including a heat insulation wall
- Patent number 11,270,923
- Issue date Mar 8, 2022
- SK hynix Inc.
- Min Kyu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and method for forming the same
- Patent number 11,264,342
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin 3D fan-out embedded wafer level package (EWLB) for application...
- Patent number 11,251,154
- Issue date Feb 15, 2022
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
- Publication number 20240145346
- Publication date May 2, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Joo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055394
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- DAEHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...
- Publication number 20230411263
- Publication date Dec 21, 2023
- STATS ChipPAC Pte Ltd.
- SooHan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE
- Publication number 20230402744
- Publication date Dec 14, 2023
- TRON FUTURE TECH INC.
- KUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20230335440
- Publication date Oct 19, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20230326839
- Publication date Oct 12, 2023
- TDK Corporation
- Yosuke KOMASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Control for Package Formation
- Publication number 20230145063
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Wafer Level Package Structure
- Publication number 20230107519
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20230059375
- Publication date Feb 23, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP
- Publication number 20220415856
- Publication date Dec 29, 2022
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSE SIGNAL OUTPUT CIRCUIT AND SHIFT REGISTER
- Publication number 20220284976
- Publication date Sep 8, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Seiko Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A STIFFENER RING
- Publication number 20220262691
- Publication date Aug 18, 2022
- MEDIA TEK INC.
- Chi-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating Passive Devices in Package Structures
- Publication number 20220139885
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE W...
- Publication number 20220115331
- Publication date Apr 14, 2022
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATION, MANUFACTURE AND PRODUCTION OF ENERGY HARVE...
- Publication number 20220029082
- Publication date Jan 27, 2022
- FACE INTERNATIONAL CORPORATION
- Clark D BOYD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20220013460
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods of Forming the Same
- Publication number 20210327778
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH HIGH DENSITY INTERCONNECTS
- Publication number 20210193583
- Publication date Jun 24, 2021
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Si-substrate-free Interposer and Method Forming Same
- Publication number 20210082857
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20210043511
- Publication date Feb 11, 2021
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Wafer Level Package Structure
- Publication number 20210028097
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20210020552
- Publication date Jan 21, 2021
- TDK Corporation
- Yosuke KOMASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Control for Package Formation
- Publication number 20210005595
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods of Forming the Same
- Publication number 20200402877
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MOLDING LAYER
- Publication number 20200365563
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
- Publication number 20200343163
- Publication date Oct 29, 2020
- Amkor Technology Singapore Holding Pte. Ltd
- Dong Joo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP
- Publication number 20200328191
- Publication date Oct 15, 2020
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE
- Publication number 20200321287
- Publication date Oct 8, 2020
- SKYWORKS SOLUTIONS, INC.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200294936
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure and method for fabricating a computing system with an int...

Devices and methods related to dual-sided radio-frequency package w...

Pulse signal output circuit and shift register

Semiconductor packaging with high density interconnects

Semiconductor device with through-mold via

Wire bond wires for interference shielding

Chip package structure with molding layer

Anti-rotation feature for bonded stud

Semiconductor package having a stiffener ring

Electronic component package

Structure and method for fabricating a computing system with an int...

Memory devices with controllers under memory packages and associate...

Packages with Si-substrate-free interposer and method forming same

Process control for package formation

High electric-thermal performance and high-power density power module

Embedded power device module, processor substrate and electronic sy...

Memory device with multi-layer liner structure

Method for manufacturing semiconductor package structure

Fan-out wafer level package structure

Package structures and methods of forming the same

Chip package structure with molding layer and method for forming th...

Stacked package structure and stacked packaging method for chip

Wire bond wires for interference shielding

Package structures and methods of forming the same

Semiconductor package

Pulse signal output circuit and shift register

Semiconductor package having a stiffener ring

Semiconductor packages including a heat insulation wall

Package on package structure and method for forming the same

Thin 3D fan-out embedded wafer level package (EWLB) for application...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA

SEMICONDUCTOR PACKAGE

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...

ANTENNA PACKAGE STRUCTURE

Structure and Method for Fabricating a Computing System with an Int...

ELECTRONIC COMPONENT PACKAGE

Process Control for Package Formation

Fan-Out Wafer Level Package Structure

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP

PULSE SIGNAL OUTPUT CIRCUIT AND SHIFT REGISTER

SEMICONDUCTOR PACKAGE HAVING A STIFFENER RING

Integrating Passive Devices in Package Structures

DEVICES AND METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE W...

METHODS FOR FABRICATION, MANUFACTURE AND PRODUCTION OF ENERGY HARVE...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

Package Structures and Methods of Forming the Same

SEMICONDUCTOR PACKAGING WITH HIGH DENSITY INTERCONNECTS

Packages with Si-substrate-free Interposer and Method Forming Same

Structure and Method for Fabricating a Computing System with an Int...

Fan-Out Wafer Level Package Structure

ELECTRONIC COMPONENT PACKAGE

Process Control for Package Formation

Package Structures and Methods of Forming the Same

CHIP PACKAGE STRUCTURE WITH MOLDING LAYER

SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA

STACKED PACKAGE STRUCTURE AND STACKED PACKAGING METHOD FOR CHIP

DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD STRUCTURE

SEMICONDUCTOR PACKAGE