Aluminium [Al] as principal constituent

Industry

CPC
H01L2224/80424

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80424Aluminium [Al] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Atomic level bonding for electronics packaging
- Patent number 8,754,512
- Issue date Jun 17, 2014
- Delphi Technologies, Inc.
- Ralph S. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240393653
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250039
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250038
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230154877
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPSET AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230130460
- Publication date Apr 27, 2023
- Shanghai Biren Technology Co.,Ltd
- Shiqun GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LEVEL BONDING FOR ELECTRONICS PACKAGING
- Publication number 20140151864
- Publication date Jun 5, 2014
- Delphi Technologies, Inc.
- Ralph S. TAYLOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100071946
- Publication date Mar 25, 2010
- SEIKO EPSON CORPORATION
- Nobuaki HASHIMOTO
- G02 - OPTICS

Aluminium [Al] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Atomic level bonding for electronics packaging

Electronic component mounting structure

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

CHIPSET AND METHOD OF MANUFACTURING THE SAME

ATOMIC LEVEL BONDING FOR ELECTRONICS PACKAGING

ELECTRONIC COMPONENT MOUNTING STRUCTURE