Aluminium [Al] as principal constituent

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H01L2224/13624

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13624Aluminium [Al] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Serializer-deserializer die for high speed signal interconnect
- Patent number 11,581,282
- Issue date Feb 14, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,121,106
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 10,867,810
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 10,748,785
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,312,216
- Issue date Jun 4, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic element with bond elements to encapsulation surface
- Patent number 10,008,477
- Issue date Jun 26, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a hybridized device including microelectronic c...
- Patent number 10,002,842
- Issue date Jun 19, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,905,530
- Issue date Feb 27, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient interface gradient bonding for metal bonds
- Patent number 9,865,565
- Issue date Jan 9, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 9,780,063
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 9,741,589
- Issue date Aug 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,721,915
- Issue date Aug 1, 2017
- Mitsubishi Electric Corporation
- Motoru Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,640,455
- Issue date May 2, 2017
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,633,981
- Issue date Apr 25, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 9,368,390
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,355,974
- Issue date May 31, 2016
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,355,988
- Issue date May 31, 2016
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,142,516
- Issue date Sep 22, 2015
- SOCIONEXT INC.
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 9,117,825
- Issue date Aug 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 8,835,301
- Issue date Sep 16, 2014
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube contact structures for use with semiconductor dies...
- Patent number 8,756,802
- Issue date Jun 24, 2014
- FormFactor, Inc.
- John K. Gritters
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Circuit board, fabricating method thereof and package structure
- Patent number 8,674,503
- Issue date Mar 18, 2014
- Himax Technologies Limited
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus including a metal alloy between a first con...
- Patent number 8,378,490
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor element, method for manufacturing the same, and mount...
- Patent number 8,330,271
- Issue date Dec 11, 2012
- Kyocera Corporation
- Kenichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor mounting module, mobile communica...
- Patent number 8,324,623
- Issue date Dec 4, 2012
- Panasonic Corporation
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234357
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGWEON SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR FOR CONDUCTIVE CONNECTION
- Publication number 20240088079
- Publication date Mar 14, 2024
- DUKSAN HI-METAL CO., LTD.
- Eun Dong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210134749
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERIALIZER-DESERIALIZER DIE FOR HIGH SPEED SIGNAL INTERCONNECT
- Publication number 20200075521
- Publication date Mar 5, 2020
- Intel Corporation
- Adel A. Elsherbini
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180182733
- Publication date Jun 28, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Pad Structure
- Publication number 20170345677
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE
- Publication number 20170194277
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Keji Matsumodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20170179072
- Publication date Jun 22, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160358874
- Publication date Dec 8, 2016
- Mitsubishi Electric Corporation
- Motoru YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20160254252
- Publication date Sep 1, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20140319680
- Publication date Oct 30, 2014
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Pad Structure
- Publication number 20140159203
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
- Publication number 20140075747
- Publication date Mar 20, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon Nanotube Contact Structures For Use With Semiconductor Dies...
- Publication number 20130140057
- Publication date Jun 6, 2013
- FormFactor, Inc.
- John K. Gritters
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20130130496
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE
- Publication number 20130087906
- Publication date Apr 11, 2013
- Pai-Sheng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20130026649
- Publication date Jan 31, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Masashi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120299197
- Publication date Nov 29, 2012
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20120235301
- Publication date Sep 20, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20120217640
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICA...
- Publication number 20110180900
- Publication date Jul 28, 2011
- PANASONIC CORPORATION
- Koichi HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE CONTACT STRUCTURES FOR USE WITH SEMICONDUCTOR DIES...
- Publication number 20100252317
- Publication date Oct 7, 2010
- FormFactor, Inc.
- John K. Gritters
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Element, Method for Manufacturing the Same, and Mount...
- Publication number 20100252926
- Publication date Oct 7, 2010
- KYOCERA CORPORATION
- Kenichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICA...
- Publication number 20100164061
- Publication date Jul 1, 2010
- Koichi Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...
- Publication number 20090275191
- Publication date Nov 5, 2009
- Jonas R Weiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING SEMICONDUCTOR DEVICE, AS WELL AS CIRCUIT BOARD,...
- Publication number 20090242122
- Publication date Oct 1, 2009
- SEIKO EPSON CORPORATION
- Shuichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20090115054
- Publication date May 7, 2009
- SEIKO EPSON CORPORATION
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light-emitting diode chip package body and packaging method thereof
- Publication number 20080173888
- Publication date Jul 24, 2008
- Yu-Nung Shen
- H01 - BASIC ELECTRIC ELEMENTS

Aluminium [Al] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Serializer-deserializer die for high speed signal interconnect

Integrated circuit package and method

Substrate pad structure

Substrate pad structure

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Microelectronic element with bond elements to encapsulation surface

Method of producing a hybridized device including microelectronic c...

Bonding structure for semiconductor package and method of manufactu...

Systems and methods for bonding semiconductor elements

Transient interface gradient bonding for metal bonds

Semiconductor device and method of forming bump structure with insu...

Substrate pad structure

Semiconductor device

Semiconductor packages

Bump electrode, board which has bump electrodes, and method for man...

Semiconductor device

Systems and methods for bonding semiconductor elements

Flip-chip assembly process comprising pre-coating interconnect elem...

Semiconductor apparatus

Semiconductor device and manufacturing method therefor

Semiconductor device

Semiconductor device and manufacturing method therefor

Substrate pad structure

Semiconductor device and method of forming bump structure with insu...

Carbon nanotube contact structures for use with semiconductor dies...

Circuit board, fabricating method thereof and package structure

Semiconductor apparatus including a metal alloy between a first con...

Semiconductor element, method for manufacturing the same, and mount...

Semiconductor chip, semiconductor mounting module, mobile communica...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

METAL PILLAR FOR CONDUCTIVE CONNECTION

SEMICONDUCTOR PACKAGE

Integrated Circuit Package and Method

SERIALIZER-DESERIALIZER DIE FOR HIGH SPEED SIGNAL INTERCONNECT

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

Substrate Pad Structure

ELECTRICAL CONNECTING STRUCTURE

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

Semiconductor Device and Method of Forming Bump Structure with Insu...

Substrate Pad Structure

CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS

Carbon Nanotube Contact Structures For Use With Semiconductor Dies...

SEMICONDUCTOR APPARATUS

CIRCUIT BOARD, FABRICATING METHOD THEREOF AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR APPARATUS

Semiconductor Device and Method of Forming Bump Structure with Insu...

SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICA...

CARBON NANOTUBE CONTACT STRUCTURES FOR USE WITH SEMICONDUCTOR DIES...

Semiconductor Element, Method for Manufacturing the Same, and Mount...

SEMICONDUCTOR CHIP, SEMICONDUCTOR MOUNTING MODULE, MOBILE COMMUNICA...

METHOD AND APPARATUS FOR ELECTROSTATIC DISCHARGE PROTECTION USING A...

METHOD FOR MOUNTING SEMICONDUCTOR DEVICE, AS WELL AS CIRCUIT BOARD,...

ELECTRONIC COMPONENT

Light-emitting diode chip package body and packaging method thereof