Aluminium [Al] as principal constituent

Industry

CPC
H01L2924/16724

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/16724Aluminium [Al] as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Embedded lid for low cost and improved thermal performance
- Patent number 12,021,004
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,011,431
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,777,467
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive sheet, production method for thermally conduct...
- Patent number 10,526,519
- Issue date Jan 7, 2020
- Dexerials Corporation
- Hiroki Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit including a switch-mode regulator and m...
- Patent number 10,103,627
- Issue date Oct 16, 2018
- Altera Corporation
- Teik Wah Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,991,184
- Issue date Jun 5, 2018
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packages and methods of manufacture thereof
- Patent number 9,735,130
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 9,716,049
- Issue date Jul 25, 2017
- SOCIONEXT INC.
- Kazuyuki Urago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,640,518
- Issue date May 2, 2017
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper nanorod-based thermal interface material (TIM)
- Patent number 9,601,406
- Issue date Mar 21, 2017
- Intel Corporation
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,449,946
- Issue date Sep 20, 2016
- Amkor Technology, Inc.
- Pil Je Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with package-on-package stacking capability a...
- Patent number 9,318,411
- Issue date Apr 19, 2016
- BRODGE SEMICONDUCTOR CORPORATION
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned integrated circuit device and manufacturing process for the...
- Patent number 9,252,054
- Issue date Feb 2, 2016
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging devices and methods
- Patent number 8,810,028
- Issue date Aug 19, 2014
- Xilinx, Inc.
- Nael Zohni
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...
- Publication number 20230395450
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LID FOR LOW COST AND IMPROVED THERMAL PERFORMANCE
- Publication number 20220319950
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Hiep Xuan Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200411385
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200066598
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING FUNCTION AND HEAT DISSIP...
- Publication number 20140328023
- Publication date Nov 6, 2014
- Samsung Electronics Co., Ltd.
- IN-HO CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140284785
- Publication date Sep 25, 2014
- Amkor Technology, Inc.
- Pil Je Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)
- Publication number 20140246770
- Publication date Sep 4, 2014
- Chandra M. Jha
- H01 - BASIC ELECTRIC ELEMENTS

Aluminium [Al] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded lid for low cost and improved thermal performance

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Thermally conductive sheet, production method for thermally conduct...

Packaged integrated circuit including a switch-mode regulator and m...

Electronic module and method of manufacturing the same

Chip packages and methods of manufacture thereof

Semiconductor device and manufacturing method of semiconductor device

Semiconductor package with package-on-package stacking capability a...

Copper nanorod-based thermal interface material (TIM)

Semiconductor device and manufacturing method thereof

Semiconductor package with package-on-package stacking capability a...

Thinned integrated circuit device and manufacturing process for the...

Integrated circuit packaging devices and methods

Patents Applicationslast 30 patents

REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE...

EMBEDDED LID FOR LOW COST AND IMPROVED THERMAL PERFORMANCE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING FUNCTION AND HEAT DISSIP...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM)