Aluminium [Al] as principal constituent

Industry

CPC
H01L2924/17724

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/17724Aluminium [Al] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,410,996
- Issue date Sep 10, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,332,864
- Issue date Jun 25, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof electronic device and manufacturing method thereof
- Patent number 9,852,962
- Issue date Dec 26, 2017
- Hitachi Automotive Systems, Ltd.
- Hiroyuki Temmei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for stabilizing leads in wire-bonded semicondu...
- Patent number 9,824,959
- Issue date Nov 21, 2017
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with integrated inductor
- Patent number 9,768,099
- Issue date Sep 19, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,640,455
- Issue date May 2, 2017
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal base substrate, power module, and method for manufacturing me...
- Patent number 9,578,754
- Issue date Feb 21, 2017
- Mitsubishi Electric Corporation
- Mariko Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,373,572
- Issue date Jun 21, 2016
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 9,356,002
- Issue date May 31, 2016
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,355,988
- Issue date May 31, 2016
- Rohm Co., Ltd.
- Kenji Fujii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEMS WITH ANTI-WARPAGE MECHANISMS AND ASSOCIATED S...
- Publication number 20230290738
- Publication date Sep 14, 2023
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package For Assembling Various Dice In A Single...
- Publication number 20180158804
- Publication date Jun 7, 2018
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR STABILIZING LEADS IN WIRE-BONDED SEMICONDU...
- Publication number 20170278776
- Publication date Sep 28, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20170229371
- Publication date Aug 10, 2017
- Denso Corporation
- Shinji HIRAMITSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Waterproof Electronic Device and Manufacturing Method Thereof
- Publication number 20160343636
- Publication date Nov 24, 2016
- Hitachi Automotive Systems, Ltd.
- Hiroyuki TEMMEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160233150
- Publication date Aug 11, 2016
- Kabushiki Kaisha Toshiba
- Takeshi FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPOND...
- Publication number 20160099200
- Publication date Apr 7, 2016
- STMicroelectronics S.r.l.
- Laura Ceriati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having Etched Foil Capacitor Integrated Into...
- Publication number 20160035655
- Publication date Feb 4, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150357269
- Publication date Dec 10, 2015
- Yunhyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BASE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING ME...
- Publication number 20150332982
- Publication date Nov 19, 2015
- Mitsubishi Electric Corporation
- Mariko ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150294928
- Publication date Oct 15, 2015
- ROHM CO., LTD.
- Kenji FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...
- Publication number 20150255444
- Publication date Sep 10, 2015
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS

Aluminium [Al] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit package for assembling various dice in a single...

Method of manufacturing a semiconductor device

Integrated circuit package for assembling various dice in a single...

Semiconductor device, method of manufacturing a semiconductor devic...

Waterproof electronic device and manufacturing method thereof

Structure and method for stabilizing leads in wire-bonded semicondu...

IC package with integrated inductor

Semiconductor device

Metal base substrate, power module, and method for manufacturing me...

Semiconductor package having etched foil capacitor integrated into...

Semiconductor package and method for manufacturing the same

Semiconductor device

Patents Applicationslast 30 patents

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

SEMICONDUCTOR SYSTEMS WITH ANTI-WARPAGE MECHANISMS AND ASSOCIATED S...

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Integrated Circuit Package For Assembling Various Dice In A Single...

STRUCTURE AND METHOD FOR STABILIZING LEADS IN WIRE-BONDED SEMICONDU...

ELECTRONIC DEVICE

Waterproof Electronic Device and Manufacturing Method Thereof

SEMICONDUCTOR DEVICE

ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPOND...

Semiconductor Package Having Etched Foil Capacitor Integrated Into...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METAL BASE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING ME...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...