Aluminium gallium nitride [AlGaN]

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H01L2924/10344

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/10344Aluminium gallium nitride [AlGaN]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,094,956
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,062,651
- Issue date Aug 13, 2024
- Kabushiki Kaisha Toshiba
- Yasuhiro Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for RF transistor amplifiers
- Patent number 11,837,457
- Issue date Dec 5, 2023
- Wolfspeed, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 11,817,494
- Issue date Nov 14, 2023
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor and semiconductor device
- Patent number 11,749,622
- Issue date Sep 5, 2023
- SUMITOMO DEVICE INNOVATIONS, INC.
- Chihoko Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,710,778
- Issue date Jul 25, 2023
- United Microelectronics Corp.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,367,994
- Issue date Jun 21, 2022
- Nichia Corporation
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for providing electrical isolation in semiconductor devices
- Patent number 11,296,055
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,289,407
- Issue date Mar 29, 2022
- Vanguard International Semiconductor Corporation
- Chih-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 11,270,967
- Issue date Mar 8, 2022
- Sumitomo Electric Device Innovations, Inc.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor substrate
- Patent number 11,201,217
- Issue date Dec 14, 2021
- COORSTEK KK
- Kenichi Eriguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor and semiconductor device
- Patent number 11,081,452
- Issue date Aug 3, 2021
- Sumitomo Electric Device Innovations, Inc.
- Chihoko Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,965,097
- Issue date Mar 30, 2021
- Nichia Corporation
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction semiconductor device for reducing parasitic capacitance
- Patent number 10,950,524
- Issue date Mar 16, 2021
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 10,910,491
- Issue date Feb 2, 2021
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing high electron mobility transistor (HEMT)
- Patent number 10,861,947
- Issue date Dec 8, 2020
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction semiconductor device having source and drain pads wi...
- Patent number 10,833,185
- Issue date Nov 10, 2020
- Delta Electronics, Inc.
- Wen-Chia Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor relay
- Patent number 10,818,815
- Issue date Oct 27, 2020
- Panasonic Corporation
- Daisuke Shibata
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High electron mobility transistor (HEMT)
- Patent number 10,707,311
- Issue date Jul 7, 2020
- RFHIC CORPORATION
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device integrated with ESD protection circuit u...
- Patent number 10,665,709
- Issue date May 26, 2020
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,608,406
- Issue date Mar 31, 2020
- Nichia Corporation
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction semiconductor device for reducing parasitic capacitance
- Patent number 10,573,736
- Issue date Feb 25, 2020
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement-mode III-nitride devices
- Patent number 10,535,763
- Issue date Jan 14, 2020
- Transphorm Inc.
- Rakesh K. Lal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with first and second transistors and support...
- Patent number 10,535,625
- Issue date Jan 14, 2020
- Rohm Co., Ltd.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for providing electrical isolation in semico...
- Patent number 10,504,874
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction semiconductor device for reducing parasitic capacitance
- Patent number 10,468,516
- Issue date Nov 5, 2019
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor and manufacturing method thereof
- Patent number 10,242,963
- Issue date Mar 26, 2019
- National Tsing Hua University
- Yu-Lin Wang
- G01 - MEASURING TESTING
Information Patent Grant
Heterojunction semiconductor device for reducing parasitic capacitance
- Patent number 10,236,236
- Issue date Mar 19, 2019
- Delta Electronics, Inc.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of making a semiconductor device
- Patent number 10,224,443
- Issue date Mar 5, 2019
- RayVio Corporation
- Douglas A. Collins
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240395909
- Publication date Nov 28, 2024
- UNITED MICROELECTRONICS CORP.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030338
- Publication date Jan 25, 2024
- Ancora Semiconductors Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures for Providing Electrical Isolation in Semiconductor Devices
- Publication number 20220271015
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220077131
- Publication date Mar 10, 2022
- Kabushiki Kaisha Toshiba
- Yasuhiro Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210398883
- Publication date Dec 23, 2021
- Vanguard International Semiconductor Corporation
- Chih-Yen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210098617
- Publication date Apr 1, 2021
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROCESSING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)
- Publication number 20200287004
- Publication date Sep 10, 2020
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20200279822
- Publication date Sep 3, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures for Providing Electrical Isolation in Semiconductor Devices
- Publication number 20200066685
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterojunction Semiconductor Device for Reducing Parasitic Capacitance
- Publication number 20200020791
- Publication date Jan 16, 2020
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190386128
- Publication date Dec 19, 2019
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)
- Publication number 20190115435
- Publication date Apr 18, 2019
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190043825
- Publication date Feb 7, 2019
- ROHM CO., LTD.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterojunction Semiconductor Device for Reducing Parasitic Capacitance
- Publication number 20190006504
- Publication date Jan 3, 2019
- Delta Electronics, Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCEMENT-MODE III-NITRIDE DEVICES
- Publication number 20180315843
- Publication date Nov 1, 2018
- TRANSPHORM INC.
- Rakesh K. Lal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DIAMOND-SEMICONDUCTOR COMPOSITE SUBSTRATES
- Publication number 20180151404
- Publication date May 31, 2018
- RFHIC Corporation
- Daniel FRANCIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR PROVIDING ELECTRICAL ISOLATION IN SEMICO...
- Publication number 20180033776
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180026125
- Publication date Jan 25, 2018
- Delta Electronics, Inc.
- Wen-Chia LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mount Device Package Having Improved Reliability
- Publication number 20170278764
- Publication date Sep 28, 2017
- Infineon Technologies Americas Corp.
- Wayne Partington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20170248590
- Publication date Aug 31, 2017
- National Tsing-Hua University
- Yu-Lin Wang
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MAKING A SEMICONDUCTOR DEVICE
- Publication number 20170222075
- Publication date Aug 3, 2017
- RayVio Corporation
- Douglas A. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170077013
- Publication date Mar 16, 2017
- Akira MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Package with Conductive Carr...
- Publication number 20150348887
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Integrated Heat Spreader
- Publication number 20150348888
- Publication date Dec 3, 2015
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...
- Publication number 20150200265
- Publication date Jul 16, 2015
- Sumitomo Electric Industries, Ltd.
- Tetsuya Kumano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Conductive Clips
- Publication number 20150194369
- Publication date Jul 9, 2015
- International Rectifier Corporation
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR COOLING THREE-DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20150060039
- Publication date Mar 5, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- HUI-YU LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chromium/Titanium/Aluminum-based Semiconductor Device Contact
- Publication number 20140308766
- Publication date Oct 16, 2014
- SENSOR ELECTRONIC TECHNOLOGY, INC.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Multiple Conductive Clips
- Publication number 20140175630
- Publication date Jun 26, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS

Aluminium gallium nitride [AlGaN]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Semiconductor device

Semiconductor device including source pad region and drain pad regi...

Packaging for RF transistor amplifiers

Semiconductor device having reduced capacitance between source and...

Field effect transistor and semiconductor device

Semiconductor device and method for fabricating the same

Light emitting device

Structures for providing electrical isolation in semiconductor devices

Package structure

Method for manufacturing semiconductor device and semiconductor device

Nitride semiconductor substrate

Field effect transistor and semiconductor device

Light emitting device

Heterojunction semiconductor device for reducing parasitic capacitance

Semiconductor device having reduced capacitance between source and...

Methods for processing high electron mobility transistor (HEMT)

Heterojunction semiconductor device having source and drain pads wi...

Semiconductor relay

High electron mobility transistor (HEMT)

Power semiconductor device integrated with ESD protection circuit u...

Light emitting device

Heterojunction semiconductor device for reducing parasitic capacitance

Enhancement-mode III-nitride devices

Semiconductor device with first and second transistors and support...

Structures and methods for providing electrical isolation in semico...

Heterojunction semiconductor device for reducing parasitic capacitance

Sensor and manufacturing method thereof

Heterojunction semiconductor device for reducing parasitic capacitance

Semiconductor device and a method of making a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Structures for Providing Electrical Isolation in Semiconductor Devices

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

METHODS FOR PROCESSING HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Structures for Providing Electrical Isolation in Semiconductor Devices

Heterojunction Semiconductor Device for Reducing Parasitic Capacitance

SEMICONDUCTOR DEVICE

HIGH ELECTRON MOBILITY TRANSISTOR (HEMT)

SEMICONDUCTOR DEVICE

Heterojunction Semiconductor Device for Reducing Parasitic Capacitance

ENHANCEMENT-MODE III-NITRIDE DEVICES

METHOD OF FABRICATING DIAMOND-SEMICONDUCTOR COMPOSITE SUBSTRATES

STRUCTURES AND METHODS FOR PROVIDING ELECTRICAL ISOLATION IN SEMICO...

SEMICONDUCTOR DEVICE

Surface Mount Device Package Having Improved Reliability

SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND A METHOD OF MAKING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Method for Fabricating a Semiconductor Package with Conductive Carr...

Semiconductor Package with Integrated Heat Spreader

SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING S...

Semiconductor Package with Conductive Clips

STRUCTURE AND METHOD FOR COOLING THREE-DIMENSIONAL INTEGRATED CIRCUITS

Chromium/Titanium/Aluminum-based Semiconductor Device Contact

Semiconductor Package with Multiple Conductive Clips