Ambient temperature

Industry

CPC
H01L2224/81099

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81099Ambient temperature

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a chip to a wafer
- Patent number 10,249,593
- Issue date Apr 2, 2019
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a hybridized device including microelectronic c...
- Patent number 10,002,842
- Issue date Jun 19, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Francois Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality electrical contacts between integrated circuit chips
- Patent number 9,646,882
- Issue date May 9, 2017
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality electrical contacts between integrated circuit chips
- Patent number 9,490,212
- Issue date Nov 8, 2016
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 9,397,063
- Issue date Jul 19, 2016
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Flip-chip assembly process for connecting two components to each other
- Patent number 9,368,472
- Issue date Jun 14, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Baptiste Goubault de Brugiere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages with nanoparticle joining
- Patent number 8,580,607
- Issue date Nov 12, 2013
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of packaging and interconnection of integrated circuits
- Patent number 7,964,964
- Issue date Jun 21, 2011
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of packaging and interconnection of integrated circuits
- Patent number 7,618,844
- Issue date Nov 17, 2009
- Intelleflex Corporation
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...
- Publication number 20210227735
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20210227734
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Tin-Based Contacting Metal
- Publication number 20210227732
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20210227733
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20210219474
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20210219475
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20180132397
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Silver-Based Contacting M...
- Publication number 20180132398
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Indium-Based Contacting M...
- Publication number 20180132395
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20180132396
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20180132394
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
System for Low-Force Thermocompression Bonding
- Publication number 20180132393
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20180132399
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
A METHOD FOR BONDING A CHIP TO A WAFER
- Publication number 20170084570
- Publication date Mar 23, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
- Publication number 20150243624
- Publication date Aug 27, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
- Publication number 20140077351
- Publication date Mar 20, 2014
- Tessera, Inc.
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Application
CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS
- Publication number 20140075747
- Publication date Mar 20, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François MARION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Assembly Process for Connecting Two Components to Each Other
- Publication number 20140038355
- Publication date Feb 6, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Baptiste Goubault de Brugiere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...
- Publication number 20130270329
- Publication date Oct 17, 2013
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
- Publication number 20120025365
- Publication date Feb 2, 2012
- Tessera Research LLC
- Belgacem Haba
- B82 - NANO-TECHNOLOGY
Information Patent Application
ROOM TEMPERATURE DIRECT METAL-METAL BONDING
- Publication number 20110226841
- Publication date Sep 22, 2011
- Jun Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High quality electrical contacts between integrated circuit chips
- Publication number 20100270674
- Publication date Oct 28, 2010
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging and interconnection of integrated circuits
- Publication number 20100038770
- Publication date Feb 18, 2010
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of packaging and interconnection of integrated circuits
- Publication number 20070040272
- Publication date Feb 22, 2007
- INTELLEFLEX CORPORATION
- James Sheats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ambient temperature

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

3D packaging with low-force thermocompression bonding of oxidizable...

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Method for bonding a chip to a wafer

Method of producing a hybridized device including microelectronic c...

High quality electrical contacts between integrated circuit chips

High quality electrical contacts between integrated circuit chips

Flip-chip assembly process comprising pre-coating interconnect elem...

Microelectronic packages with nanoparticle joining

Flip-chip assembly process for connecting two components to each other

Microelectronic packages with nanoparticle joining

Method of packaging and interconnection of integrated circuits

Method of packaging and interconnection of integrated circuits

Patents Applicationslast 30 patents

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

Structures And Methods For Low Temperature Bonding Using Nanoparticles

THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Tin-Based Contacting Metal

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

Structures And Methods For Low Temperature Bonding Using Nanoparticles

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Silver-Based Contacting M...

Thermocompression Bonding with Passivated Indium-Based Contacting M...

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

System for Low-Force Thermocompression Bonding

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

A METHOD FOR BONDING A CHIP TO A WAFER

MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING

MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING

CONNECTING COMPONENT EQUIPPED WITH HOLLOW INSERTS

Flip-Chip Assembly Process for Connecting Two Components to Each Other

3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...

MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

High quality electrical contacts between integrated circuit chips

Method of packaging and interconnection of integrated circuits

Method of packaging and interconnection of integrated circuits