Anchoring

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CPC
H05K2201/2072

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/2072Anchoring

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming an electronic device
- Patent number 11,432,448
- Issue date Aug 30, 2022
- KEMET Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated flexible printed circuit with routing channel/aid
- Patent number 11,412,619
- Issue date Aug 9, 2022
- Aptiv Technologies Limited
- David R. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a flat device
- Patent number 11,406,020
- Issue date Aug 2, 2022
- IMEC VZW
- Jan Vanfleteren
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Display panel and display apparatus
- Patent number 11,337,308
- Issue date May 17, 2022
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Chunghao Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer substrate and method for manufacturing multi-layer subs...
- Patent number 11,289,403
- Issue date Mar 29, 2022
- Shinko Electric Industries Co., Ltd.
- Misaki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printable 3D electronic structure
- Patent number 11,064,609
- Issue date Jul 13, 2021
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and assembly
- Patent number 10,993,344
- Issue date Apr 27, 2021
- FANUC CORPORATION
- Ryou Matsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing structure of cable to wiring substrate, and cable, and manuf...
- Patent number 10,855,010
- Issue date Dec 1, 2020
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with heat sink
- Patent number 10,785,864
- Issue date Sep 22, 2020
- Amazon Technologies, Inc.
- William Mische
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Component stability structure
- Patent number 10,729,051
- Issue date Jul 28, 2020
- KEMET Electronics Corporation
- John E. McConnell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module having circuit boards and a plastic sealing ring...
- Patent number 10,721,819
- Issue date Jul 21, 2020
- Robert Bosch GmbH
- Uwe Liskow
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Implantable electrode and method of making the same
- Patent number 10,688,298
- Issue date Jun 23, 2020
- NeuroNexus Technologies, Inc.
- David S. Pellinen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 10,492,288
- Issue date Nov 26, 2019
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Simon Sebanz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Light source module, fabrication method therefor, and lighting devi...
- Patent number 10,401,015
- Issue date Sep 3, 2019
- LG Electronics Inc.
- Jaepyo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastening device for joining circuit boards and electronic device u...
- Patent number 10,299,380
- Issue date May 21, 2019
- HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
- Wen-Hu Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plastic component with at least one electrical contact element and...
- Patent number 10,237,972
- Issue date Mar 19, 2019
- Krallmann Kunststoffverarbeitung GmbH
- Eduard Engelmann
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic module with a component which can be flexibly placed by...
- Patent number 10,237,979
- Issue date Mar 19, 2019
- Robert Bosch GmbH
- Uwe Liskow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device module and manufacturing method thereof
- Patent number 10,219,380
- Issue date Feb 26, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer wiring substrate
- Patent number 10,165,691
- Issue date Dec 25, 2018
- Hitachi Chemical Company, Ltd.
- Nobuyuki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Roller structure and method of using the same
- Patent number 10,155,413
- Issue date Dec 18, 2018
- Dtech Precision Industries Co., Ltd.
- Ting-Jui Wang
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for manufacturing multilayer wiring substrate
- Patent number 10,076,044
- Issue date Sep 11, 2018
- Hitachi Chemical Company, Ltd.
- Nobuyuki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, electronic component device, method for manufacturing...
- Patent number 10,049,972
- Issue date Aug 14, 2018
- Shinko Electric Industries Co., Ltd.
- Kentaro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and mounting structure using the same
- Patent number 9,936,583
- Issue date Apr 3, 2018
- KYOCERA Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the metallation of a workpiece and a layer structure mad...
- Patent number 9,924,601
- Issue date Mar 20, 2018
- LPKF Laser & Electronics AG
- Roman Ostholt
- B44 - DECORATIVE ARTS
Information Patent Grant
Wiring board and mounting structure using same
- Patent number 9,877,387
- Issue date Jan 23, 2018
- KYOCERA Corporation
- Satoshi Kajita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with cavity for built-in electronic component and meth...
- Patent number 9,832,878
- Issue date Nov 28, 2017
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 9,795,025
- Issue date Oct 17, 2017
- AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Simon Sebanz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded three-layer patterned ground structure
- Patent number 9,786,331
- Issue date Oct 10, 2017
- Western Digital Technologies, Inc.
- Albert John Wallash
- G11 - INFORMATION STORAGE
Information Patent Grant
Lateral element isolation device
- Patent number 9,786,584
- Issue date Oct 10, 2017
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate embedded with wires and method for fabricating t...
- Patent number 9,707,706
- Issue date Jul 18, 2017
- Industrial Technology Research Institute
- Chun-Wei Su
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Printed Circuit Board Arrangement for a Motor Vehicle Headlight
- Publication number 20240414838
- Publication date Dec 12, 2024
- ZKW GROUP GMBH
- Dietmar KIESLINGER
- F21 - LIGHTING
Information Patent Application
ENGAGING CONNECTION STRUCTURE AND ENGAGING CONNECTION METHOD THEREOF
- Publication number 20240314918
- Publication date Sep 19, 2024
- FIVETECH TECHNOLOGY INC.
- TING-JUI WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240306312
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION ASSEMBLY AND ELECTRIC DEVICE THEREOF
- Publication number 20240224470
- Publication date Jul 4, 2024
- GIGA-BYTE TECHNOLOGY CO., LTD.
- Chih-Ming Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230115957
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- KIJU LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASABLE FASTENING ARRANGEMENT
- Publication number 20220190497
- Publication date Jun 16, 2022
- Eazy Coating Electric AB
- Håkan Johan Löfholm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY APPARATUS
- Publication number 20210337672
- Publication date Oct 28, 2021
- Ordos Yuansheng Optoelectronics Co., Ltd.
- Chunghao CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED FLEXIBLE PRINTED CIRCUIT WITH ROUTING CHANNEL/AID
- Publication number 20210227694
- Publication date Jul 22, 2021
- Aptiv Technologies Limited
- David R. Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND ASSEMBLY
- Publication number 20210127520
- Publication date Apr 29, 2021
- FANUC CORPORATION
- Ryou MATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20200053864
- Publication date Feb 13, 2020
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Simon Sebanz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D PRINTING METHOD AND PRODUCT
- Publication number 20200045832
- Publication date Feb 6, 2020
- SIGNIFY HOLDING B.V.
- RIFAT ATA MUSTAFA HIKMET
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
Method for Manufacturing Shape-Retaining Non-Flat Devices
- Publication number 20200029440
- Publication date Jan 23, 2020
- IMEC vzw
- Jan Vanfleteren
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRICAL DEVICE, CIRCUIT BOARD, AND METHOD OF IDENTIFYING A TYPE...
- Publication number 20190235588
- Publication date Aug 1, 2019
- FUJITSU TECHNOLOGY SOLUTIONS INTELLECTUAL PROPERTY GMBH
- Diana Langner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY, AND CORRESPONDING ELECTRONIC DEVICE...
- Publication number 20180310440
- Publication date Oct 25, 2018
- THOMSON LICENSING
- Mickey Jay HUNT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module with a Component Which Can Be Flexibly Placed By...
- Publication number 20180177058
- Publication date Jun 21, 2018
- ROBERT BOSCH GmbH
- Uwe Liskow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20180042099
- Publication date Feb 8, 2018
- AT & S AUSTRIA TECHNOLOGIES & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Simon Sebanz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLANTABLE ELECTRODE AND METHOD OF MAKING THE SAME
- Publication number 20170252553
- Publication date Sep 7, 2017
- NEURONEXUS TECHNOLOGIES, INC.
- David S. Pellinen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HEAT DISSIPATION DEVICE FOR ELECTRONIC SYSTEM
- Publication number 20170006696
- Publication date Jan 5, 2017
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
- JIN-SHAN MA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCH RELEASE CONDUCTIVE ADHESIVE
- Publication number 20150218425
- Publication date Aug 6, 2015
- Apple Inc.
- Julian MALINSKI
- B32 - LAYERED PRODUCTS
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150136454
- Publication date May 21, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150136453
- Publication date May 21, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTER PROVIDED WITH COOLING SYSTEM
- Publication number 20150085442
- Publication date Mar 26, 2015
- Yoshihiro Kondo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD CONNECTION STRUCTURE
- Publication number 20150077948
- Publication date Mar 19, 2015
- OLYMPUS CORPORATION
- KENJIRO KANNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING SUBSTRATE MICROVIAS WITH ANCHOR STRUCTURES
- Publication number 20140353831
- Publication date Dec 4, 2014
- Sri Ranga Sai BOYAPATI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140353021
- Publication date Dec 4, 2014
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER SYSTEM WITH INTERLOCKING CELLS
- Publication number 20140334084
- Publication date Nov 13, 2014
- Advanced Micro Devices, Inc.
- Jean-Philippe FRICKER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140268587
- Publication date Sep 18, 2014
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THREE-DIMENSIONAL PRINTED CIRCUIT BOARD STRUCTURES
- Publication number 20140238724
- Publication date Aug 28, 2014
- Honeywell International Inc.
- Nigel Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMP WITH MULTIPLE FLEXIBLE OLEDs
- Publication number 20140231793
- Publication date Aug 21, 2014
- UNIVERSAL DISPLAY CORPORATION
- Kamala Rajan
- F21 - LIGHTING
Information Patent Application
MOUNTING STRUCTURE FOR PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEV...
- Publication number 20140233188
- Publication date Aug 21, 2014
- Fuji Electric Co., Ltd.
- Noriho Terasawa
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming an electronic device

Integrated flexible printed circuit with routing channel/aid

Method of manufacturing a flat device

Display panel and display apparatus

Multi-layer substrate and method for manufacturing multi-layer subs...

Printable 3D electronic structure

Connection structure and assembly

Fixing structure of cable to wiring substrate, and cable, and manuf...

Printed circuit board with heat sink

Component stability structure

Electronic module having circuit boards and a plastic sealing ring...

Implantable electrode and method of making the same

Method of manufacturing a printed circuit board

Light source module, fabrication method therefor, and lighting devi...

Fastening device for joining circuit boards and electronic device u...

Plastic component with at least one electrical contact element and...

Electronic module with a component which can be flexibly placed by...

Electronic device module and manufacturing method thereof

Method for manufacturing multilayer wiring substrate

Roller structure and method of using the same

Method for manufacturing multilayer wiring substrate

Wiring board, electronic component device, method for manufacturing...

Wiring board and mounting structure using the same

Method for the metallation of a workpiece and a layer structure mad...

Wiring board and mounting structure using same

Wiring board with cavity for built-in electronic component and meth...

Method of manufacturing a printed circuit board

Shielded three-layer patterned ground structure

Lateral element isolation device

Flexible substrate embedded with wires and method for fabricating t...

Patents Applicationslast 30 patents

Printed Circuit Board Arrangement for a Motor Vehicle Headlight

ENGAGING CONNECTION STRUCTURE AND ENGAGING CONNECTION METHOD THEREOF

PRINTED WIRING BOARD

HEAT DISSIPATION ASSEMBLY AND ELECTRIC DEVICE THEREOF

SEMICONDUCTOR PACKAGES

RELEASABLE FASTENING ARRANGEMENT

DISPLAY PANEL AND DISPLAY APPARATUS

INTEGRATED FLEXIBLE PRINTED CIRCUIT WITH ROUTING CHANNEL/AID

CONNECTION STRUCTURE AND ASSEMBLY

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

3D PRINTING METHOD AND PRODUCT

Method for Manufacturing Shape-Retaining Non-Flat Devices

ELECTRICAL DEVICE, CIRCUIT BOARD, AND METHOD OF IDENTIFYING A TYPE...

PRINTED CIRCUIT BOARD ASSEMBLY, AND CORRESPONDING ELECTRONIC DEVICE...

Electronic Module with a Component Which Can Be Flexibly Placed By...

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

IMPLANTABLE ELECTRODE AND METHOD OF MAKING THE SAME

HEAT DISSIPATION DEVICE FOR ELECTRONIC SYSTEM

STRETCH RELEASE CONDUCTIVE ADHESIVE

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMPUTER PROVIDED WITH COOLING SYSTEM

PRINTED CIRCUIT BOARD CONNECTION STRUCTURE

METHODS OF FORMING SUBSTRATE MICROVIAS WITH ANCHOR STRUCTURES

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

SERVER SYSTEM WITH INTERLOCKING CELLS

MODULE AND METHOD OF MANUFACTURING THE SAME

FABRICATION OF THREE-DIMENSIONAL PRINTED CIRCUIT BOARD STRUCTURES

LAMP WITH MULTIPLE FLEXIBLE OLEDs

MOUNTING STRUCTURE FOR PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEV...