Patent Application
20170006696
The subject matter herein generally relates to electronic systems, particularly relates to electronic systems with heat dissipation device.
Electronic systems can include one or more electronic components. During operation of the electronic system, the electronic components can generate heat. The heat can change the performance of the electronic component. Heat removal components are often implemented to remove or transfer the heat from the electronic component.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
FIG.1 is an assembled, isometric view of an electronic system in accordance with a first embodiment of the present disclosure.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
The present disclosure is described in relation to an electronic system. The electronic system can include an electronic component, a heat dissipation device located on the electronic component and a retaining device around the electronic component. The heat dissipation device can include a base for contacting the electronic component and a plurality of fins extending from the base. The base can include a coupling face forming a plurality of screw threads thereon. The retaining device includes at least a coupling face toward the coupling face of the base. The coupling face of the retaining device forms a plurality of screw threads for engaging with the screw threads of the coupling face of the base.
In at least one embodiment, the plurality of coupling blocks 313 can number four. When there are four coupling blocks 313, the four coupling blocks 313 can be located at four corners of the base plate 311. Each of the coupling blocks 313 has a coupling face 3130 for coupling the flange 215. Each of the coupling blocks 313 forms a plurality of screw threads 3131 in the coupling face 3130. The coupling faces 3130 of the four coupling blocks 313 are located on a circumferential face of an imaginary cylinder. In at least one embodiment, each of the four coupling blocks 313 is arched. The four coupling blocks 313 can cooperatively define the imaginary cylinder. For example, the coupling faces 3130 are located in an outer circumferential face of the imaginary cylinder.
The base plate 311 further includes a plurality of coupling members 315 extending toward the printed circuit board 20. The backplate 330 includes a main portion 331 and a plurality of coupling poles 333 extending from the main portion 331 toward the coupling members 315.
The circuit board 20 can define a plurality of through apertures 21 corresponding to the coupling poles 333 of the backplate 330.
The heat dissipation device 200 is positioned on the electronic component 100. The platform 217 (shown in
In use, the electronic component 100 generates heat, the heat is absorbed by the platform 217 of the base 210 and is transferred to the fins 230. The fins 230 dissipate the heat to ambient air.
The heat dissipation device 400 can include a base 410 and a plurality of fins 430 extending from a face of the base 410. The base 410 includes a first face 411 and a second face 413 opposite to the first face 411. The fins 430 extend from the first face 411. A coupling platform 417 extends from a center portion of the second face 413 toward electronic component 100. The platform 417 includes a contacting face 4170 for contacting the contacting face 110 of the electronic component 100. The platform 417 further includes a coupling face 4171 for coupling the platform 417 to the retaining device 600. The coupling face 4171 is an outer face of the platform 417. The platform 417 forms a plurality of screw threads 4173 on the coupling face 4171. In at least one embodiment, the heat dissipation device 400 can further include a thermal interface 450 positioned on the contacting face 4170 of the platform 417. The base 410 can be in a shape of cylinder. The platform 417 can be in a shape of cylinder. In at least one embodiment, the coupling face 4171 is an outer circumferential face of the platform 417. The fins 430 can be parallel to each other. The fins 430 cooperatively define a cylinder configuration.
The retaining device 600 can include a retaining member 610 located on the circuit board 20 and can surround the electronic component 100. The retaining device 600 can further include the backplate 330 (shown in
It can be understood that, in an assembly, the electronic component 100 is positioned on the printed circuit board 20, the retaining member 610 of the retaining device 600 is coupled on the printed circuit board 20 and has the electronic component 100 exposed outwards via the opening 6110. The backplate 330 of the retaining device 600 is positioned to a face of the printed circuit board 20 opposite to the retaining member 610. The backplate 330 is engaged with the retaining member 610, whereby, the retaining member 610 is retained to the printed circuit board 20. The electronic component 100 can be retained on the printed circuit board 20 by the retaining member 610. The heat dissipation device 400 is positioned on the electronic component 100. The platform 417 of the base 410 of the heat dissipation device 400 is located on the electronic component 100. The platform 417 of the base 410 is surrounded by the coupling blocks 613 of the retaining member 610. The coupling face 4171 of the platform 417 faces the coupling faces 6130 of the coupling blocks 613. The screw threads 4173 in the coupling face 4171 engage with the screw threads 6131 in the coupling faces 6130. The contacting face 4170 of the platform 417 of the heat dissipation device 400 contacts the contacting face 110 of the electronic component 100. In at least one embodiment, the contacting face 4170 of the platform 417 can be in direct physical contact with the contacting face 110 of the electronic component 100. In at least one embodiment, the thermal interface 450 can located between the contacting face 4170 of the platform 417 and the contacting face 110 of the electronic component 100.
The embodiments shown and described above are only examples. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, including in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including, the full extent established by the broad general meaning of the terms used in the claims.
