Antimony [Sb] as principal constituent

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CPC
H01L2224/8342

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8342Antimony [Sb] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,062,637
- Issue date Aug 13, 2024
- Innolux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing a light-emitting device and a method for manuf...
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- Issue date Feb 27, 2024
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
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Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 11,721,792
- Issue date Aug 8, 2023
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with frame having arms
- Patent number 11,715,677
- Issue date Aug 1, 2023
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
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- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-attach method to compensate for thermal expansion
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- Issue date Aug 30, 2022
- Cree, Inc.
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum layer
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- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
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- Issue date Jan 25, 2022
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having conductive particle between pads
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- Issue date Jan 4, 2022
- Innolux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
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- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
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Information Patent Grant
Method for producing an integral join and automatic placement machine
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- Issue date Aug 3, 2021
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- B22 - CASTING POWDER METALLURGY
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Semiconductor package and related methods
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- Semiconductor Components Industries, LLC
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Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device with frame having arms and related methods
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- Issue date May 11, 2021
- STMICROELECTRONICS, INC.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 10,943,888
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and fluidic manufacture thereof
- Patent number 10,930,819
- Issue date Feb 23, 2021
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
- Patent number 10,825,776
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Yoonha Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for bonding
- Patent number 10,756,047
- Issue date Aug 25, 2020
- E I du Pont de Nemours and Company
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ag underlayer-attached metallic member, Ag underlayer-attached insu...
- Patent number 10,734,297
- Issue date Aug 4, 2020
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 10,622,531
- Issue date Apr 14, 2020
- Nichia Corporation
- Yasuo Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrator device, oscillator, electronic device, and vehicle
- Patent number 10,615,747
- Issue date Apr 7, 2020
- Seiko Epson Corporation
- Hisahiro Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of forming PIP with inner known goo...
- Patent number RE47923
- Issue date Mar 31, 2020
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device
- Patent number 10,504,749
- Issue date Dec 10, 2019
- Mitsubishi Materials Corporation
- Shuji Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
3DIC Package and Method Forming the Same
- Publication number 20240072034
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...
- Publication number 20220181293
- Publication date Jun 9, 2022
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220084982
- Publication date Mar 17, 2022
- InnoLux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200365551
- Publication date Nov 19, 2020
- InnoLux Corporation
- Pai-Chiao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...
- Publication number 20190306976
- Publication date Oct 3, 2019
- OSRAM SYLVANIA INC.
- Sridharan Venk
- F21 - LIGHTING
Information Patent Application
Light Emitting Device and Fluidic Manufacture Thereof
- Publication number 20190181304
- Publication date Jun 13, 2019
- eLux Inc.
- Kenji Alexander Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...
- Publication number 20190139899
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Yoonha JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Conductive Paste For Bonding
- Publication number 20180102341
- Publication date Apr 12, 2018
- E I DU PONT DE NEMOURS AND COMPANY
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...
- Publication number 20180026015
- Publication date Jan 25, 2018
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Process
- Publication number 20170345708
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING PIP WITH INNER KNOWN GOO...
- Publication number 20140284788
- Publication date Sep 25, 2014
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER AND DIE-BONDING STRUCTURE
- Publication number 20140225269
- Publication date Aug 14, 2014
- Kabushiki Kaisha Toyota Jidoshokki
- Kazuhiro MAENO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION
- Publication number 20140179064
- Publication date Jun 26, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew D. Romig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED TYPE POWER DEVICE MODULE
- Publication number 20140159212
- Publication date Jun 12, 2014
- Industrial Technology Research Institute
- Yin-Po Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE HEAT SPREADER AND METHODS
- Publication number 20140160673
- Publication date Jun 12, 2014
- Ioan Sauciuc
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20140147695
- Publication date May 29, 2014
- DOWA METALTECH CO., LTD.
- Naoya Sunachi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS
- Publication number 20140138806
- Publication date May 22, 2014
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS
- Publication number 20140138807
- Publication date May 22, 2014
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE SURFACE MOUNT PACKAGE WITH ISOLATED TAB
- Publication number 20140133104
- Publication date May 15, 2014
- GENERAL ELECTRIC COMPANY
- Eladio Clemente Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME
- Publication number 20140124799
- Publication date May 8, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Doo Hyeb YOUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20140021595
- Publication date Jan 23, 2014
- Takeaki SHIRASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140021610
- Publication date Jan 23, 2014
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS

Antimony [Sb] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Method for repairing a light-emitting device and a method for manuf...

Methods of manufacturing stacked semiconductor die assemblies with...

Light emitting device and fluidic manufacture thereof

Semiconductor device with frame having arms

Interconnect structure with redundant electrical connectors and ass...

Chip assembly

Die-attach method to compensate for thermal expansion

Soldering a conductor to an aluminum layer

Interconnect structure with redundant electrical connectors and ass...

Electronic device having conductive particle between pads

Circuit package, an electronic circuit package, and methods for enc...

Method for producing an integral join and automatic placement machine

Semiconductor package and related methods

Method for electrically contacting a component by galvanic connecti...

Semiconductor device with frame having arms and related methods

Interconnect structure with redundant electrical connectors and ass...

Light emitting device and fluidic manufacture thereof

Method and apparatus for creating a bond between objects based on f...

Semiconductor packaging structure and process

Semiconductor packages having semiconductor chips disposed in openi...

Conductive paste for bonding

Ag underlayer-attached metallic member, Ag underlayer-attached insu...

Chip assembly

Light-emitting device

Vibrator device, oscillator, electronic device, and vehicle

Semiconductor device and method of forming PIP with inner known goo...

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Semiconductor device

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Patents Applicationslast 30 patents

3DIC Package and Method Forming the Same

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

METHOD FOR REPAIRING A LIGHT-EMITTING DEVICE AND A METHOD FOR MANUF...

ELECTRONIC DEVICE

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

ELECTRONIC DEVICE

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

Die Attach Methods and Semiconductor Devices Manufactured based on...

CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...

Light Emitting Device and Fluidic Manufacture Thereof

SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

Conductive Paste For Bonding

INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...

Semiconductor Packaging Structure and Process

SEMICONDUCTOR DEVICE AND METHOD OF FORMING PIP WITH INNER KNOWN GOO...

ELECTRONIC COMPONENT BONDING METHOD

SOLDER AND DIE-BONDING STRUCTURE

METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION

STACKED TYPE POWER DEVICE MODULE

LOW PROFILE HEAT SPREADER AND METHODS

ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS

POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS

LOW PROFILE SURFACE MOUNT PACKAGE WITH ISOLATED TAB

LIGHT EMITTING DIODES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE