Antimony [Sb]

Industry

CPC
H01L2924/01051

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01051Antimony [Sb]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,705,413
- Issue date Jul 18, 2023
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 11,600,588
- Issue date Mar 7, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonded structure and bonding material
- Patent number 11,515,281
- Issue date Nov 29, 2022
- Panasonic Holdings Corporation
- Akio Furusawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable form of single crystal silicon for high performance ele...
- Patent number 11,456,258
- Issue date Sep 27, 2022
- The Board of Trustees of the University of Illinois
- John A. Rogers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 11,413,709
- Issue date Aug 16, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,315,854
- Issue date Apr 26, 2022
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,302,657
- Issue date Apr 12, 2022
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 11,229,979
- Issue date Jan 25, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,227,846
- Issue date Jan 18, 2022
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material for semiconductor device
- Patent number 11,145,615
- Issue date Oct 12, 2021
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,069,644
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,916,491
- Issue date Feb 9, 2021
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 10,748,865
- Issue date Aug 18, 2020
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder material for semiconductor device
- Patent number 10,727,194
- Issue date Jul 28, 2020
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fluxless micro-piercing of solder balls, and resulting d...
- Patent number 10,515,918
- Issue date Dec 24, 2019
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of electrical power multiplication for power smoothing in power...
- Patent number 10,367,244
- Issue date Jul 30, 2019
- CPG Technologies, Inc.
- James F. Corum
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for soldering surface-mount component and surface-mount comp...
- Patent number 10,354,944
- Issue date Jul 16, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 10,340,239
- Issue date Jul 2, 2019
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including soldered surface-mount component
- Patent number 10,297,539
- Issue date May 21, 2019
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 10,249,588
- Issue date Apr 2, 2019
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20250001530
- Publication date Jan 2, 2025
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240297142
- Publication date Sep 5, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290744
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number 20240065002
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230223441
- Publication date Jul 13, 2023
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
- Publication number 20230207507
- Publication date Jun 29, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Power Semiconductor Module and Power Semicondu...
- Publication number 20220406679
- Publication date Dec 22, 2022
- Huawei Digital Power Technologies Co., Ltd.
- Ruoyang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20220331913
- Publication date Oct 20, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20220285297
- Publication date Sep 8, 2022
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20220216173
- Publication date Jul 7, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20220102297
- Publication date Mar 31, 2022
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...
- Publication number 20220077099
- Publication date Mar 10, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Gwang-Mun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20210407953
- Publication date Dec 30, 2021
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PRE...
- Publication number 20210129245
- Publication date May 6, 2021
- Heraeus Deutschland GmbH & Co. KG
- Michael Schäfer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210066158
- Publication date Mar 4, 2021
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND BONDING MATERIAL
- Publication number 20200335470
- Publication date Oct 22, 2020
- PANASONIC CORPORATION
- Akio FURUSAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20200303337
- Publication date Sep 24, 2020
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20200243462
- Publication date Jul 30, 2020
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...
- Publication number 20200243464
- Publication date Jul 30, 2020
- MEDIATEK INC.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200176411
- Publication date Jun 4, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20200105704
- Publication date Apr 2, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Antimony [Sb]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Bonding wire for semiconductor devices

Connection structure and manufacturing method therefor

High reliability lead-free solder alloys for harsh environment elec...

Semiconductor package having improved thermal interface between sem...

Semiconductor device including a solder compound containing a compo...

Semiconductor package having improved thermal interface between sem...

Superconducting bump bonds for quantum computing systems

Bonded structure and bonding material

Stretchable form of single crystal silicon for high performance ele...

High reliability lead-free solder alloys for harsh environment elec...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package having improved thermal interface between sem...

High reliability lead-free solder alloys for harsh environment elec...

Semiconductor package having improved thermal interface between sem...

Designs and methods for conductive bumps

Solder material for semiconductor device

3D packaging with low-force thermocompression bonding of oxidizable...

Semiconductor device including a solder compound containing a compo...

Method and apparatus for creating a bond between objects based on f...

Semiconductor module

Cu column, Cu core column, solder joint, and through-silicon via

Copper paste for joining, method for manufacturing joined body, and...

Solder material for semiconductor device

Methods of fluxless micro-piercing of solder balls, and resulting d...

Use of electrical power multiplication for power smoothing in power...

Method for soldering surface-mount component and surface-mount comp...

Tooling for coupling multiple electronic chips

Electronic device including soldered surface-mount component

Designs and methods for conductive bumps

Patents Applicationslast 30 patents

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

Lead-Free Solder Ball

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

Superconducting Bump Bonds for Quantum Computing Systems

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

Method for Producing Power Semiconductor Module and Power Semicondu...

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PRE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BONDED STRUCTURE AND BONDING MATERIAL

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEM...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...