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Apertured devices mounted on one or more rods passed through the apertures

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

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H01L25/073Apertured devices mounted on one or more rods passed through the apertures
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Patents Grantslast 30 patents

  • Information Patent Grant

    Integrated control LED display system
    • Patent number 11,508,702
    • Issue date Nov 22, 2022
    • Shenzhen Chip Optech Co. Ltd.
    • XiaoGang Wu
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Modular distributed control led display system
    • Patent number 11,495,584
    • Issue date Nov 8, 2022
    • Shenzhen Chip Optech Co. Ltd.
    • XiaoGang Wu
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Modularized spliced LED display screen
    • Patent number 11,244,933
    • Issue date Feb 8, 2022
    • Shenzhen Chip Optech Co. Ltd.
    • XiaoGang Wu
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Heat dissipation substrate for multi-chip package
    • Patent number 11,177,188
    • Issue date Nov 16, 2021
    • Actron Technology Corporation
    • Hsin-Chang Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power conversion apparatus
    • Patent number 11,056,417
    • Issue date Jul 6, 2021
    • Denso Corporation
    • Satoshi Yamaura
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Projection display system
    • Patent number 10,700,048
    • Issue date Jun 30, 2020
    • Hong Kong Beida Jade Bird Display Limited
    • Lei Zhang
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Grant

    Low thermal resistance hanging die package
    • Patent number 10,347,558
    • Issue date Jul 9, 2019
    • Intel IP Corporation
    • Christian Geissler
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interposer structures, semiconductor assembly and methods for formi...
    • Patent number 10,056,528
    • Issue date Aug 21, 2018
    • Intel Corporation
    • Zhiguo Qian
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip stack cooling structure
    • Patent number 9,818,726
    • Issue date Nov 14, 2017
    • International Business Machines Corporation
    • Timothy J. Chainer
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 9,673,129
    • Issue date Jun 6, 2017
    • Fuji Electric Co., Ltd.
    • Motohito Hori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stacked semiconductor chips packaging
    • Patent number 9,449,907
    • Issue date Sep 20, 2016
    • Advanced Micro Devices, Inc.
    • Lei Fu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flat-type semiconductor stack
    • Patent number 6,492,720
    • Issue date Dec 10, 2002
    • Mitsubishi Denki Kabushiki Kaisha
    • Hiroaki Yamaguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer scale or full wafer memory system, packaging method thereof,...
    • Patent number 5,309,011
    • Issue date May 3, 1994
    • Hitachi, Ltd.
    • Masanori Tazunoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer scale of full wafer memory system, packaging method thereof,...
    • Patent number 5,191,224
    • Issue date Mar 2, 1993
    • Hitachi, Ltd.
    • Masanori Tazunoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Pressure-mounted semiconductive structure
    • Patent number 4,126,883
    • Issue date Nov 21, 1978
    • Siemens Aktiengesellschaft
    • Heinz Martin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3636415
    • Patent number 3,636,415
    • Issue date Jan 18, 1972
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3460055
    • Patent number 3,460,055
    • Issue date Aug 5, 1969
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Grant

    3445738
    • Patent number 3,445,738
    • Issue date May 20, 1969
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3445737
    • Patent number 3,445,737
    • Issue date May 20, 1969
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3317688
    • Patent number 3,317,688
    • Issue date May 2, 1967
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3290566
    • Patent number 3,290,566
    • Issue date Dec 6, 1966
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3280390
    • Patent number 3,280,390
    • Issue date Oct 18, 1966
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3262030
    • Patent number 3,262,030
    • Issue date Jul 19, 1966
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3246213
    • Patent number 3,246,213
    • Issue date Apr 12, 1966
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3242412
    • Patent number 3,242,412
    • Issue date Mar 22, 1966
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3165678
    • Patent number 3,165,678
    • Issue date Jan 12, 1965
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    3018425
    • Patent number 3,018,425
    • Issue date Jan 23, 1962
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    2986679
    • Patent number 2,986,679
    • Issue date May 30, 1961
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    2980828
    • Patent number 2,980,828
    • Issue date Apr 18, 1961
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    2966620
    • Patent number 2,966,620
    • Issue date Dec 27, 1960
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents