Apparatus chuck

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CPC
H01L2224/75981

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75981Apparatus chuck

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip bonding apparatus using VCSEL device
- Patent number 11,810,890
- Issue date Nov 7, 2023
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor device
- Patent number 11,227,779
- Issue date Jan 18, 2022
- ASM Technology Singapore Pte. Ltd.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positioning device
- Patent number 11,075,102
- Issue date Jul 27, 2021
- Suss MicroTec Lithography GmbH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus and method of bonding substrates
- Patent number 10,872,874
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- B30 - PRESSES
Information Patent Grant
Substrate processing apparatus and manufacturing method of substrat...
- Patent number 10,833,045
- Issue date Nov 10, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,422
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,421
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding machines for bonding semiconductor elements, methods of ope...
- Patent number 10,468,373
- Issue date Nov 5, 2019
- Kulicke and Sofia Industries, Inc.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermocompression bonding using plasma gas
- Patent number 10,297,567
- Issue date May 21, 2019
- Intel Corporation
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,297,568
- Issue date May 21, 2019
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced chip to wafer stacking
- Patent number 10,269,760
- Issue date Apr 23, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection body, method for manufacturing a connection body, connec...
- Patent number 10,175,544
- Issue date Jan 8, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- G02 - OPTICS
Information Patent Grant
Advanced chip to wafer stacking
- Patent number 10,170,447
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted substrate, mounted-substrate production method, and mounted...
- Patent number 10,136,570
- Issue date Nov 20, 2018
- Sharp Kabushiki Kaisha
- Katsuhiro Yamaguchi
- G02 - OPTICS
Information Patent Grant
Electronic device, electronic device fabrication method, and electr...
- Patent number 10,115,694
- Issue date Oct 30, 2018
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and method of correcting offset amount of the same
- Patent number 10,068,872
- Issue date Sep 4, 2018
- Shinkawa Ltd.
- Makoto Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding machines for bonding semiconductor elements, methods of ope...
- Patent number 9,929,121
- Issue date Mar 27, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Advanced chip to wafer stacking
- Patent number 9,881,896
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,780,065
- Issue date Oct 3, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,780,066
- Issue date Oct 3, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out pop stacking process
- Patent number 9,754,924
- Issue date Sep 5, 2017
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias and thermocompression bonding using inkjet-pri...
- Patent number 9,717,145
- Issue date Jul 25, 2017
- The Regents of the University of California
- Vivek Subramanian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING APPARATUS USING VCSEL DEVICE
- Publication number 20210335748
- Publication date Oct 28, 2021
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212002
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212003
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS AND METHOD OF BONDING SUBSTRATES
- Publication number 20190267347
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
- Publication number 20190080939
- Publication date Mar 14, 2019
- ASM Technology Singapore Pte Ltd
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SUBSTRAT...
- Publication number 20180342479
- Publication date Nov 29, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...
- Publication number 20180174997
- Publication date Jun 21, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM
- Publication number 20180158796
- Publication date Jun 7, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
POSITIONING DEVICE
- Publication number 20180138070
- Publication date May 17, 2018
- SUSS MICROTEC LITHOGRAPHY GMBH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180026006
- Publication date Jan 25, 2018
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE
- Publication number 20170221856
- Publication date Aug 3, 2017
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC DEVICE FABRICATION METHOD, AND ELECTR...
- Publication number 20170186718
- Publication date Jun 29, 2017
- Fujitsu Limited
- Hidehiko Kira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20170186724
- Publication date Jun 29, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING USING PLASMA GAS
- Publication number 20170179070
- Publication date Jun 22, 2017
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED CHIP TO WAFER STACKING
- Publication number 20170179077
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...
- Publication number 20170062378
- Publication date Mar 2, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS AND METHOD OF CORRECTING OFFSET AMOUNT OF THE SAME
- Publication number 20160351528
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- MAKOTO TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT POP STACKING PROCESS
- Publication number 20160268236
- Publication date Sep 15, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND HEAD ASSEMBLIES, THERMOCOMPRESSION BONDING SYSTEMS AND METHODS...
- Publication number 20160254245
- Publication date Sep 1, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Method, Storage Medium, Bonding Apparatus and Bonding System
- Publication number 20160155721
- Publication date Jun 2, 2016
- TOKYO ELECTRON LIMITED
- Kenji SUGAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...
- Publication number 20160148840
- Publication date May 26, 2016
- The Regents of the University of California
- Vivek Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT POP STACKING PROCESS
- Publication number 20160027766
- Publication date Jan 28, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM
- Publication number 20150059985
- Publication date Mar 5, 2015
- TOKYO ELECTRON LIMITED
- Masataka Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALANCED STRESS ASSEMBLY FOR SEMICONDUCTOR DEVICES
- Publication number 20140252578
- Publication date Sep 11, 2014
- Delphi Technologies, Inc.
- CARL W. BERLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE
- Publication number 20080210383
- Publication date Sep 4, 2008
- Atsuhiko Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED MOUNTING APPARATUS AND ELECTRIC DEVICE MANUFACTURING M...
- Publication number 20080156434
- Publication date Jul 3, 2008
- Yoshitaka Uematsu
- B32 - LAYERED PRODUCTS
Information Patent Application
DOUBLE-SIDE MOUNTING APPARATUS, AND METHOD OF MANUFACTURING ELECTRI...
- Publication number 20070144668
- Publication date Jun 28, 2007
- KABUSHIKI KAISHA TOSHIBA
- Yoshitaka Uematsu
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus chuck

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

Flip-chip bonding apparatus using VCSEL device

Bonding of bridge to multiple semiconductor chips

Apparatus and method for processing a semiconductor device

Positioning device

Bonding apparatus, bonding system, bonding method and storage medium

Bonding apparatus and method of bonding substrates

Substrate processing apparatus and manufacturing method of substrat...

Bond chucks having individually-controllable regions, and associate...

Bond chucks having individually-controllable regions, and associate...

Bonding apparatus, bonding system, bonding method and storage medium

Method for bonding substrates together, and substrate bonding device

Bonding machines for bonding semiconductor elements, methods of ope...

Bonding apparatus, bonding system, bonding method and storage medium

Thermocompression bonding using plasma gas

Systems and methods for bonding semiconductor elements

Advanced chip to wafer stacking

Connection body, method for manufacturing a connection body, connec...

Advanced chip to wafer stacking

Mounted substrate, mounted-substrate production method, and mounted...

Electronic device, electronic device fabrication method, and electr...

Mounting apparatus and method of correcting offset amount of the same

Method for manufacturing semiconductor device, heat insulating load...

Bonding machines for bonding semiconductor elements, methods of ope...

Advanced chip to wafer stacking

Systems and methods for bonding semiconductor elements

Thermocompression bonding systems and methods of operating the same

Fan-out pop stacking process

Bonding method, storage medium, bonding apparatus and bonding system

Through silicon vias and thermocompression bonding using inkjet-pri...

Patents Applicationslast 30 patents

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

FLIP-CHIP BONDING APPARATUS USING VCSEL DEVICE

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

BONDING APPARATUS AND METHOD OF BONDING SUBSTRATES

APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE

SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SUBSTRAT...

BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM

POSITIONING DEVICE

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE

ELECTRONIC DEVICE, ELECTRONIC DEVICE FABRICATION METHOD, AND ELECTR...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

THERMOCOMPRESSION BONDING USING PLASMA GAS

ADVANCED CHIP TO WAFER STACKING

BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...

MOUNTING APPARATUS AND METHOD OF CORRECTING OFFSET AMOUNT OF THE SAME

FAN-OUT POP STACKING PROCESS

BOND HEAD ASSEMBLIES, THERMOCOMPRESSION BONDING SYSTEMS AND METHODS...

Bonding Method, Storage Medium, Bonding Apparatus and Bonding System

THROUGH SILICON VIAS AND THERMOCOMPRESSION BONDING USING INKJET-PRI...

FAN-OUT POP STACKING PROCESS

BONDING SYSTEM

BALANCED STRESS ASSEMBLY FOR SEMICONDUCTOR DEVICES

BONDING DEVICE

DOUBLE-SIDED MOUNTING APPARATUS AND ELECTRIC DEVICE MANUFACTURING M...

DOUBLE-SIDE MOUNTING APPARATUS, AND METHOD OF MANUFACTURING ELECTRI...