DOUBLE-SIDE MOUNTING APPARATUS, AND METHOD OF MANUFACTURING ELECTRICAL APPARATUS

Abstract

To promote miniaturization of an electronic-component mounted device, in which a larger number of electronic components are mounted on a mounting base, while increasing a number of electronic components mounted on the mounting base, disclosed is a double-side mounting apparatus including: a first compression-bonding tool and a second compression-bonding tool arranged opposite to each other; heating means for heating the first and second compression-bonding tools; pressurizing means for applying a pressure load between the first and second compression-bonding tools; a workpiece retention mechanism for retaining a mounted workpiece in between the first and second compression-bonding tools; a first protective-tape supply mechanism for supplying a first protective tape, in between the first and second compression-bonding tools, to the first compression-bonding tool; and a second protective-tape supply mechanism for supplying a second protective tape, in between the first and second compression-bonding tools, to the second compression-bonding tool.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a front view showing an outline of a double-side mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a side view showing the outline of the double-side mounting apparatus.

FIG. 3A is a side view showing one example of a double-side mounted workpiece used in the double-side mounting apparatus, and FIG. 3B is a side view showing a state where the double-side mounted workpiece is retained by the workpiece retention mechanism.

FIG. 4 is a flowchart explaining steps of double-side mounting.

FIG. 5 is a front view showing the double-side mounting in a state of step S2.

FIG. 6 is a front view showing the double-side mounting in a state of steps S3 and S4.

FIG. 7 is a front view showing the double-side mounting in a state of step S5.

FIG. 8 is a front view showing the double-side mounting in a state of step S6.

FIG. 9 is a front view showing the double-side mounting in a state of step S7.

FIG. 10 is a side view showing an outline of a double-side mounting apparatus according to a second embodiment of the present invention.

FIG. 11 is a side view showing an elevation portion whose self weight is canceled by a self-weight cancellation mechanism.

FIG. 12 is a side view showing a part of the double-side mounting apparatus in a state before pressurization on ICs and ACFs is performed.

FIG. 13 is a side view showing a part of the double-side mounting apparatus in a state where an upper compression-bonding tool makes contact with an upper IC through a protective tape.

FIG. 14 is a side view showing a part of the double-side mounting apparatus in a state where, after the upper compression-bonding tool makes contact with the upper IC with the protective tape interposed in-between, an upper compression-bonding head thereof is further lowered continuously.

FIG. 15 is a side view showing a part of the double-side mounting apparatus in a state where, with the upper compression-bonding head being further lowered continuously, a lower IC makes contact with a lower compression-bonding tool with another protective tape interposed in-between.

Claims

1. A double-side mounting apparatus comprising: a first compression-bonding tool and a second compression-bonding tool arranged opposite to each other;heating means which heats the first compression-bonding tool and the second compression-bonding tool;pressurizing means which applies a pressure load between the first compression-bonding tool and the second compression-bonding tool;a workpiece retention mechanism for retaining a mounted workpiece in between the first compression-bonding tool and the second compression-bonding tool;a first protective-tape supply mechanism for supplying a first protective tape, in between the first compression-bonding tool and the second compression-bonding tool, to the first compression-bonding tool; anda second protective-tape supply mechanism for supplying a second protective tape, in between the first compression-bonding tool and the second compression-bonding tool, to the second compression-bonding tool.

2. The double-side mounting apparatus according to claim 1, wherein the workpiece retention mechanism comprises a self-weight cancellation mechanism for canceling a self weight of the mounted workpiece retained thereby.

3. The double-side mounting apparatus according to claim 1, wherein the first protective-tape supply mechanism comprises: a first supply unit for supplying the first protective tape; and a first suction unit for sucking into a first containing case the first protective tape having been supplied, andthe second protective-tape supply mechanism comprises: a second supply unit for supplying the second protective tape; and a second suction unit for sucking into a second containing case the second protective tape having been supplied.

4. The double-side mounting apparatus according to claim 2, wherein the first protective-tape supply mechanism comprises: a first supply unit for supplying the first protective tape; and a first suction unit for sucking into a first containing case the first protective tape having been supplied, andthe second protective-tape supply mechanism comprises: a second supply unit for supplying the second protective tape; and a second suction unit for sucking into a second containing case the second protective tape having been supplied.

5. A method of manufacturing an electrical apparatus, comprising the steps of: temporarily attaching a first electronic component on a front surface of a mounting base with a first anisotropic conductive adhesive agent interposed in-between, and temporarily attaching a second electronic component on a back surface of the mounting base, which is opposite to the front surface thereof, with a second anisotropic conductive adhesive agent interposed in-between;arranging a first protective tape opposite to the first electronic component attached temporarily, and arranging a second protective tape opposite to the second electronic component attached temporarily; andconnecting the first electronic component and the second electronic component respectively to both sides of the mounting base by simultaneously pressurizing and heating the first anisotropic conductive adhesive agent, through the first protective tape and the first electronic component, and simultaneously pressurizing and heating the second anisotropic conductive adhesive agent, with the second protective tape and the second electronic component.