Apparatus for connecting with strap connectors

Industry

CPC
H01L24/77

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/77Apparatus for connecting with strap connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, method of manufacturing connector, and method of...
- Patent number 11,437,340
- Issue date Sep 6, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip module
- Patent number 11,264,351
- Issue date Mar 1, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) die attached between an offset lead frame d...
- Patent number 10,553,524
- Issue date Feb 4, 2020
- Microchip Technology Incorporated
- Man Kit Lam
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window clamp
- Patent number 9,997,490
- Issue date Jun 12, 2018
- Texas Instruments Incorporated
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter
- Patent number 9,455,238
- Issue date Sep 27, 2016
- Honda Motor Co., Ltd.
- Asako Yoneguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-embedded packages with backside die connection
- Patent number 9,437,516
- Issue date Sep 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,746,537
- Issue date Jun 10, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked leadframe implementation for DC/DC convertor power module i...
- Patent number 8,450,149
- Issue date May 28, 2013
- Texas Instruments Incorporated
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring method and device
- Patent number 8,439,251
- Issue date May 14, 2013
- Google Inc.
- Giovanni Delrosso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,253,247
- Issue date Aug 28, 2012
- Renesas Electronics Corporation
- Noriko Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring method and device
- Patent number 8,096,463
- Issue date Jan 17, 2012
- MOSAID Technologies Incorporated
- Giovanni Delrosso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,863,107
- Issue date Jan 4, 2011
- Renesas Electronics Corporation
- Hideaki Tamimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding equipment for manufacturing semiconductor device...
- Patent number 7,804,160
- Issue date Sep 28, 2010
- Kabushiki Kaisha Toshiba
- Masataka Nanba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,667,307
- Issue date Feb 23, 2010
- Renesas Technology Corp.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,364,950
- Issue date Apr 29, 2008
- Kabushiki Kaisha Toshiba
- Norihide Funato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configuration and method for contacting circuit structure
- Patent number 7,245,026
- Issue date Jul 17, 2007
- Infineon Technologies AG
- Rudolf Lehner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,230,322
- Issue date Jun 12, 2007
- Kabushiki Kaisha Toshiba
- Norihide Funato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 6,903,450
- Issue date Jun 7, 2005
- Kabushiki Kaisha Toshiba
- Norihide Funato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...
- Publication number 20240379612
- Publication date Nov 14, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230395555
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX BONDED INTEGRATED CIRCUITS
- Publication number 20230299035
- Publication date Sep 21, 2023
- META PLATFORMS, INC.
- Sandeep Rekhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET
- Publication number 20230154889
- Publication date May 18, 2023
- Fuji Electric Co., Ltd.
- Manabu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210265243
- Publication date Aug 26, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi KURAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CHIP MODULE
- Publication number 20210175197
- Publication date Jun 10, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP BOND SEMICONDUCTOR PACKAGES AND ASSEMBLY TOOLS
- Publication number 20210118840
- Publication date Apr 22, 2021
- UTAC Headquarters Pte. Ltd.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE, METHOD OF MANUFACTURING CONNECTOR, AND METHOD OF...
- Publication number 20200273833
- Publication date Aug 27, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190139866
- Publication date May 9, 2019
- KABUSHIKI KAISHA TOSHIBA
- Hidetoshi KURAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261568
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261567
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER
- Publication number 20140284809
- Publication date Sep 25, 2014
- Honda Motor Co., Ltd.
- Asako YONEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20140048584
- Publication date Feb 20, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL BONDING APPARATUS
- Publication number 20130284794
- Publication date Oct 31, 2013
- Sanyo Electric Co., Ltd.
- Takashi SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device
- Publication number 20130207252
- Publication date Aug 15, 2013
- RENESAS ELECTRONICS CORPORATION
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...
- Publication number 20120119343
- Publication date May 17, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING METHOD AND DEVICE
- Publication number 20120118938
- Publication date May 17, 2012
- MOSAID TECHNOLOGIES INCORPORATED
- Giovanni DELROSSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120034742
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20110073921
- Publication date Mar 31, 2011
- Renesas Electronics Corporation
- Hideaki TAMIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20100323476
- Publication date Dec 23, 2010
- KABUSHIKI KAISHA TOSHIBA
- Masataka Nanba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100258945
- Publication date Oct 14, 2010
- RENESAS TECHNOLOGY CORP.
- NORIKO NUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100105174
- Publication date Apr 29, 2010
- RENESAS TECHNOLOGY CORP.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING...
- Publication number 20090209065
- Publication date Aug 20, 2009
- Hideo NISHIUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20090152697
- Publication date Jun 18, 2009
- RENESAS TECHNOLOGY CORP.
- Hideaki Tamimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...
- Publication number 20090001135
- Publication date Jan 1, 2009
- Kabushiki Kaisha Toshiba
- Makoto Kishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Method and Device
- Publication number 20080302858
- Publication date Dec 11, 2008
- Giovanni Delrosso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080265386
- Publication date Oct 30, 2008
- Kuniharu MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070052075
- Publication date Mar 8, 2007
- Norihide Funato
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for connecting with strap connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip packaging device, chip packaging method, and package chip

Semiconductor device

Clip bond semiconductor packages and assembly tools

Electronic module, method of manufacturing connector, and method of...

Method of manufacturing chip module

Method for electrically contacting a component by galvanic connecti...

Semiconductor device

Integrated circuit (IC) die attached between an offset lead frame d...

Method of manufacturing a semiconductor device

Window clamp

Semiconductor device, method of manufacturing a semiconductor devic...

Power converter

Chip-embedded packages with backside die connection

Ultrasonic bonding systems and methods of using the same

Stacked leadframe implementation for DC/DC convertor power module i...

Wiring method and device

Semiconductor device and method for manufacturing the same

Wiring method and device

Semiconductor device and manufacturing method of the same

Ultrasonic bonding equipment for manufacturing semiconductor device...

Semiconductor device

Semiconductor device and method of manufacturing the same

Configuration and method for contacting circuit structure

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCT...

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

POWER MODULE

FLEX BONDED INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING CHIP MODULE

CLIP BOND SEMICONDUCTOR PACKAGES AND ASSEMBLY TOOLS

ELECTRONIC MODULE, METHOD OF MANUFACTURING CONNECTOR, AND METHOD OF...

SEMICONDUCTOR DEVICE

Window Clamp

Window Clamp

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

POWER CONVERTER

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

METAL BONDING APPARATUS

Semiconductor Device

STACKED LEADFRAME IMPLEMENTATION FOR DC/DC CONVERTOR POWER MODULE I...

WIRING METHOD AND DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...

Wiring Method and Device

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME