Apparatus for connecting with wire connectors

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CPC
H01L2224/78

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78Apparatus for connecting with wire connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,159,857
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jungseok Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bonding wire
- Patent number 12,154,883
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Daewoong Heo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-process wire bond testing using wire bonding apparatus
- Patent number 12,148,730
- Issue date Nov 19, 2024
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for tool mark free stitch bonding
- Patent number 12,142,595
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of calibrating an ultrasonic characteristic on a wire bondi...
- Patent number 12,113,043
- Issue date Oct 8, 2024
- Kulicke and Soffa Industries, Inc.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method for manufacturing semiconductor d...
- Patent number 12,107,070
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus, method for measuring opening amount of clam...
- Patent number 12,087,725
- Issue date Sep 10, 2024
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and alignment method
- Patent number 12,080,679
- Issue date Sep 3, 2024
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,057,431
- Issue date Aug 6, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 12,057,428
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Jongeun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 12,057,427
- Issue date Aug 6, 2024
- Shinkawa Ltd.
- Osamu Kakutani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic horn and manufacturing apparatus of semiconductor device
- Patent number 12,046,574
- Issue date Jul 23, 2024
- Shinkawa Ltd.
- Yuhei Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon bonding tools and methods of using the same
- Patent number 11,978,718
- Issue date May 7, 2024
- Kulicke and Soffa Industries, Inc,.
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic material and wire bonding capillary
- Patent number 11,964,915
- Issue date Apr 23, 2024
- Industrial Technology Research Institute
- Tien-Heng Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,961,819
- Issue date Apr 16, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of optimizing clamping of a semiconductor element against a...
- Patent number 11,935,864
- Issue date Mar 19, 2024
- Kulicke and Soffa Industries, Inc.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,908,827
- Issue date Feb 20, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 11,901,329
- Issue date Feb 13, 2024
- Kaijo Corporation
- Mami Kushima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-segment wire-bond
- Patent number 11,869,868
- Issue date Jan 9, 2024
- Semiconductor Components Industries, LLC
- Elmer Cunanan Bayron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 11,824,038
- Issue date Nov 21, 2023
- Shinkawa Ltd.
- Nobuyuki Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Force sensor in an ultrasonic wire bonding device
- Patent number 11,798,911
- Issue date Oct 24, 2023
- ASMPT SINGAPORE PTE. LTD.
- Hing Leung Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding insulated coating wire, connection structure, me...
- Patent number 11,791,304
- Issue date Oct 17, 2023
- Kaijo Corporation
- Akio Sugito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge tool, bonding device, and bonding inspection method
- Patent number 11,756,919
- Issue date Sep 12, 2023
- Mitsubishi Electric Corporation
- Daisuke Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary guide device and wire bonding apparatus
- Patent number 11,717,912
- Issue date Aug 8, 2023
- Shinkawa Ltd.
- Yohei Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20240404986
- Publication date Dec 5, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20240395765
- Publication date Nov 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- XuHui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...
- Publication number 20240363581
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Daewoong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20240363583
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE PATH PLATE HAVING ENHANCED DURABILITY FOR WIRE BONDING
- Publication number 20240347500
- Publication date Oct 17, 2024
- ASMPT Singapore Pte. Ltd.
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240335901
- Publication date Oct 10, 2024
- Mitsubishi Electric Corporation
- Erubi SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...
- Publication number 20240304592
- Publication date Sep 12, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BONDING FOR SEMICONDUCTOR DEVICES
- Publication number 20240290746
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY FOR STITCH BOND
- Publication number 20240250060
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...
- Publication number 20240250063
- Publication date Jul 25, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240234331
- Publication date Jul 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC COMPOSITE VIBRATION DEVICE AND MANUFACTURING APPARATUS O...
- Publication number 20240203933
- Publication date Jun 20, 2024
- SHINKAWA LTD.
- Hikaru MIURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136302
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND ALIGNMENT METHOD
- Publication number 20240105673
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER...
- Publication number 20240088089
- Publication date Mar 14, 2024
- SHINKAWA LTD.
- Tsutomu KIYONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICO...
- Publication number 20240079375
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Hiroaki HOKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...
- Publication number 20240055388
- Publication date Feb 15, 2024
- SHINKAWA LTD.
- Kiyotaka TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING WIRE
- Publication number 20240038717
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Daewoong Heo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20240006193
- Publication date Jan 4, 2024
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE JIG AND TABBING APPARATUS INCLUDING THE SAME
- Publication number 20230378391
- Publication date Nov 23, 2023
- Hanwha Corporation
- Min Kyo Jung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC HORN AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
- Publication number 20230343742
- Publication date Oct 26, 2023
- SHINKAWA LTD.
- Yuhei ITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING CAPILLARY
- Publication number 20230311239
- Publication date Oct 5, 2023
- CRAFTSTECH, INC.
- Jeffrey C. Roberts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
- Publication number 20230318207
- Publication date Oct 5, 2023
- Heraeus Nexensos GmbH
- Matthias MUZIOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230298981
- Publication date Sep 21, 2023
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20230282613
- Publication date Sep 7, 2023
- SHINKAWA LTD.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE CLAMP AND WIRE BONDING APPARATUS INCLUDING THE SAME
- Publication number 20230230952
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Jaehyeok HEO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-PROCESS WIRE BOND TESTING
- Publication number 20230215835
- Publication date Jul 6, 2023
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for connecting with wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor package

Apparatus for bonding wire

In-process wire bond testing using wire bonding apparatus

Apparatus and methods for tool mark free stitch bonding

Methods of calibrating an ultrasonic characteristic on a wire bondi...

Wire bonding device, wire cutting method and non-transitory compute...

Wire bonding apparatus and method for manufacturing semiconductor d...

Wire bonding apparatus, method for measuring opening amount of clam...

Bonding apparatus and alignment method

Chip bonding apparatus and securing assembly therefor

Methods of forming wire interconnect structures and related wire bo...

Wire bonding apparatus

Wire bonding apparatus

Ultrasonic horn and manufacturing apparatus of semiconductor device

Ribbon bonding tools and methods of using the same

Ceramic material and wire bonding capillary

Wire bonding apparatus

Methods of optimizing clamping of a semiconductor element against a...

Wire bonding apparatus

Wire bonding for semiconductor devices

Wire bonding method and wire bonding apparatus

Multi-segment wire-bond

Wire bonding apparatus

Force sensor in an ultrasonic wire bonding device

Method for bonding insulated coating wire, connection structure, me...

Wedge tool, bonding device, and bonding inspection method

Package-on-package assembly with wire bond vias

Capillary guide device and wire bonding apparatus

Semiconductor device

Patents Applicationslast 30 patents

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

WIRE PATH PLATE HAVING ENHANCED DURABILITY FOR WIRE BONDING

WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...

BALL BONDING FOR SEMICONDUCTOR DEVICES

CAPILLARY FOR STITCH BOND

METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ULTRASONIC COMPOSITE VIBRATION DEVICE AND MANUFACTURING APPARATUS O...

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

BONDING APPARATUS AND ALIGNMENT METHOD

WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER...

BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICO...

BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...

APPARATUS FOR BONDING WIRE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

WIRE JIG AND TABBING APPARATUS INCLUDING THE SAME

ULTRASONIC HORN AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

WIRE BONDING CAPILLARY

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

WIRE CLAMP AND WIRE BONDING APPARATUS INCLUDING THE SAME

IN-PROCESS WIRE BOND TESTING