Apparatus for making assemblies not otherwise provided for

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CPC
H01L21/67121

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67121Apparatus for making assemblies not otherwise provided for

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Assembly apparatus
- Patent number 12,272,760
- Issue date Apr 8, 2025
- LG Electronics Inc.
- Junghun Rho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package
- Patent number 12,217,976
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for mitigating overlay distortion patterns caused...
- Patent number 12,164,277
- Issue date Dec 10, 2024
- KLA Corporation
- Franz Zach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for joining substrates
- Patent number 12,087,726
- Issue date Sep 10, 2024
- EV Group E. Thallner GmbH
- Jürgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transfer apparatus
- Patent number 12,068,178
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Dongkyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro light-emitting diode mass transfer apparatus and method
- Patent number 12,062,555
- Issue date Aug 13, 2024
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Qiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer equipment
- Patent number 12,057,330
- Issue date Aug 6, 2024
- PlayNitride Display Co., Ltd.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pick-and-place system with a stabilizer
- Patent number 12,027,403
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for environmental control of dies and substrates for hybr...
- Patent number 12,001,193
- Issue date Jun 4, 2024
- Applied Materials, Inc.
- Ying Wang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Modular mainframe layout for supporting multiple semiconductor proc...
- Patent number 11,935,771
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Randy A. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having hybrid bonding...
- Patent number 11,894,247
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for self-assembling semiconductor light-emitti...
- Patent number 11,869,871
- Issue date Jan 9, 2024
- LG Electronics Inc.
- Juchan Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 11,804,468
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for mitigating overlay distortion patterns caused...
- Patent number 11,782,411
- Issue date Oct 10, 2023
- KLA Corporation
- Franz Zach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stencil structure and method of fabricating package
- Patent number 11,756,801
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Notched wafer and bonding support structure to improve wafer stacking
- Patent number 11,682,652
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation system for package fabrication
- Patent number 11,676,832
- Issue date Jun 13, 2023
- Applied Materials, Inc.
- Kurtis Leschkies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for securing components of an integrated circuit
- Patent number 11,631,600
- Issue date Apr 18, 2023
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cassette packing apparatus
- Patent number 11,569,106
- Issue date Jan 31, 2023
- SK SILTRON CO., LTD.
- Tae Ju Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for alignment of substrates
- Patent number 11,488,851
- Issue date Nov 1, 2022
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and semiconductor package fabrication equipment i...
- Patent number 11,469,133
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Seok Geun Ahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfill method for semiconductor package
- Patent number 11,355,360
- Issue date Jun 7, 2022
- Enjet Co., Ltd.
- Do Young Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,348,791
- Issue date May 31, 2022
- Tokyo Electron Limited
- Toshifumi Inamasu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solar array system and method of manufacturing
- Patent number 11,264,522
- Issue date Mar 1, 2022
- Sierra Space Corporation
- Brian Anthony
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having hybrid bonding interface, method of man...
- Patent number 11,257,694
- Issue date Feb 22, 2022
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,195,774
- Issue date Dec 7, 2021
- Samsung Electronics Co., Ltd.
- Soo Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging apparatus and method thereof
- Patent number 11,189,507
- Issue date Nov 30, 2021
- CAPCON LIMITED
- Feng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate having a via wall configured as a sh...
- Patent number 11,139,224
- Issue date Oct 5, 2021
- QUALCOMM Incorporated
- Chaoqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate processing method
- Patent number 11,101,151
- Issue date Aug 24, 2021
- Disco Corporation
- Kenji Takenouchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING PACKAGE
- Publication number 20250132169
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS
- Publication number 20250105053
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED...
- Publication number 20250103019
- Publication date Mar 27, 2025
- KLA Corporation
- Franz Zach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20250017094
- Publication date Jan 9, 2025
- Japan Display Inc.
- Tatsuya IDE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CLEANING A PACKAGE
- Publication number 20240395571
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS AND METHOD
- Publication number 20240371705
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Nan HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING PRESS
- Publication number 20240339343
- Publication date Oct 10, 2024
- AMX - AUTOMATRIX S.R.L.
- Nicola SCHIVALOCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK-AND-PLACE SYSTEM WITH A STABILIZER
- Publication number 20240339348
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY APPARATUS
- Publication number 20240332447
- Publication date Oct 3, 2024
- LG ELECTRONICS INC.
- Junghun RHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOL CHANGING APPARATUS AND METHOD
- Publication number 20240316709
- Publication date Sep 26, 2024
- SEMES CO., LTD.
- Changhoon OK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VACUUM PACKAGING MANUFACTURING METHOD AND SEMICONDUCTOR DEVICES MAN...
- Publication number 20240312782
- Publication date Sep 19, 2024
- Seoul National University R&DB Foundation
- Woo Young CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO PLACE BALLS FOR SECOND LEVEL INTERCONNECTS...
- Publication number 20240304473
- Publication date Sep 12, 2024
- Intel Corporation
- Zewei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKING SYSTEM FOR SEMICONDUCTOR PACKAGING PROCESS AND OPERATION ME...
- Publication number 20240266193
- Publication date Aug 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Tang-Hsin KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS AND METHODS FOR REDUCING WARPAGE DURING FABRICATIO...
- Publication number 20240242974
- Publication date Jul 18, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROC...
- Publication number 20240194503
- Publication date Jun 13, 2024
- Applied Materials, Inc.
- Randy A. HARRIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK-AND-PLACE TOOL WITH WARPAGE-CORRECTION MECHANISM
- Publication number 20240087943
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED GLASS CARRIERS FOR MAKING PACKAGE SUBSTRATES
- Publication number 20240079259
- Publication date Mar 7, 2024
- Intel Corporation
- Jacob VEHONSKY
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED...
- Publication number 20240053721
- Publication date Feb 15, 2024
- KLA Corporation
- Franz Zach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR JOINING SUBSTRATES
- Publication number 20240047414
- Publication date Feb 8, 2024
- EV GROUP E. THALLNER GMBH
- Jürgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for Cleaning a Package
- Publication number 20230377910
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Hao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
- Publication number 20230369283
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE
- Publication number 20230369066
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PRESSURE HEAD MODULE AND LASER BONDING APPARATUS INCLUDING TH...
- Publication number 20230360934
- Publication date Nov 9, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jong Hyup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MOLDING PRESS MACHINE
- Publication number 20230343611
- Publication date Oct 26, 2023
- Mitsubishi Electric Corporation
- Kiyohiro UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
- Publication number 20230326797
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND ASSEMBLY FOR REPLACING SOLDER BALLS OF AN ELECTRONIC PAC...
- Publication number 20230317473
- Publication date Oct 5, 2023
- Skyworks Solutions, Inc.
- Marco Antonio Carmona
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK-AND-PLACE SYSTEM WITH A STABILIZER
- Publication number 20230307281
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
APPARATUS FOR ENVIRONMENTAL CONTROL OF DIES AND SUBSTRATES FOR HYBR...
- Publication number 20230288916
- Publication date Sep 14, 2023
- Ying WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION SYSTEM FOR PACKAGE FABRICATION
- Publication number 20230282498
- Publication date Sep 7, 2023
- Applied Materials, Inc.
- Kurtis LESCHKIES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Apparatus for making assemblies not otherwise provided for

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Assembly apparatus

Method of fabricating package

Manufacturing method of semiconductor package using jig

System and method for mitigating overlay distortion patterns caused...

Device and method for joining substrates

Chip transfer apparatus

Micro light-emitting diode mass transfer apparatus and method

Mass transfer equipment

Pick-and-place system with a stabilizer

Apparatus for environmental control of dies and substrates for hybr...

Modular mainframe layout for supporting multiple semiconductor proc...

Method of manufacturing semiconductor device having hybrid bonding...

Apparatus and method for self-assembling semiconductor light-emitti...

Manufacturing method of semiconductor package using jig

System and method for mitigating overlay distortion patterns caused...

Stencil structure and method of fabricating package

Notched wafer and bonding support structure to improve wafer stacking

Laser ablation system for package fabrication

Apparatus and method for securing components of an integrated circuit

Wafer cassette packing apparatus

Method and device for alignment of substrates

Bonding apparatus and semiconductor package fabrication equipment i...

Underfill method for semiconductor package

Bonding apparatus and bonding method

Solar array system and method of manufacturing

Semiconductor device having hybrid bonding interface, method of man...

Semiconductor packages

Chip packaging apparatus and method thereof

Package comprising a substrate having a via wall configured as a sh...

Package substrate processing method

Patents Applicationslast 30 patents

METHOD OF FABRICATING PACKAGE

SELECTIVE TRANSFER OF OPTICAL AND OPTO-ELECTRONIC COMPONENTS

SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED...

PROCESSING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE

APPARATUS AND METHODS FOR CLEANING A PACKAGE

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

WAFER BONDING APPARATUS AND METHOD

SINTERING PRESS

PICK-AND-PLACE SYSTEM WITH A STABILIZER

ASSEMBLY APPARATUS

TOOL CHANGING APPARATUS AND METHOD

VACUUM PACKAGING MANUFACTURING METHOD AND SEMICONDUCTOR DEVICES MAN...

METHODS AND APPARATUS TO PLACE BALLS FOR SECOND LEVEL INTERCONNECTS...

WORKING SYSTEM FOR SEMICONDUCTOR PACKAGING PROCESS AND OPERATION ME...

DEVICES, SYSTEMS AND METHODS FOR REDUCING WARPAGE DURING FABRICATIO...

MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROC...

PICK-AND-PLACE TOOL WITH WARPAGE-CORRECTION MECHANISM

DUAL SIDED GLASS CARRIERS FOR MAKING PACKAGE SUBSTRATES

SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED...

DEVICE AND METHOD FOR JOINING SUBSTRATES

Apparatus and Methods for Cleaning a Package

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG

METHOD OF FABRICATING PACKAGE

LASER PRESSURE HEAD MODULE AND LASER BONDING APPARATUS INCLUDING TH...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MOLDING PRESS MACHINE

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...

SYSTEM AND ASSEMBLY FOR REPLACING SOLDER BALLS OF AN ELECTRONIC PAC...

PICK-AND-PLACE SYSTEM WITH A STABILIZER

APPARATUS FOR ENVIRONMENTAL CONTROL OF DIES AND SUBSTRATES FOR HYBR...

LASER ABLATION SYSTEM FOR PACKAGE FABRICATION