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Apparatus for making assemblies not otherwise provided for
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H01L21/67121
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/67121
Apparatus for making assemblies not otherwise provided for
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Patents Grants
last 30 patents
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Patent Grant
Modular mainframe layout for supporting multiple semiconductor proc...
Patent number
11,935,771
Issue date
Mar 19, 2024
Applied Materials, Inc.
Randy A. Harris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device having hybrid bonding...
Patent number
11,894,247
Issue date
Feb 6, 2024
NANYA TECHNOLOGY CORPORATION
Hsih-Yang Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for self-assembling semiconductor light-emitti...
Patent number
11,869,871
Issue date
Jan 9, 2024
LG Electronics Inc.
Juchan Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor package using jig
Patent number
11,804,468
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for mitigating overlay distortion patterns caused...
Patent number
11,782,411
Issue date
Oct 10, 2023
KLA Corporation
Franz Zach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stencil structure and method of fabricating package
Patent number
11,756,801
Issue date
Sep 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Notched wafer and bonding support structure to improve wafer stacking
Patent number
11,682,652
Issue date
Jun 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-Chan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser ablation system for package fabrication
Patent number
11,676,832
Issue date
Jun 13, 2023
Applied Materials, Inc.
Kurtis Leschkies
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method for securing components of an integrated circuit
Patent number
11,631,600
Issue date
Apr 18, 2023
Cerebras Systems Inc.
Jean-Philippe Fricker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer cassette packing apparatus
Patent number
11,569,106
Issue date
Jan 31, 2023
SK SILTRON CO., LTD.
Tae Ju Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for alignment of substrates
Patent number
11,488,851
Issue date
Nov 1, 2022
EV Group E. Thallner GmbH
Thomas Wagenleitner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus and semiconductor package fabrication equipment i...
Patent number
11,469,133
Issue date
Oct 11, 2022
Samsung Electronics Co., Ltd.
Seok Geun Ahn
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Underfill method for semiconductor package
Patent number
11,355,360
Issue date
Jun 7, 2022
Enjet Co., Ltd.
Do Young Byun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus and bonding method
Patent number
11,348,791
Issue date
May 31, 2022
Tokyo Electron Limited
Toshifumi Inamasu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solar array system and method of manufacturing
Patent number
11,264,522
Issue date
Mar 1, 2022
Sierra Space Corporation
Brian Anthony
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having hybrid bonding interface, method of man...
Patent number
11,257,694
Issue date
Feb 22, 2022
NANYA TECHNOLOGY CORPORATION
Hsih-Yang Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
11,195,774
Issue date
Dec 7, 2021
Samsung Electronics Co., Ltd.
Soo Hwan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip packaging apparatus and method thereof
Patent number
11,189,507
Issue date
Nov 30, 2021
CAPCON LIMITED
Feng Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package comprising a substrate having a via wall configured as a sh...
Patent number
11,139,224
Issue date
Oct 5, 2021
QUALCOMM Incorporated
Chaoqi Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate processing method
Patent number
11,101,151
Issue date
Aug 24, 2021
Disco Corporation
Kenji Takenouchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective member forming apparatus
Patent number
10,978,320
Issue date
Apr 13, 2021
Disco Corporation
Kazuki Sugiura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for alignment of substrates
Patent number
10,943,807
Issue date
Mar 9, 2021
EV Group E. Thallner GmbH
Thomas Wagenleitner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and methods for the transfer of chips from a source substrat...
Patent number
10,923,460
Issue date
Feb 16, 2021
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Stéphane Caplet
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Flip chip bonding device and bonding method
Patent number
10,903,105
Issue date
Jan 26, 2021
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Feibiao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for securing components of an integrated circuit
Patent number
10,784,128
Issue date
Sep 22, 2020
Cerebras Systems Inc.
Jean-Philippe Fricker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solar array system and method of manufacturing
Patent number
10,770,606
Issue date
Sep 8, 2020
Sierra Nevada Corporation
Brian Anthony
B64 - AIRCRAFT AVIATION COSMONAUTICS
Information
Patent Grant
Laminating device and method for fabricating semiconductor package...
Patent number
10,748,855
Issue date
Aug 18, 2020
Samsung Electronics Co., Ltd.
Tea-Geon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and system for mass arrangement of micro-component devices
Patent number
10,748,792
Issue date
Aug 18, 2020
MAVEN OPTRONICS CO., LTD.
Chieh Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stack boat tool and method using the same
Patent number
10,741,430
Issue date
Aug 11, 2020
Samsung Electronics Co., Ltd.
Tea-geon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Delivery roll and method for manufacturing thereof
Patent number
10,741,475
Issue date
Aug 11, 2020
Nolato Silikonteknik AB
Xiongwei Lu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PICK-AND-PLACE TOOL WITH WARPAGE-CORRECTION MECHANISM
Publication number
20240087943
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL SIDED GLASS CARRIERS FOR MAKING PACKAGE SUBSTRATES
Publication number
20240079259
Publication date
Mar 7, 2024
Intel Corporation
Jacob VEHONSKY
B32 - LAYERED PRODUCTS
Information
Patent Application
SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED...
Publication number
20240053721
Publication date
Feb 15, 2024
KLA Corporation
Franz Zach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR JOINING SUBSTRATES
Publication number
20240047414
Publication date
Feb 8, 2024
EV GROUP E. THALLNER GMBH
Jürgen Burggraf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and Methods for Cleaning a Package
Publication number
20230377910
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Hao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
Publication number
20230369283
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING PACKAGE
Publication number
20230369066
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER PRESSURE HEAD MODULE AND LASER BONDING APPARATUS INCLUDING TH...
Publication number
20230360934
Publication date
Nov 9, 2023
SAMSUNG DISPLAY CO., LTD.
Jong Hyup KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MOLDING PRESS MACHINE
Publication number
20230343611
Publication date
Oct 26, 2023
Mitsubishi Electric Corporation
Kiyohiro UCHIDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
Publication number
20230326797
Publication date
Oct 12, 2023
TOKYO ELECTRON LIMITED
Tetsuya Maki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND ASSEMBLY FOR REPLACING SOLDER BALLS OF AN ELECTRONIC PAC...
Publication number
20230317473
Publication date
Oct 5, 2023
Skyworks Solutions, Inc.
Marco Antonio Carmona
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PICK-AND-PLACE SYSTEM WITH A STABILIZER
Publication number
20230307281
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Yuan Chang
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Application
APPARATUS FOR ENVIRONMENTAL CONTROL OF DIES AND SUBSTRATES FOR HYBR...
Publication number
20230288916
Publication date
Sep 14, 2023
Ying WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ABLATION SYSTEM FOR PACKAGE FABRICATION
Publication number
20230282498
Publication date
Sep 7, 2023
Applied Materials, Inc.
Kurtis LESCHKIES
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MACHINE LEARNING & INTEGRATED METROLOGY FOR RUN-TO-RUN OPTIMIZATION...
Publication number
20230274987
Publication date
Aug 31, 2023
Ruiping WANG
G05 - CONTROLLING REGULATING
Information
Patent Application
NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING
Publication number
20230275064
Publication date
Aug 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-Chan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP TRANSFER APPARATUS
Publication number
20230154769
Publication date
May 18, 2023
Samsung Electronics Co., Ltd.
Dongkyun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mounting method for an integrated semiconductor wafer device, and m...
Publication number
20230096742
Publication date
Mar 30, 2023
LPKF Laser & Electronics AG
Roman OSTHOLT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND METHOD FOR MITIGATING OVERLAY DISTORTION PATTERNS CAUSED...
Publication number
20230035201
Publication date
Feb 2, 2023
Franz Zach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MASS TRANSFER EQUIPMENT
Publication number
20230029828
Publication date
Feb 2, 2023
PlayNitride Display Co., Ltd.
Yun-Li Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM AND METHOD FOR OPTIMIZING THROUGH SILICON VIA OVERLAY
Publication number
20230030116
Publication date
Feb 2, 2023
Franz Zach
G05 - CONTROLLING REGULATING
Information
Patent Application
STENCIL STRUCTURE AND METHOD OF FABRICATING PACKAGE
Publication number
20230009506
Publication date
Jan 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROC...
Publication number
20220262653
Publication date
Aug 18, 2022
Randy A. HARRIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20220254636
Publication date
Aug 11, 2022
TOKYO ELECTRON LIMITED
Toshifumi Inamasu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD AND APPARATUS FOR CHIP MANUFACTURING
Publication number
20220208559
Publication date
Jun 30, 2022
ADVANCED MICRO DEVICES, INC.
Ai-Tee Ang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING APPARATUS AND TERMINAL DEVICE
Publication number
20220084849
Publication date
Mar 17, 2022
Huawei Technologies Co., Ltd
Chao MA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING HYBRID BONDING...
Publication number
20220059372
Publication date
Feb 24, 2022
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER ABLATION SYSTEM FOR PACKAGE FABRICATION
Publication number
20220028709
Publication date
Jan 27, 2022
Applied Materials, Inc.
Kurtis LESCHKIES
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MICRO LIGHT-EMITTING DIODE MASS TRANSFER APPARATUS AND METHOD
Publication number
20210384050
Publication date
Dec 9, 2021
CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
Qiang LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTI...
Publication number
20210351158
Publication date
Nov 11, 2021
LG ELECTRONICS INC.
Juchan CHOI
H01 - BASIC ELECTRIC ELEMENTS