Apparatus for manufacturing bump connectors

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H01L2224/742

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/742Apparatus for manufacturing bump connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Injection molded solder head with improved sealing performance
- Patent number 12,166,008
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-type solder ball placement system
- Patent number 12,151,315
- Issue date Nov 26, 2024
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor fabrication apparatus and semiconductor fabrication m...
- Patent number 10,892,240
- Issue date Jan 12, 2021
- TOSHIBA MEMORY CORPORATION
- Keiichi Niwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 10,600,652
- Issue date Mar 24, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal post bonding using pre-fabricated metal posts
- Patent number 10,034,390
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic element with bond elements to encapsulation surface
- Patent number 10,008,477
- Issue date Jun 26, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding bare chip dies
- Patent number 9,859,247
- Issue date Jan 2, 2018
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Edsger Constant Pieter Smits
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through silicon vias and thermocompression bonding using inkjet-pri...
- Patent number 9,717,145
- Issue date Jul 25, 2017
- The Regents of the University of California
- Vivek Subramanian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 9,640,495
- Issue date May 2, 2017
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump forming method and apparatus
- Patent number 9,511,438
- Issue date Dec 6, 2016
- Senju Metal Industry Co., Ltd.
- Issaku Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless plating apparatus and electroless plating method
- Patent number 9,293,364
- Issue date Mar 22, 2016
- Ebara Corporation
- Hiroyuki Kanda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a plurality of metal posts
- Patent number 9,263,407
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring a graphene sheet to metal contact bumps of...
- Patent number 8,974,617
- Issue date Mar 10, 2015
- IMEC
- Yu-Hsiang Hu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Controlled electroplated solder bumps
- Patent number 8,741,765
- Issue date Jun 3, 2014
- GLOBALFOUNDRIES Inc.
- Christian Schroiff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate manufacturing method
- Patent number 8,671,561
- Issue date Mar 18, 2014
- Shinko Electric Industries Co., Ltd.
- Kiyoaki Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow system and method for conductive connections
- Patent number 8,623,756
- Issue date Jan 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repairing anomalous stiff pillar bumps
- Patent number 8,623,754
- Issue date Jan 7, 2014
- GLOBALFOUNDRIES Inc.
- Vivian W. Ryan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Template wafer fabrication process for small pitch flip-chip interc...
- Patent number 8,592,301
- Issue date Nov 26, 2013
- The United States of America as represented by the Secretary of the Army
- Justin K. Markunas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming copper pillar bumps using patterned anodes
- Patent number 8,581,401
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Silicon nitride passivation layer for covering high aspect ratio fe...
- Patent number 8,563,095
- Issue date Oct 22, 2013
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solder ball mounting tool
- Patent number 8,556,155
- Issue date Oct 15, 2013
- Compal Information (Kunshan) Co., Ltd.
- Jin-Bao Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanisms for forming copper pillar bumps using patterned anodes
- Patent number 8,546,254
- Issue date Oct 1, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Direct IMS (injection molded solder) without a mask for forming sol...
- Patent number 8,492,262
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Peter A. Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Template wafer and process for small pitch flip-chip interconnect h...
- Patent number 8,456,004
- Issue date Jun 4, 2013
- The United States of America as represented by the Secretary of the Army
- Justin K. Markunas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, electronic device, and method for fabricating a structure
- Patent number 8,350,160
- Issue date Jan 8, 2013
- Kabushiki Kaisha Toshiba
- Tadashi Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication of through-silicon vias on silicon wafers
- Patent number 8,329,575
- Issue date Dec 11, 2012
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ball mounting apparatus having a movable conductive ball...
- Patent number 8,299,628
- Issue date Oct 30, 2012
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of through-silicon vias on silicon wafers
- Patent number 8,283,237
- Issue date Oct 9, 2012
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Template process for small pitch flip-chip interconnect hybridization
- Patent number 8,163,644
- Issue date Apr 24, 2012
- United States of America as represented by the Secretary of the Army
- Justin K. Markunas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a wired circuit board
- Patent number 8,146,246
- Issue date Apr 3, 2012
- Nitto Denko Corporation
- Hitoki Kanagawa
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD
- Publication number 20240282611
- Publication date Aug 22, 2024
- NEXPERIA B.V.
- Johannes Hubertus Antonius van de Rijdt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIR OF SOLDER BUMPS
- Publication number 20240222302
- Publication date Jul 4, 2024
- ORBOTECH LTD.
- Zvi KOTLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...
- Publication number 20240194531
- Publication date Jun 13, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Anna ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...
- Publication number 20230340686
- Publication date Oct 26, 2023
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...
- Publication number 20230230847
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20230154887
- Publication date May 18, 2023
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR PRODUCING SEMICO NDUCTOR BUMP METAL LAYER
- Publication number 20190378812
- Publication date Dec 12, 2019
- Yu-Hung Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR FABRICATION APPARATUS AND SEMICONDUCTOR FABRICATION M...
- Publication number 20190295976
- Publication date Sep 26, 2019
- Toshiba Memory Corporation
- Keiichi NIWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD AND BONDED BODY
- Publication number 20180082973
- Publication date Mar 22, 2018
- Mitsubishi Heavy Industries, Ltd.
- Masahiro KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS
- Publication number 20170018525
- Publication date Jan 19, 2017
- Intel Corporation
- Rajendra C. Dias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL
- Publication number 20170012009
- Publication date Jan 12, 2017
- DECA TECHNOLOGIES INC
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES
- Publication number 20140264854
- Publication date Sep 18, 2014
- Oracle International Corporation
- Hiren D. Thacker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Post Bonding Using Pre-Fabricated Metal Posts
- Publication number 20140262470
- Publication date Sep 18, 2014
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...
- Publication number 20140166194
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIRING ANOMALOUS STIFF PILLAR BUMPS
- Publication number 20140077368
- Publication date Mar 20, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIRING ANOMALOUS STIFF PILLAR BUMPS
- Publication number 20140027902
- Publication date Jan 30, 2014
- GLOBALFOUNDRIES INC.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Forming Uniform Rigid Interconnect Structures
- Publication number 20140004660
- Publication date Jan 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chung Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Template Wafer Fabrication Process for Small Pitch Flip-Chip Interc...
- Publication number 20130244417
- Publication date Sep 19, 2013
- UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE ARMY
- Justin K. Markunas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL MOUNTING TOOL
- Publication number 20130140344
- Publication date Jun 6, 2013
- Jin-Bao Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD
- Publication number 20130122704
- Publication date May 16, 2013
- Dainippon Screen Mfg. Co., Ltd.
- Hiroyuki KANDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND APPARATUS FOR MA...
- Publication number 20130098769
- Publication date Apr 25, 2013
- TOKYO ELECTRON LIMITED
- Haruo IWATSU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Reflow System and Method for Conductive Connections
- Publication number 20120329264
- Publication date Dec 27, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES
- Publication number 20120267781
- Publication date Oct 25, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROLLED ELECTROPLATED SOLDER BUMPS
- Publication number 20120252203
- Publication date Oct 4, 2012
- GLOBALFOUNDRIES INC.
- Christian Schroiff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS
- Publication number 20120164827
- Publication date Jun 28, 2012
- Applied Materials, Inc.
- Nagarajan RAJAGOPALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS
- Publication number 20120164829
- Publication date Jun 28, 2012
- Applied Materials, Inc.
- Nagarajan RAJAGOPALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPLATE WAFER AND PROCESS FOR SMALL PITCH FLIP-CHIP INTERCONNECT H...
- Publication number 20120161314
- Publication date Jun 28, 2012
- UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE ARMY
- Justin K. Markunas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
- Publication number 20120043655
- Publication date Feb 23, 2012
- CARSEM (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES
- Publication number 20120043654
- Publication date Feb 23, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Apparatus for manufacturing bump connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Injection molded solder head with improved sealing performance

Dual-type solder ball placement system

Semiconductor fabrication apparatus and semiconductor fabrication m...

Semiconductor device processing method for material removal

Metal post bonding using pre-fabricated metal posts

Microelectronic element with bond elements to encapsulation surface

Method for bonding bare chip dies

Through silicon vias and thermocompression bonding using inkjet-pri...

Semiconductor device processing method for material removal

Solder bump forming method and apparatus

Electroless plating apparatus and electroless plating method

Method for manufacturing a plurality of metal posts

Method for transferring a graphene sheet to metal contact bumps of...

Controlled electroplated solder bumps

Substrate manufacturing method

Reflow system and method for conductive connections

Repairing anomalous stiff pillar bumps

Template wafer fabrication process for small pitch flip-chip interc...

Mechanisms for forming copper pillar bumps using patterned anodes

Silicon nitride passivation layer for covering high aspect ratio fe...

Solder ball mounting tool

Mechanisms for forming copper pillar bumps using patterned anodes

Direct IMS (injection molded solder) without a mask for forming sol...

Template wafer and process for small pitch flip-chip interconnect h...

Structure, electronic device, and method for fabricating a structure

Fabrication of through-silicon vias on silicon wafers

Conductive ball mounting apparatus having a movable conductive ball...

Fabrication of through-silicon vias on silicon wafers

Template process for small pitch flip-chip interconnect hybridization

Method of manufacturing a wired circuit board

Patents Applicationslast 30 patents

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD

REPAIR OF SOLDER BUMPS

THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...

ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...

ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

DEVICE FOR PRODUCING SEMICO NDUCTOR BUMP METAL LAYER

SEMICONDUCTOR FABRICATION APPARATUS AND SEMICONDUCTOR FABRICATION M...

BONDING METHOD AND BONDED BODY

METHOD AND PROCESS FOR EMIB CHIP INTERCONNECTIONS

SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL

MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES

Metal Post Bonding Using Pre-Fabricated Metal Posts

METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...

REPAIRING ANOMALOUS STIFF PILLAR BUMPS

REPAIRING ANOMALOUS STIFF PILLAR BUMPS

System and Method for Forming Uniform Rigid Interconnect Structures

Template Wafer Fabrication Process for Small Pitch Flip-Chip Interc...

SOLDER BALL MOUNTING TOOL

ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATING METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND APPARATUS FOR MA...

Reflow System and Method for Conductive Connections

MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES

CONTROLLED ELECTROPLATED SOLDER BUMPS

FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS

FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS

TEMPLATE WAFER AND PROCESS FOR SMALL PITCH FLIP-CHIP INTERCONNECT H...

WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

MECHANISMS FOR FORMING COPPER PILLAR BUMPS USING PATTERNED ANODES