Apparatus for Tape Automated Bonding [TAB]

Industry

CPC
H01L2224/79

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/79Apparatus for Tape Automated Bonding [TAB]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate debonding from bonded part
- Patent number 12,040,311
- Issue date Jul 16, 2024
- The Boeing Company
- Peter D. Brewer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,979,987
- Issue date May 7, 2024
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Display device
- Patent number 11,874,569
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Han Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
- Patent number 11,791,305
- Issue date Oct 17, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 11,745,281
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-beam laser de-bonding apparatus and method thereof
- Patent number 11,699,676
- Issue date Jul 11, 2023
- LASERSSEL CO., LTD.
- Jae-Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,696,402
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Han-Sung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorption device, method for making same, and transferring system...
- Patent number 11,498,779
- Issue date Nov 15, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,457,531
- Issue date Sep 27, 2022
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Display device
- Patent number 11,347,120
- Issue date May 31, 2022
- Samsung Display Co., Ltd.
- Han Ho Park
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for transferring semiconductor devices from a...
- Patent number 11,183,478
- Issue date Nov 23, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing perovskite solar cell module and perovskit...
- Patent number 11,114,252
- Issue date Sep 7, 2021
- CPC CORPORATION, TAIWAN
- Kuan-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 11,020,811
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed, high-resolution electrophysiology in-vivo using conform...
- Patent number 10,918,298
- Issue date Feb 16, 2021
- The Board of Trustees of the University of Illinois
- John A. Rogers
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electrically conductive pattern printer for downhole tools
- Patent number 10,799,908
- Issue date Oct 13, 2020
- Halliburton Energy Services, Inc.
- Robert L. Reynolds
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Display device
- Patent number 10,782,573
- Issue date Sep 22, 2020
- Samsung Display Co., Ltd.
- Han Ho Park
- G02 - OPTICS
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for bending a substrate
- Patent number 10,600,658
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for transfering semiconductor devices from a s...
- Patent number 10,529,685
- Issue date Jan 7, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for severing a microchip from a wafer and arrangi...
- Patent number 10,497,589
- Issue date Dec 3, 2019
- Jenoptik Optical Systems GmbH
- Meik Panitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 10,490,525
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor substrate
- Patent number 10,475,668
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer printed device repair
- Patent number 10,438,859
- Issue date Oct 8, 2019
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiresaw removal of microelectronics from printed circuit board
- Patent number 10,403,595
- Issue date Sep 3, 2019
- United States of America, as represented by the Secretary of the Navy
- Joel T. Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 10,307,850
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 10,306,763
- Issue date May 28, 2019
- Samsung Display Co., Ltd.
- Han-Sung Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,303,017
- Issue date May 28, 2019
- Samsung Display Co., Ltd.
- Han Ho Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20240284594
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DETACHING SUBSTRATE COMPONENTS AND SYSTEM FOR DETACHI...
- Publication number 20240284602
- Publication date Aug 22, 2024
- ASTEC IRIE CO., LTD.
- Taichi YOSHIMURA
- B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL
Information Patent Application
METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT
- Publication number 20240071992
- Publication date Feb 29, 2024
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...
- Publication number 20220262764
- Publication date Aug 18, 2022
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION JIG TAPE
- Publication number 20220063947
- Publication date Mar 3, 2022
- Dongsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
- Publication number 20210252621
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOCOMPRESSION BONDING DEVICE
- Publication number 20200411466
- Publication date Dec 31, 2020
- Sakai Display Products Corporation
- YOHICHIROH SAKAKI
- G02 - OPTICS
Information Patent Application
MULTI-BEAM LASER DE-BONDING APPARATUS AND METHOD THEREOF
- Publication number 20200251442
- Publication date Aug 6, 2020
- LASERSSEL CO., LTD.
- Jae-Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
- Publication number 20200135688
- Publication date Apr 30, 2020
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Bending a Substrate
- Publication number 20200027752
- Publication date Jan 23, 2020
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20190278125
- Publication date Sep 12, 2019
- SAMSUNG DISPLAY CO., LTD.
- Han Ho PARK
- G02 - OPTICS
Information Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
- Publication number 20190061034
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECOUPLING SYSTEMS AND METHODS FOR SAME
- Publication number 20180286832
- Publication date Oct 4, 2018
- Intel Corporation
- Bassam M. Ziadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...
- Publication number 20180263116
- Publication date Sep 13, 2018
- SAMSUNG DISPLAY CO., LTD.
- Han-Sung BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
- Publication number 20180226376
- Publication date Aug 9, 2018
- Rohinni, LLC.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER PRINTED DEVICE REPAIR
- Publication number 20180174932
- Publication date Jun 21, 2018
- X-Celeprint Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20180149901
- Publication date May 31, 2018
- SAMSUNG DISPLAY CO., LTD.
- Han Ho PARK
- G02 - OPTICS
Information Patent Application
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
- Publication number 20170179066
- Publication date Jun 22, 2017
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR REMOVING CHIP
- Publication number 20170110433
- Publication date Apr 20, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Guangyuan Cai
- B32 - LAYERED PRODUCTS
Information Patent Application
DEBONDER TO MANUFACTURE SEMICONDUCTOR AND DEBONDING METHOD THEREOF
- Publication number 20120234497
- Publication date Sep 20, 2012
- Samsung Electronics Co., Ltd.
- Il Young Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Speed, High-Resolution Electrophysiology In-Vivo Using Conform...
- Publication number 20120157804
- Publication date Jun 21, 2012
- John A. ROGERS
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PACKAGING OR MOUNTING A COMPONENT
- Publication number 20120117797
- Publication date May 17, 2012
- NOVALIA LTD.
- Kate Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE TAPE AND METHOD OF MANUFACTURING IT, CONNECT...
- Publication number 20100018755
- Publication date Jan 28, 2010
- Hitachi Chemical Company, Ltd.
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Device for Transferring a Chip to a Contact Substrate
- Publication number 20080210368
- Publication date Sep 4, 2008
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminating System, Ic Sheet, Scroll of Ic Sheet, and Method for Man...
- Publication number 20080042168
- Publication date Feb 21, 2008
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Ryosuke Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Thermal release adhesive-backed carrier tapes
- Publication number 20080006922
- Publication date Jan 10, 2008
- Charles Gutentag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE EMBEDDED BRIDGE
- Publication number 20070102486
- Publication date May 10, 2007
- Checkpoint Systems, Inc.
- Andre Cote
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
IN-MOLD CHIP ATTACH
- Publication number 20070098942
- Publication date May 3, 2007
- Checkpoint Systems, Inc.
- Andre Cote
- G06 - COMPUTING CALCULATING COUNTING

Apparatus for Tape Automated Bonding [TAB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip bonding apparatus and securing assembly therefor

Substrate debonding from bonded part

Electronic component, electric device including the same, and bondi...

Display device

Manufacturing apparatus, operation method thereof, and method for m...

Solder removal from semiconductor devices

Multi-beam laser de-bonding apparatus and method thereof

Electronic component, electric device including the same, and bondi...

Adsorption device, method for making same, and transferring system...

Electronic component, electric device including the same, and bondi...

Display device

High speed handling of ultra-small chips by selective laser bonding...

Apparatus and method for transferring semiconductor devices from a...

Method for manufacturing perovskite solar cell module and perovskit...

Solder removal from semiconductor devices

High-speed, high-resolution electrophysiology in-vivo using conform...

Electrically conductive pattern printer for downhole tools

Display device

Power electronics assembly having an adhesion layer, and method for...

Apparatus for the material-bonded connection of connection partners...

Apparatus and method for bending a substrate

Apparatus and method for transfering semiconductor devices from a s...

Method and device for severing a microchip from a wafer and arrangi...

High speed handling of ultra-small chips by selective laser bonding...

Apparatus and method for processing a semiconductor substrate

Transfer printed device repair

Wiresaw removal of microelectronics from printed circuit board

Solder removal from semiconductor devices

Electronic component, electric device including the same, and bondi...

Display device

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

APPARATUS FOR DETACHING SUBSTRATE COMPONENTS AND SYSTEM FOR DETACHI...

METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT

MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...

CONNECTION JIG TAPE

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

THERMOCOMPRESSION BONDING DEVICE

MULTI-BEAM LASER DE-BONDING APPARATUS AND METHOD THEREOF

APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

Apparatus and Method for Bending a Substrate

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

DISPLAY DEVICE

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

DECOUPLING SYSTEMS AND METHODS FOR SAME

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDI...

APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES

TRANSFER PRINTED DEVICE REPAIR

DISPLAY DEVICE

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING

APPARATUS FOR REMOVING CHIP

DEBONDER TO MANUFACTURE SEMICONDUCTOR AND DEBONDING METHOD THEREOF

High-Speed, High-Resolution Electrophysiology In-Vivo Using Conform...

PACKAGING OR MOUNTING A COMPONENT

ANISOTROPIC CONDUCTIVE TAPE AND METHOD OF MANUFACTURING IT, CONNECT...

Method and Device for Transferring a Chip to a Contact Substrate

Laminating System, Ic Sheet, Scroll of Ic Sheet, and Method for Man...

Thermal release adhesive-backed carrier tapes

WIRE EMBEDDED BRIDGE

IN-MOLD CHIP ATTACH