Apparatus for thermal treatment

Industry

CPC
H01L21/67098

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67098Apparatus for thermal treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of performing maintenance on substrate processing apparatus
- Patent number 12,315,709
- Issue date May 27, 2025
- Tokyo Electron Limited
- Yuya Minoura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heated substrate support
- Patent number 12,309,888
- Issue date May 20, 2025
- Applied Materials, Inc.
- Govinda Raj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate boat and methods of using the same
- Patent number 12,308,266
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Huang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and furnace opening closer
- Patent number 12,261,066
- Issue date Mar 25, 2025
- Kokusai Electric Corporation
- Takashi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing silicon nitride films
- Patent number 12,230,495
- Issue date Feb 18, 2025
- Lam Research Corporation
- James S. Sims
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate treating apparatus
- Patent number 12,224,200
- Issue date Feb 11, 2025
- Semes Co., Ltd.
- Ji Hoon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure wafer processing systems and related methods
- Patent number 12,198,951
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and oxygen removal method thereof
- Patent number 12,165,883
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Min Zuo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for cooling a heating element
- Patent number 12,158,305
- Issue date Dec 3, 2024
- Kanthal GmbH
- Ralph Miethe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating substrate
- Patent number 12,154,796
- Issue date Nov 26, 2024
- Semes Co., Ltd.
- Joo Jib Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning apparatus for component for semiconductor production appar...
- Patent number 12,139,788
- Issue date Nov 12, 2024
- Taiyo Nippon Sanso Corporation
- Akira Yamaguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heating platform, thermal treatment and manufacturing method
- Patent number 12,142,497
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,131,902
- Issue date Oct 29, 2024
- Kokusai Electric Corporation
- Yukinori Aburatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, plurality of electrodes and method...
- Patent number 12,094,735
- Issue date Sep 17, 2024
- Kokusai Electric Corporation
- Tsuyoshi Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing line edge roughness and mitigating defects by wafer freezing
- Patent number 12,087,601
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Karen E. Petrillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of manufacturing solder bump
- Patent number 12,068,176
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Sungyong Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Progressive heating of components of substrate processing systems u...
- Patent number 12,062,554
- Issue date Aug 13, 2024
- Lam Research Corporation
- Ramesh Chandrasekharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat treatment method and heat treatment apparatus
- Patent number 12,051,596
- Issue date Jul 30, 2024
- SCREEN Holdings Co., Ltd.
- Mao Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system for processing substrates with an elect...
- Patent number 12,051,602
- Issue date Jul 30, 2024
- ASM IP Holding B.V.
- Jeroen de Jonge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, and thermocouple
- Patent number 12,050,138
- Issue date Jul 30, 2024
- Kokusai Electric Corporation
- Akihiro Osaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,042,813
- Issue date Jul 23, 2024
- SCREEN Holdings Co., Ltd.
- Hiroshi Abe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Substrate processing apparatus and method of cleaning substrate pro...
- Patent number 12,046,485
- Issue date Jul 23, 2024
- Tokyo Electron Limited
- Shusei Takebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head for mounting components and die bonder with such a bon...
- Patent number 12,046,490
- Issue date Jul 23, 2024
- Besi Switzerland AG
- Rene Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning apparatus and wafer cleaning method using the same
- Patent number 12,042,828
- Issue date Jul 23, 2024
- Samsung Electronics Co., Ltd.
- Seung Min Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing apparatus and methods for calibrating a se...
- Patent number 12,040,200
- Issue date Jul 16, 2024
- ASM IP Holding B.V.
- Shiva Rajavelu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus for processing substrates
- Patent number 12,040,199
- Issue date Jul 16, 2024
- ASM IP Holding B.V.
- Jeroen Fluit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering devices and pressure sintering mechanisms with controllab...
- Patent number 12,038,232
- Issue date Jul 16, 2024
- QUICK INTELLIGENT EQUIPMENT CO., LTD.
- Guoqiang Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication system embedded with effective baking module
- Patent number 12,033,863
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-Yu Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heat treatment apparatus and dummy substrate processing method
- Patent number 12,027,384
- Issue date Jul 2, 2024
- Tokyo Electron Limited
- Yutaka Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing wafer
- Patent number 12,020,975
- Issue date Jun 25, 2024
- PIOTECH INC.
- Junichi Arami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FURNACE TUBE ASSEMBLY AND DISASSEMBLY AUXILIARY DEVICE
- Publication number 20250183077
- Publication date Jun 5, 2025
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Qi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...
- Publication number 20250149351
- Publication date May 8, 2025
- HPSP Co., Ltd.
- Sung Kil CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSCEPTOR
- Publication number 20250140582
- Publication date May 1, 2025
- MICO CERAMICS LTD.
- Hyung-Jun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK
- Publication number 20250132183
- Publication date Apr 24, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Chi Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND FORMULATIONS FOR SACRIFICIAL BRACING, SURFACE PROTECTIO...
- Publication number 20250132195
- Publication date Apr 24, 2025
- LAM RESEARCH CORPORATION
- Stephen M. SIRARD
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
HEAT TRANSFER JACKETS AND SENSOR ASSEMBLIES, AND RELATED METHODS AN...
- Publication number 20250125164
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Vishwas Kumar PANDEY
- G01 - MEASURING TESTING
Information Patent Application
CERAMIC RF RETURN KIT DESIGN
- Publication number 20250118577
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Vellaichamy Nagappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR GAS ACTIVATION I...
- Publication number 20250118576
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Chen-Ying WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING DEVICE AND MOUNTING DEVICE USING SAME
- Publication number 20250096016
- Publication date Mar 20, 2025
- TORAY ENGINEERING CO., LTD.
- Kenji HAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND...
- Publication number 20250079336
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER SYSTEM CONTROLLER AND METHOD
- Publication number 20250071940
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- John Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS CONSTRUCTED AND ARRANGED TO PROCESS A PLURALITY OF SUBSTR...
- Publication number 20250069911
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Lucian Jdira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Actively Controlled gas inject FOR PROCESS Temperature CONTROL
- Publication number 20250037975
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Zhepeng CONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250022703
- Publication date Jan 16, 2025
- Kokusai Electric Corporation
- Yukinori ABURATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR HEAT TREATMENT MEMBER
- Publication number 20250002390
- Publication date Jan 2, 2025
- CoorsTek GK
- Kanta DOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSOR, SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUF...
- Publication number 20250004489
- Publication date Jan 2, 2025
- Kokusai Electric Corporation
- Takayuki NAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-PROCESSING APPARATUS
- Publication number 20250006541
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Riichiro ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, PLURALITY OF ELECTRODES AND METHOD...
- Publication number 20240412987
- Publication date Dec 12, 2024
- Kokusai Electric Corporation
- Tsuyoshi TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND DISPLAY METHOD
- Publication number 20240404849
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Tatsuya WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE BONDING METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR CHU...
- Publication number 20240404869
- Publication date Dec 5, 2024
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Jason STEPHENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...
- Publication number 20240404854
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Jaeho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRESSIVE HEATING OF COMPONENTS OF SUBSTRATE PROCESSING SYSTEMS U...
- Publication number 20240395569
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Ramesh CHANDRASEKHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD
- Publication number 20240387203
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Hua Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE
- Publication number 20240377145
- Publication date Nov 14, 2024
- ASM IP HOLDING B.V.
- SungBae Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR SUBSTRATE BOAT AND METHODS OF USING THE SAME
- Publication number 20240379394
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Huang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER STRUCTURE, MULTILAYER STRUCTURE, PROCESSING APPARATUS AND ME...
- Publication number 20240379483
- Publication date Nov 14, 2024
- Kokusai Electric Corporation
- Shuhei SAIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR HEAT TREATMENT DEVICE AND METHOD FOR CONTROLLING PRES...
- Publication number 20240355646
- Publication date Oct 24, 2024
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Yan JIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS
- Publication number 20240347351
- Publication date Oct 17, 2024
- TOKYO ELECTRON LIMITED
- Hitoshi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES
- Publication number 20240347505
- Publication date Oct 17, 2024
- Lodestar Licensing Group LLC
- Sui Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FABRICATION SYSTEM EMBEDDED WITH EFFECTIVE BAKING MODULE
- Publication number 20240347345
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Han-Yu Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Apparatus for thermal treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of performing maintenance on substrate processing apparatus

Heated substrate support

Semiconductor substrate boat and methods of using the same

Substrate processing apparatus and furnace opening closer

Method of depositing silicon nitride films

Substrate treating apparatus

High pressure wafer processing systems and related methods

Semiconductor device and oxygen removal method thereof

Methods and systems for cooling a heating element

Method for treating substrate

Cleaning apparatus for component for semiconductor production appar...

Heating platform, thermal treatment and manufacturing method

Method of manufacturing semiconductor device, substrate processing...

Substrate processing apparatus, plurality of electrodes and method...

Reducing line edge roughness and mitigating defects by wafer freezing

Apparatus and method of manufacturing solder bump

Progressive heating of components of substrate processing systems u...

Heat treatment method and heat treatment apparatus

Substrate processing system for processing substrates with an elect...

Substrate processing apparatus, and thermocouple

Substrate processing method and substrate processing apparatus

Substrate processing apparatus and method of cleaning substrate pro...

Bonding head for mounting components and die bonder with such a bon...

Wafer cleaning apparatus and wafer cleaning method using the same

Semiconductor processing apparatus and methods for calibrating a se...

Substrate processing apparatus for processing substrates

Sintering devices and pressure sintering mechanisms with controllab...

Semiconductor fabrication system embedded with effective baking module

Heat treatment apparatus and dummy substrate processing method

Apparatus and method for processing wafer

Patents Applicationslast 30 patents

FURNACE TUBE ASSEMBLY AND DISASSEMBLY AUXILIARY DEVICE

HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...

SUSCEPTOR

WAFER CHUCK

METHODS AND FORMULATIONS FOR SACRIFICIAL BRACING, SURFACE PROTECTIO...

HEAT TRANSFER JACKETS AND SENSOR ASSEMBLIES, AND RELATED METHODS AN...

CERAMIC RF RETURN KIT DESIGN

CHAMBER KITS, PROCESSING CHAMBERS, AND METHODS FOR GAS ACTIVATION I...

POSITIONING DEVICE AND MOUNTING DEVICE USING SAME

STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND...

HEAT TRANSFER SYSTEM CONTROLLER AND METHOD

APPARATUS CONSTRUCTED AND ARRANGED TO PROCESS A PLURALITY OF SUBSTR...

Actively Controlled gas inject FOR PROCESS Temperature CONTROL

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

SEMICONDUCTOR HEAT TREATMENT MEMBER

TEMPERATURE SENSOR, SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUF...

SUBSTRATE-PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS, PLURALITY OF ELECTRODES AND METHOD...

SUBSTRATE PROCESSING SYSTEM AND DISPLAY METHOD

SOLID-STATE BONDING METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR CHU...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USIN...

PROGRESSIVE HEATING OF COMPONENTS OF SUBSTRATE PROCESSING SYSTEMS U...

HEATING PLATFORM, THERMAL TREATMENT AND MANUFACTURING METHOD

SUBSTRATE PROCESSING DEVICE

SEMICONDUCTOR SUBSTRATE BOAT AND METHODS OF USING THE SAME

HEATER STRUCTURE, MULTILAYER STRUCTURE, PROCESSING APPARATUS AND ME...

SEMICONDUCTOR HEAT TREATMENT DEVICE AND METHOD FOR CONTROLLING PRES...

SUBSTRATE-PROCESSING METHOD AND SUBSTRATE-PROCESSING APPARATUS

MITIGATING THERMAL IMPACTS ON ADJACENT STACKED SEMICONDUCTOR DEVICES

SEMICONDUCTOR FABRICATION SYSTEM EMBEDDED WITH EFFECTIVE BAKING MODULE