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STACK CHIP PACKAGE
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Publication number 20250183238
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Publication date Jun 5, 2025
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SK HYNIX INC.
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Dong Sop LEE
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20250167145
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Publication date May 22, 2025
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chen-Hua Yu
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE AND METHOD
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Publication number 20250167187
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Publication date May 22, 2025
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Chen-Hua Yu
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250167098
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Publication date May 22, 2025
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Samsung Electronics Co., Ltd.
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Kyoung Lim Suk
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H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGES AND METHODS
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Publication number 20250087543
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Publication date Mar 13, 2025
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Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
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Yi-Hsiu Chen
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20250062177
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Publication date Feb 20, 2025
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Samsung Electronics Co., Ltd.
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Han Min LEE
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H01 - BASIC ELECTRIC ELEMENTS
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PRINTED CIRCUIT BOARD
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Publication number 20250038116
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Publication date Jan 30, 2025
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Samsung Electro-Mechanics Co., Ltd.
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Da Hee JOUNG
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRICAL INTERCONNECT BRIDGE
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Publication number 20250038114
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Publication date Jan 30, 2025
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Intel Corporation
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Srinivas V. Pietambaram
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H01 - BASIC ELECTRIC ELEMENTS
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