Applying a precursor material to the bonding area

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H01L2224/83026

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83026Applying a precursor material to the bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-substrate assemblies having sinter-bonded backside via structur...
- Patent number 11,749,639
- Issue date Sep 5, 2023
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing assembly pads on a carrier for the self-a...
- Patent number 11,380,648
- Issue date Jul 5, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Léa Di Cioccio
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device production method
- Patent number 10,998,283
- Issue date May 4, 2021
- TOSHIBA MEMORY CORPORATION
- Takahiko Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,961,411
- Issue date Mar 30, 2021
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,202,519
- Issue date Feb 12, 2019
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inkjet adhesive, manufacturing method for semiconductor device, and...
- Patent number 10,066,118
- Issue date Sep 4, 2018
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
- Patent number 9,640,510
- Issue date May 2, 2017
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding substrates with transient liquid phase bonds by...
- Patent number 9,343,425
- Issue date May 17, 2016
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240379608
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Yuta TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230207517
- Publication date Jun 29, 2023
- Fuji Electric Co., Ltd.
- Tsunehiro NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...
- Publication number 20230111320
- Publication date Apr 13, 2023
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT, AND WORKPIECE
- Publication number 20210320006
- Publication date Oct 14, 2021
- OSRAM OLED GmbH
- Martin Behringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD
- Publication number 20200035636
- Publication date Jan 30, 2020
- Toshiba Memory Corporation
- Takahiro KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20190092963
- Publication date Mar 28, 2019
- Sekisui Chemical Co., Ltd
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20180218998
- Publication date Aug 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20170233615
- Publication date Aug 17, 2017
- Sekisui Chemical Co., Ltd.
- Mitsuru Tanikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING
- Publication number 20170047307
- Publication date Feb 16, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING METALLIC CONTACT AREAS WITH DISSOLUTION OF A SAC...
- Publication number 20160071817
- Publication date Mar 10, 2016
- EV GROUP E. THALLNER GMBH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS

Applying a precursor material to the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Die-substrate assemblies having sinter-bonded backside via structur...

Structures and methods for low temperature bonding using nanoparticles

Process for manufacturing assembly pads on a carrier for the self-a...

Semiconductor device production method

Inkjet adhesive, manufacturing method for semiconductor device, and...

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Inkjet adhesive, manufacturing method for semiconductor device, and...

Inkjet adhesive, manufacturing method for semiconductor device, and...

Method for bonding metallic contact areas with solution of a sacrif...

Methods for bonding substrates with transient liquid phase bonds by...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

DIE-SUBSTRATE ASSEMBLIES HAVING SINTER-BONDED BACKSIDE VIA STRUCTUR...

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT, AND WORKPIECE

Structures And Methods For Low Temperature Bonding Using Nanoparticles

Structures And Methods For Low Temperature Bonding Using Nanoparticles

SEMICONDUCTOR DEVICE PRODUCTION METHOD

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND...

STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING

METHOD FOR BONDING METALLIC CONTACT AREAS WITH DISSOLUTION OF A SAC...