Applying catalyst after applying plating resist

Industry

CPC
H05K2203/1415

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1415Applying catalyst after applying plating resist

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for preparing a patterned electric circuit
- Patent number 9,000,303
- Issue date Apr 7, 2015
- Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Roland Anthony Tacken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a solder pad structure
- Patent number 8,051,560
- Issue date Nov 8, 2011
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Transparent electrically conductive film and process for producing...
- Patent number 7,883,837
- Issue date Feb 8, 2011
- Seiren Co., Ltd.
- Kohei Yamada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laser enhanced plating for forming wiring patterns
- Patent number 7,291,380
- Issue date Nov 6, 2007
- Hewlett-Packard Development Company, L.P.
- Peter S. Nyholm
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Through-hole plate printed circuit board with resist and process fo...
- Patent number 5,373,629
- Issue date Dec 20, 1994
- Blasberg Oberflachentechnik GmbH
- Jurgen Hupe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing printed wiring board
- Patent number 5,309,632
- Issue date May 10, 1994
- Hitachi Chemical Co., Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective metallization process
- Patent number 5,158,860
- Issue date Oct 27, 1992
- Shipley Company Inc.
- Michael Gulla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedded catalyst receptors for metallization of dielectrics
- Patent number 5,112,726
- Issue date May 12, 1992
- E. I. Du Pont de Nemours and Company
- Abraham B. Cohen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Printed circuit board having an injection molded substrate
- Patent number 4,996,391
- Issue date Feb 26, 1991
- Siemens Aktiengesellschaft
- Hans Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having an injection molded substrate
- Patent number 4,985,600
- Issue date Jan 15, 1991
- Siemens Aktiengesellschaft
- Marcel Heerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacture of printed circuit boards
- Patent number 4,931,148
- Issue date Jun 5, 1990
- MacDermid, Incorporated
- Peter E. Kukanskis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective metallization process, additive method for manufacturing...
- Patent number 4,897,118
- Issue date Jan 30, 1990
- MacDermid, Incorporated
- Donald R. Ferrier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless deposition employing laser-patterned masking layer
- Patent number 4,865,873
- Issue date Sep 12, 1989
- General Electric Company
- Herbert S. Cole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Embedded catalyst receptors for metallization of dielectrics
- Patent number 4,859,571
- Issue date Aug 22, 1989
- E. I. Du Pont de Nemours and Company
- Abraham B. Cohen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Preparation of printed circuit boards by selective metallization
- Patent number 4,847,114
- Issue date Jul 11, 1989
- Learonal, Inc.
- William R. Brasch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for printed circuit board manufacture
- Patent number 4,761,304
- Issue date Aug 2, 1988
- Learonal, Inc.
- William R. Brasch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for printed circuit board manufacture
- Patent number 4,759,952
- Issue date Jul 26, 1988
- Learonal, Inc.
- William R. Brasch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective metallization process and additive method for manufacture...
- Patent number 4,748,104
- Issue date May 31, 1988
- MacDermid, Incorporated
- Donald R. Ferrier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System for selective metallization of electronic interconnection bo...
- Patent number 4,668,532
- Issue date May 26, 1987
- Kollmorgen Technologies Corporation
- Michael P. Moisan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dichromic process for preparation of conductive circuit
- Patent number 4,631,111
- Issue date Dec 23, 1986
- E. I. Du Pont de Nemours and Company
- David W. Williston
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Additive processing electroless metal plating using aqueous photore...
- Patent number 4,574,031
- Issue date Mar 4, 1986
- AT&T Technologies, Inc.
- John K. Dorey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Preparation of photoformed plastic multistrate by via formation first
- Patent number 4,572,764
- Issue date Feb 25, 1986
- E. I. Du Pont de Nemours and Company
- Roxy N. Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective metallization process
- Patent number 4,537,799
- Issue date Aug 27, 1985
- AT&T Technologies, Inc.
- John K. Dorey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing printed circuits
- Patent number 4,433,009
- Issue date Feb 21, 1984
- Schering Aktiengesellschaft
- Helmut Henze
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming printed circuit
- Patent number 4,305,975
- Issue date Dec 15, 1981
- Tokyo Shibaura Denki Kabushiki Kaisha
- Kunihiro Ikari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for production of printed circuits by electroless metal plating
- Patent number 4,293,592
- Issue date Oct 6, 1981
- Hitachi, Ltd.
- Hirosada Morishita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for production of printed circuits by electroless metal plat...
- Patent number 4,151,313
- Issue date Apr 24, 1979
- Hitachi, Ltd.
- Motoyo Wajima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing or repairing a patterned metal layer on a subs...
- Patent number 4,107,351
- Issue date Aug 15, 1978
- RCA Corporation
- Edward Anthony James
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal on a surface
- Patent number 4,100,037
- Issue date Jul 11, 1978
- Western Electric Company, Inc.
- William James Baron
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a metal on a surface
- Patent number 4,089,686
- Issue date May 16, 1978
- Western Electric Company, Inc.
- Wesley Peter Townsend
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of Using a Mask to Provide a Patterned Substrate
- Publication number 20130068723
- Publication date Mar 21, 2013
- Matthew S. Stay
- B82 - NANO-TECHNOLOGY
Information Patent Application
SOLDER PAD STRUCTURE FOR PRINTED CIRCUIT BOARDS AND FABRICATION MET...
- Publication number 20110091697
- Publication date Apr 21, 2011
- Tzyy-Jang Tseng
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PREPARING A PATTERNED ELECTRIC CIRCUIT
- Publication number 20110017495
- Publication date Jan 27, 2011
- Roland Anthony Tacken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transparent electrically conductive film and process for producing...
- Publication number 20090042150
- Publication date Feb 12, 2009
- Kohei Yamada
- B32 - LAYERED PRODUCTS
Information Patent Application
Laser enhanced plating
- Publication number 20060008627
- Publication date Jan 12, 2006
- Hewlett-Packard Development Company, L.P.
- Peter S. Nyholm
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Applying catalyst after applying plating resist

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for preparing a patterned electric circuit

Method of fabricating a solder pad structure

Transparent electrically conductive film and process for producing...

Laser enhanced plating for forming wiring patterns

Through-hole plate printed circuit board with resist and process fo...

Process for producing printed wiring board

Selective metallization process

Embedded catalyst receptors for metallization of dielectrics

Printed circuit board having an injection molded substrate

Printed circuit board having an injection molded substrate

Method for manufacture of printed circuit boards

Selective metallization process, additive method for manufacturing...

Electroless deposition employing laser-patterned masking layer

Embedded catalyst receptors for metallization of dielectrics

Preparation of printed circuit boards by selective metallization

Process for printed circuit board manufacture

Process for printed circuit board manufacture

Selective metallization process and additive method for manufacture...

System for selective metallization of electronic interconnection bo...

Dichromic process for preparation of conductive circuit

Additive processing electroless metal plating using aqueous photore...

Preparation of photoformed plastic multistrate by via formation first

Selective metallization process

Method of manufacturing printed circuits

Method of forming printed circuit

Method for production of printed circuits by electroless metal plating

Method for production of printed circuits by electroless metal plat...

Method of depositing or repairing a patterned metal layer on a subs...

Method of depositing a metal on a surface

Method of depositing a metal on a surface

Patents Applicationslast 30 patents

Method of Using a Mask to Provide a Patterned Substrate

SOLDER PAD STRUCTURE FOR PRINTED CIRCUIT BOARDS AND FABRICATION MET...

METHOD FOR PREPARING A PATTERNED ELECTRIC CIRCUIT

Transparent electrically conductive film and process for producing...

Laser enhanced plating