Applying catalyst before etching

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CPC
H05K2203/1423

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

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H05K2203/1423Applying catalyst before etching

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Patents Grantslast 30 patents

Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,820
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated metallization structures
- Patent number 10,699,948
- Issue date Jun 30, 2020
- Analog Devices Global Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing multilayer wiring substrate
- Patent number 9,516,764
- Issue date Dec 6, 2016
- Hitachi Chemical Company, Ltd.
- Nobuyuki Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing a plated-through hole on a printed-circuit board
- Patent number 5,799,393
- Issue date Sep 1, 1998
- Blaupunkt-Werke GmbH
- Wolf Backasch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacture of printed circuit boards
- Patent number 5,358,602
- Issue date Oct 25, 1994
- Enthone-OMI Inc.
- Gary R. Sutcliffe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming electric circuits on a base board
- Patent number 4,735,676
- Issue date Apr 5, 1988
- Asahi Chemical Research Laboratory Co., Ltd.
- Yamahiro Iwasa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3269861
- Patent number 3,269,861
- Issue date Aug 30, 1966
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
PLATED METALLIZATION STRUCTURES
- Publication number 20200328114
- Publication date Oct 15, 2020
- Analog Devices Global Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130319734
- Publication date Dec 5, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hyun Shin
- H01 - BASIC ELECTRIC ELEMENTS

Applying catalyst before etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Single-layer circuit board, multi-layer circuit board, and manufact...

Plated metallization structures

Single-layer circuit board, multi-layer circuit board, and manufact...

Single-layer circuit board, multi-layer circuit board, and manufact...

Single-layer circuit board, multi-layer circuit board, and manufact...

Plated metallization structures

Method for manufacturing multilayer wiring substrate

Method for producing a plated-through hole on a printed-circuit board

Method for manufacture of printed circuit boards

Method for forming electric circuits on a base board

3269861

Patents Applicationslast 30 patents

PLATED METALLIZATION STRUCTURES

PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME