3269861

Information

• Patent Grant
• 3269861

• References
• Source

• Patent Number

  3,269,861

• Date Filed

  Not available

• Date Issued

  Tuesday, August 30, 1966
  58 years ago

• CPC

  • H05K3/187 - means therefor
  • C07F1/005 - without C-Metal linkages
  • C23C18/1605 - by masking
  • C23C18/405 - Formaldehyde
  • H05K3/108 - by semi-additive methods; masks therefor
  • H05K3/422 - characterised by electroless plating method; pretreatment therefor
  • H05K3/427 - initial plating of through-holes in metal-clad substrates
  • H05K3/428 - initial plating of through-holes in substrates having a metal pattern
  • H05K3/0094 - Filling or covering plated through-holes or blind plated vias
  • H05K3/064 - Photoresists
  • H05K2201/0344 - Electroless sublayer
  • H05K2201/0347 - Overplating
  • H05K2201/09581 - Applying an insulating coating on the walls of holes
  • H05K2203/0565 - Resist used only for applying catalyst, not for plating itself
  • H05K2203/072 - Electroless plating
  • H05K2203/1383 - Temporary protective insulating layer
  • H05K2203/1423 - Applying catalyst before etching

• US Classifications

  • 216 - Etching a substrate: processes
  • 427 - Coating processes
  • 430 - Radiation imagery chemistry: process, composition, or product thereof