Applying energy for connecting

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H01L2224/812

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/812Applying energy for connecting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
- Patent number 12,363,878
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated gold contacting metal
- Patent number 12,363,877
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and storage system
- Patent number 12,354,941
- Issue date Jul 8, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shu-Liang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures for low temperature chip bonding
- Patent number 12,354,988
- Issue date Jul 8, 2025
- Northrop Grumman Systems Corporation
- Justin C. Hackley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
- Patent number 12,356,553
- Issue date Jul 8, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under chip bridge
- Patent number 12,354,964
- Issue date Jul 8, 2025
- FRONTGRADE TECHNOLOGIES INC.
- Sean Thorne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a conductive layer on an IC using non-lithogr...
- Patent number 12,347,800
- Issue date Jul 1, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Ken Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump to package substrate solder joint
- Patent number 12,341,126
- Issue date Jun 24, 2025
- Texas Instruments Incorporated
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having copper pillar within solder bump and...
- Patent number 12,334,463
- Issue date Jun 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for superconducting multi-chip module
- Patent number 12,317,757
- Issue date May 27, 2025
- SeeQC, Inc.
- Daniel Yohannes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 12,315,855
- Issue date May 27, 2025
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,667
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- YeongBeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package
- Patent number 12,293,986
- Issue date May 6, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure
- Patent number 12,283,561
- Issue date Apr 22, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
- Patent number 12,283,559
- Issue date Apr 22, 2025
- Texas Instruments Incorporated
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal and connection method
- Patent number 12,261,138
- Issue date Mar 25, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Jo Umezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for BGA coplanarity and warpage control
- Patent number 12,249,589
- Issue date Mar 11, 2025
- NVIDIA Corporation
- Dongji Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using metastable gas atoms
- Patent number 12,245,379
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
- Patent number 12,245,380
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
- Patent number 12,245,381
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip laser bonding system
- Patent number 12,237,295
- Issue date Feb 25, 2025
- PROTEC CO., LTD.
- Geunsik Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnecting method, interconnect device and method for for...
- Patent number 12,224,267
- Issue date Feb 11, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring electronic device
- Patent number 12,224,263
- Issue date Feb 11, 2025
- MICRAFT SYSTEM PLUS CO., LTD.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package structure and method for manufacturing the same
- Patent number 12,218,094
- Issue date Feb 4, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Jen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 12,218,091
- Issue date Feb 4, 2025
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Establishing a Contact Connection
- Publication number 20250235961
- Publication date Jul 24, 2025
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ATTACHED ENGINEERED SOLDERS FOR ULTRA-LOW RESIDUE SOLDERING
- Publication number 20250226358
- Publication date Jul 10, 2025
- The Indium Corporation of America
- Joseph M. Hertline
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CIRCUIT FORMATION METHOD AND ELECTRICAL CIRCUIT FORMATIO...
- Publication number 20250226357
- Publication date Jul 10, 2025
- FUJI CORPORATION
- Ryo SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-BONDING METHOD FOR PREVENTING DIE FROM BENDING
- Publication number 20250219017
- Publication date Jul 3, 2025
- SAULTECH TECHNOLOGY CO., LTD.
- YEN HAO LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20250210562
- Publication date Jun 26, 2025
- Google LLC
- Erik Anthony Lucero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210576
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SOLDERING ELECTRONIC DEVICES AND METHOD OF MANUFACTURING...
- Publication number 20250205797
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- KYUNGDEUK MIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reflowable Vapor Chamber Lid
- Publication number 20250201663
- Publication date Jun 19, 2025
- Marvell Asia Pte Ltd.
- Alaba Bamido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183212
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- CHEOL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...
- Publication number 20250174596
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sunchul KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20250167007
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...
- Publication number 20250167168
- Publication date May 22, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250157972
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Jen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL-ELECTRICAL SUBSTRATE PROVIDING INTERCONNECTS FOR PHOTONIC I...
- Publication number 20250147251
- Publication date May 8, 2025
- Corning Research & Development Corporation
- Lars Martin Otfried Brusberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR TRANSFERRING AND METHOD
- Publication number 20250135568
- Publication date May 1, 2025
- ams-OSRAM International GmbH
- Thomas Schwarz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE WITH BACK-TO-BACK DIE STACKING
- Publication number 20250132240
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250132220
- Publication date Apr 24, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Hyeon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250133656
- Publication date Apr 24, 2025
- LG Innotek Co., Ltd.
- Sang Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250132286
- Publication date Apr 24, 2025
- Yibu Semiconductor Co., Ltd.
- Wenqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250132287
- Publication date Apr 24, 2025
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER
- Publication number 20250125302
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND RECORDING MEDIUM
- Publication number 20250118701
- Publication date Apr 10, 2025
- SHINKAWA LTD.
- Shinsuke Fukumoto
- G05 - CONTROLLING REGULATING
Information Patent Application
IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
- Publication number 20250112198
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyasha Mohapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...
- Publication number 20250112201
- Publication date Apr 3, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE...
- Publication number 20250105203
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Kyung Deuk MIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250105152
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hansae Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE COMPRISING MICRO LIGHT EMITTING DIODE
- Publication number 20250096177
- Publication date Mar 20, 2025
- SAMSUNG ELECTRONICS CO,. LTD.
- Yoonsuk LEE
- H01 - BASIC ELECTRIC ELEMENTS

Applying energy for connecting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermocompression bonding with passivated silver-based contacting m...

Thermocompression bonding with passivated gold contacting metal

Chip package structure and storage system

Bump structures for low temperature chip bonding

Thermocompression bonding with passivated tin-based contacting metal

Under chip bridge

Method of fabricating a conductive layer on an IC using non-lithogr...

Bump to package substrate solder joint

Semiconductor structure having copper pillar within solder bump and...

System and method for superconducting multi-chip module

Display device and method for manufacturing the same

Devices with conductive or magnetic nanowires for localized heating...

Semiconductor package and method of fabricating the same

Method for forming chip packages and a chip package

Semiconductor packages and methods of forming same

Flexible electronic structure

Copper wire bond on gold bump on semiconductor die bond pad

Substrate bonding method

Terminal and connection method

Apparatus and method for BGA coplanarity and warpage control

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Thermocompression bonding with passivated nickel-based contacting m...

Flexible electronic structure including a support element

Flip chip laser bonding system

Chip interconnecting method, interconnect device and method for for...

Method for transferring electronic device

Electronic package structure and method for manufacturing the same

Semiconductor package and method of manufacturing semiconductor pac...

Superconducting bump bonds for quantum computing systems

Patents Applicationslast 30 patents

Apparatus and Method for Establishing a Contact Connection

Semiconductor Packages and Methods of Forming Same

PRE-ATTACHED ENGINEERED SOLDERS FOR ULTRA-LOW RESIDUE SOLDERING

ELECTRICAL CIRCUIT FORMATION METHOD AND ELECTRICAL CIRCUIT FORMATIO...

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

DIE-BONDING METHOD FOR PREVENTING DIE FROM BENDING

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

SEMICONDUCTOR PACKAGE

METHOD OF SOLDERING ELECTRONIC DEVICES AND METHOD OF MANUFACTURING...

Reflowable Vapor Chamber Lid

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MAN...

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL-ELECTRICAL SUBSTRATE PROVIDING INTERCONNECTS FOR PHOTONIC I...

DEVICE FOR TRANSFERRING AND METHOD

PACKAGE WITH BACK-TO-BACK DIE STACKING

ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER

BONDING APPARATUS, BONDING METHOD, AND RECORDING MEDIUM

IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY

BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...

SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

DISPLAY MODULE COMPRISING MICRO LIGHT EMITTING DIODE